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 Advanced Technical Information
VUM 25-05
Rectifier Module
for Three Phase Power Factor Correction
Using fast recovery epitaxial diodes and MOSFET
1
VDSS = 500 V ID25 = 35 A RDS(on) = 0.12 W
5 1 2 3
VRRM (Diode) V 600
VDSS V
Type
5
6 9 10 9 6 2 10
500
VUM 25-05E
3
Symbol VDSS VDGR VGS ID ID IDM PD IS ISM VRRM IdAV
Diodes MOSFET
Test Conditions TVJ = 25C to 150C TVJ = 25C to 150C; RGS = 10 kW Continuous TS = 85C TS = 25C TS = 25C, tp = x TS = 85C VGS = 0 V, TS = 25C VGS = 0 V, TS = 25C, tp = x TS = 85C, rectangular d = 0.5 TVJ = 45C, t = 10 ms (50 Hz) t = 8.3 ms (60 Hz) TVJ = 150C, t = 10 ms (50 Hz) t = 8.3 ms (60 Hz) TS = 85C
Maximum Ratings 500 500 20 24 35 95 170 24 95 600 40 300 320 260 280 36 -40...+150 150 -40...+150 V V V A A A W
Features
q
Package with DCB ceramic base plate Soldering connections for PCB mounting Isolation voltage 3600 V~ Low RDS(on) HDMOSTM process Low package inductance for high speed switching Ultrafast diodes Kelvin source for easy drive
q
q
q
q
q
A A V A A A A A W C C C V~ V~
q
Applications
q
IFSM
Three phase input rectifier with power factor correction consisting of three modules VUM 25-05
q
For power supplies, UPS, SMPS, drives, welding etc.
P TVJ TJM Tstg
Module
Advantages
q
Reduced harmonic content of input currents corresponding to standards Rectifier generates maximum DC power with a given AC fuse Wide input voltage range No external isolation Easy to mount with two screws Suitable for wave soldering High temperature and power cycling capability
VISOL Md Weight
50/60 Hz IISOL 1 mA Mounting torque (M5)
t = 1 min t=1s
3000 3600
q
2-2.5/18-22 Nm/lb.in. 35 g
q
q
q
q
q
x Pulse width limited by TVJ IXYS reserves the right to change limits, test conditions and dimensions.
(c) 2000 IXYS All rights reserved
1-4
826
VUM 25-05
Symbol Test Conditions Characteristic Values (TVJ = 25C, unless otherwise specified) min. typ. max. 500 2 V V nA mA W W S V ns ns nF nF nF nC 0.38 K/W 1.65 1.4 1.5 0.25 7 V V mA mA mA Dimensions in mm (1 mm = 0.0394")
VDSS VGS(th) IGSS IDSS RDS(on) RGint gfs VDS td(on) td(off) Ciss Coss Crss Qg RthJS VF IR
Diodes MOSFET
VGS = 0 V, ID = 2 mA VDS = 20 V, ID = 20 mA VGS = 20 V, VDS = 0 V VDS = 500 V, VGS = 0 V TVJ = 25C TVJ = 25C VDS = 15 V, IDS = 24 A, IDS = 12 A VGS = 0 V
5 500 2 0.12 1.5 30 1.5 100 220 8.5 0.9 0.3 350
VDS = 250 V, IDS = 12 A, VGS = 10 V Zgen. = 1 W, L-load
VDS = 25 V, f = 1 MHz, VGS = 0 V VDS = 250 V, ID = 12 A, IF VR VR = 22 A; TVJ = 25C TVJ =150C VGS = 10 V
= 600 V, TVJ = 25C = 480 V, TVJ = 25C TVJ =125C
VT0 rT IRM RthJS
For power-loss calculations only TVJ = 125C IF VR = 30 A; -diF/dt = 240 A/ms = 350 V, TVJ = 100C 10
1.14 V 10 mW
11
A
1.8 K/W
(c) 2000 IXYS All rights reserved
2-4
VUM 25-05
80 A 70 60 ID 50 40 30 20 10 0 0 2 4 VDS 6
10 V 7V 6V
80 A 70 60 ID 50 40 TVJ = 25C TVJ = 125C
2.5
RDS(on) ID=18A
2.0 norm. 1.5
VGS= 5 V
30 20
1.0
0.5 10 0 8 V 10 2 3 4 VGS 5 6 V7 0.0 -50
0 TVJ
50
100 C 150
Fig. 1 Typ. output characteristic ID = f (VDS) (MOSFET)
1.4 BVDSS VGS(th) 1.2 VGS(th) VDSS
Fig. 2 Typ. transfer characteristics ID = f (VGS) (MOSFET)
12 V 10 8 VDS= 250 V ID = 18 A IG = 10 mA 6
Fig. 3 Typ. normalized RDS(on) = f (TVJ) (MOSFET)
100 nF
10 C
Ciss
1.0 norm. 0.8
VGS
Coss 4 1
0.6
2 0 0 100 200 Qg 300 nC 400 0.1 0 5 10 VDS 15
Crss
0.4 -50
0 TVJ
50
100 C 150
V
20
Fig. 4 Typ. normalized BVDSS = f (TVJ) VGS(th) = f (TVJ) (MOSFET)
80 s 60
gfs
Fig. 5 Typ. turn-on gate charge characteristics, VGS = f (Qg) (MOSFET)
120 A 100 80 IF 60 40 TVJ=150C TVJ=100C TVJ= 25C
Fig. 6 Typ. capacitances C = f (VDS), f = 1 MHz (MOSFET)
3.0 C 2.5 Qrr 2.0 1.5 1.0 0.5 typ. 0.0 10 TVJ=100C VR= 350 V max. IF = 37 A IF = 74 A IF = 37 A IF = 18.5 A
40
20
20
0 0 20 40 60
ID
80 A 100
0 0.5
1.0
1.5 VF
2.0 V 2.5
100 -diF/dt
A/ms 1000
Fig. 7 Typ. transconductance, gfs = f (ID) (MOSFET)
Fig. 8 Forward current versus voltage drop (Diodes)
Fig. 9 Recovery charge versus -diF/dt (Diodes)
826
(c) 2000 IXYS All rights reserved
3-4
VUM 25-05
50 A TVJ=100C VR= 350 V 40 IRM 30 IF = 37 A IF = 74 A IF = 37 A IF = 18.5 A max. Kt
1.4
0.6
s
1.2 trr 1.0 IRM 0.8 0.2 typ. Qr 0.1 0.3 0.5 0.4
TVJ=100C VR= 350 V
max.
20
IF = 37 A IF = 74 A IF = 37 A IF = 18.5 A
10
0.6
typ. 0 0 100 200 300 400 -diF/dt 500 600 A/ms 0.4 20 0.0 40 60 80 100 120 140 160 C TJ
TVJ
0
100
200
300 400 A/ms 600 500 -diF/dt
Fig. 10 Peak reverse current versus -diF/dt (Diodes)
18 V 16 14 VFR 12 10 8 6 4 2 0 100 200 tFR 0.3 VFR 0.5 0.9
Fig. 11 Dynamic parameters versus junction temperature (Diodes)
Fig. 12 Recovery time versus -diF/dt (Diodes)
2.5 K/W 2.0 VUM 25
ms
0.7
ZthJC 1.5
Diode
1.0
0.5 tFR MOSFET 0.0 0.01 0.1 1 t s 10
0.1 300 400 A/ms 600 500 diF/dt
Fig. 13 Peak forward voltage versus -diF/dt (Diodes)
Fig. 14 Transient thermal impedance junction to case for all devices
(c) 2000 IXYS All rights reserved
4-4


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