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U2761B
DECT RF / IF IC
Description
The U2761B is an integrated circuit manufactured in TEMIC's UHF5S technology, designed for DECT application. It contains rejection mixer, IF amplifier, FM demodulator, baseband filter, RSSI, TX preamplifier and power-ramping generator for power amplifier.
Features
D Supply-voltage range 2.7 to 5.5 V D Low current consumption D Few external components D On-chip baseband filter D LO switch and TX preamplifier D Ramp-signal generator for power amplifier
Block Diagram
QUAD_TANK2 IF_TANK1 IF_TANK2 QUAD_TANK1 DEMOD_OUT VS1 VS2
IF_IN1 IF_IN2
IF amp 1
IF amp 2
Demodulator Bandgap
MIXER_IN1 MIXER_IN2
IR mixer
T/R switch
TX driver TX_RF_OUT
Ramp generator
Control logic
+ -
OpAmp OP_OUT
MIXER_OUT1
RAMP_SET TX_ON MIXER_OUT2 RAMP_OUT
LO_IN2 RX_ON OP_N LO_IN1 OP_P
14657
Figure 1. Block diagram
Ordering Information
Extended Type Number U2761B Package SSO28 Remarks
TEMIC Semiconductor Rev. A4, 10-Mar-98
1 (11)
Preliminary Information
U2761B
Pin Description
RSSI PU
1 2
28 OP_OUT 27 OP_P 26 OP_N
IF_TANK1 3 IF_TANK2 4 GND1 5
25 DEMOD_OUT 24 QUAD_TANK2 23 QUAD_TANK1 22 GND3 21 LO_IN2
MIXER_IN1 6 MIXER_IN2 7 GND2 8 TX_RF_OUT 9 VS1 10 IF_IN1 11 IF_IN2 12 RAMP_OUT 13 RAMP_SET 14
14808
20 LO_IN1 19 VS2
18 MIXER_OUT2 17 MIXER_OUT1
16 TX_ON 15 RX_ON
Figure 2. Pinning
2 (11)
Preliminary Information
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2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 TEMIC Semiconductor Rev. A4, 10-Mar-98
Pin 1
Function Received signal strength indicator output PU Hardware power-up input IF_TANK1 IF tank circuit Pin 1 IF_TANK2 IF tank circuit Pin 2 GND1 Ground MIXER_IN1 Mixer RF differential input 1 MIXER_IN2 Mixer RF differential input 2 GND2 Ground TX_RF_OUT Output of TX driver amplifier VS1 Supply voltage input 1 IF_IN1 IF amplifier differential input 1 IF_IN2 IF amplifier differential input 2 RAMP_OUT Ramp-signal output for PA RAMP_SET Slew-rate setting of ramp signal RX_ON RX control input TX_ON TX control input MIXER_OUT1 Mixer IF differential output 1 MIXER_OUT2 Mixer IF differential output 2 VS2 Supply voltage input 2 LO_IN1 Local oscillator input 1 LO_IN2 Local oscillator input 2 GND3 Ground QUAD_TANK1 Quadrature tank circuit 1 QUAD_TANK2 Quadrature tank circuit 2 DEMOD_OUT Output of demodulator OP_N OP - Input inverting OP_P OP - Input non-inverting OP_OUT OP - Output
Symbol RSSI
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Electrical Characteristics
All voltages are referred to GND (Pins 5, 8 and 22) Test conditions: VS = 3.0 V, Tamb = 25C, unless otherwise specified Output impedance Maximum output power Gain compression Output interception point Conversion gain Output interception point Input impedance Input matching LO switch and TX driver Power gain (high) Input impedance Input matching Isolation LO-TX IR mixer Image-rejection ratio DSB noise figure Parameters Power supply Total supply current pp y Supply voltage Ambient temperature IRR NFDSB= Pins 17 and 18 NFSSB Rload = 200 W Gconv Pins 17 and 18 OIP3 Pins 6 and 7 Zin Pins 6 and 7 VSWRin Pin 9, 20 and 21 @ Pin = -40 dBm Gp Pin 20 or Pin 21 to GND Zin Pins 20 and 21 VSWRin RX mode: LO Pin 20 or Isol Pin 21 to Pin 9 Pin 9 Zout Pin 9 Pmax @ TX_RF_OUT Pin 9 P1dB Pin 9 OIP3 TX RX RX (RSSI only) Standby, PU = GND Pins 6, 7, 17 and 18 Pins 17 and 18 Test Conditions / Pins Symbol Symbol VS Tamb IS Min. Min. 2.7 -25 30 50 <2:1 12 10 50 <2:1 Typ. Typ. 3.0 +25 100 3 1 10 37 10 20 30 50 47 1 Max. Max. 5.5 +85 10 dBm dBm dBm dB dBm Unit Unit V C mA mA mA
AAAAA A AA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA A AA AAAAA A AA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAA AA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA A AA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAA AA
Thermal Resistance
All voltages are referred to GND (Pins 5, 8 and 22)
TEMIC Semiconductor Rev. A4, 10-Mar-98
