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| data sheet Ceramic Quad Flat Pack Package (CQFP) Amkor Technology is continuing to service this established industry package. The Amkor Technology CQFP capability provides you, the customer, with a wide range of lead counts and body sizes available from various suppliers. The CQFP is a hermetic package consisting of two pieces of dry pressed ceramic surrounding a "gullwing" formed leadframe. The ceramic / LF / ceramic system is held together hermetically by glass. The frit lid is sealed/reflowed over the package cavity at temperatures between 400 - 460 Centigrade. Applications: Along with the other standard industry packages, the CQFP has a proven track record and is still being used by semiconductor technologies such as: Digital to Analog converters, Microwave, Logic, Memory, Microcontrollers, and Video controllers. Some end applications are: Military electronics, Commercial electronics, Automotive and Telecommunications. Features: CERAMIC / HERMETIC CQFP The CQFP offers a variety of features: * Square package body * 14-256 lead count, 25-50 mil lead pitch's * Hermetic package * High thermal conductive ceramic * Solder Plate lead finish * JEDEC standard compliant * Wide selection of available cavity sizes to meet most die size needs * Commercial or full Military flows VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND TO VIEW THE MOST CURRENT PRODUCT INFORMATION. www.amkor.com DS806 Rev Date: 08'02 |
Price & Availability of CQFP
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