Operating Range
Absolute Maximum Ratings
Junction ambient
Supply voltage Junction temperature Storage temperature
Parameters Pins 10 and 19
Parameters
Parameters Pins 10 and 19
Preliminary Information
Symbol RthJA Symbol VS Tj Tstg Value 6 150 -40 to +125 Value 130
U2761B
Unit K/W
Unit V C C
mA
dB
dB
dB
dB
W
W
W
3 (11)
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Test conditions: VS = 3.0 V, Tamb = 25C, unless otherwise specified
Electrical Characteristics (continued)
U2761B
4 (11) Amplitude of recovered signal Output-voltage DC range Output impedance AM rejection ratio OpAmp Power gain bandwidth Excess phase Input offset voltage Open loop gain Output voltage range Common mode input voltage Common mode rejection ratio Total harmonic distortion Sensitivity FM demodulator Co-channel rejection ratio Max. output current Quiescent output current RSSI fall time RSSI rise time Parameters IF amplifier Input impedance Lower cut-off frequency Upper cut-off frequency Power gain Bandwidth of external tank circuit Noise figure RSSI RSSI sensitivity RSSI compression RSSI dynamic range RSSI resolution Slope of the RSSI has to be Acc steady Pin = 30 dBmV to tr 100 dBmV Pin 1 Pin = 100 dBmV to tf 30 dBmV Pin 1 @ Pin < 20 dBmV at Iout IF_IN1, IF_IN2 Pin 1 @ Pin = 100 dBmV at Iout IF_IN1, IF_IN2 Pin 1 Pins 23, 24 and 25 @ Pin = -75 dBm at CCRR IR-mixer input Quality factor of external S tank circuit approx. 20 Nominal deviation of A signal 288 kHz Pin 25 FMoutDC Pin 25 Zout Pin 25 AMRR Pins 26, 27 and 28 PGBW Rload = 1 kW, Cload = 15 pF d Pins 26 and 27 Voffs g Pin 28 Vout Pins 1, 6 and 7 At IF_IN1, IF_IN2 _ ,_ Pins 6 and 7 Test Conditions / Pins Pins 3, 4, 11 and 12 Pins 11 and 12 Pins 26 and 27 Pins 3 and 4 Pin 28 Pin 28 Symbol BW3dB CMRR Zin fl3dB fu3dB Gp THD Pmin Pmax DR Vin NF Min. 200 0.3 0.3 0.4 Typ. 288 150 20 100 80 90 130 85 10 80 1 70 tbd tbd 13 tbd 0.5 2 10 30 10 1 1 9
Preliminary Information
TEMIC Semiconductor Rev. A4, 10-Mar-98 VS - 0.3 VS - 0.3 VS - 0.4 Max. 400 V/MHz dBmV dBmV dB mVss MHz mV dB V MHz MHz MHz dB Unit V kW dB
mA
mA
dB dB dB dB
ms
ms
%
W
V
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Test conditions: VS = 3.0 V, Tamb = 25C, unless otherwise specified
TEMIC Semiconductor Rev. A4, 10-Mar-98
RX mode TX mode Standby RSSI PU 1 0 1 1 1 RX_ON X 0 1 1 0 Logic TX_ON X 0 1 0 1
Active Blocks Corresponding to RX / TX
Electrical Characteristics (continued)
Parameters Test Conditions / Pins Ramp generator Pins 13 and 14 Min. output voltage Accord. to PA RAMP input Max. output voltage Accord. to PA RAMP input Rise time CRAMP = 270 pF at Pin 14 Fall time CRAMP = 270 pF at Pin 14 Logic input levels (RX_ON, TX_ON) Pins 15 and 16 High input level = `1' Low input level = `0' High input current = `1' Low input current = `0' Power / standby Pin 2 Power-up high input level PU = `1' Standby low input level PU = `0' Power-up high input current PU = `1' VPU = 3 V, VPU = 5.5 V Standby low input current PU = `0' VPU = 0 V, VPU = 0.5 V Settling time Switched VS = 0 -> active operation VS = 0 to VS = 3 V Settling time Switched standby -> active operation PU = 0 to PU = 1 Settling time Switched active operation -> standby VS = 3 V to VS = 0
OP
off
off
off
off
on
Preliminary Information
Demodulator off off off off on IF amplifiers off off off on on IR mixer
VPU VPU,OFF
Symbol
IPU,OFF
Vmin Vmax tr tf
off
off
off
on
on
ViH ViL IiH IiL
IPU
tsoa
tsas
tssa
Active Parts
RSSI
off
off
off
on
on
Min.
2.0
1.5
20 60
-5 -5
RX switch
off
off
off
on
on
< 10
< 10
Typ.
0.2 1.95 5 5
<2
30 80
TX switch
off
off
off
on
on
U2761B
Max.
0.7 40 100 0.1 1
TX driver
0.5 5 5
off
off
off
off
on
Ramp generator
Unit
A
A
V V A A
s
s
s
V V s s
5 (11) V V
off off off off on
U2761B
Typical Application Circuit
RX_ON TX_ON LO_IN
LC-tank RX_DATA
PCB
28
27
26
25
24
23
22
21
20
19
18
17
16
15 Matching + balun
+ OP amp
- RX Demodulator TX driver TX
Control- logic LC
SAW Filter
IF amp 2
IR mixer IF amp 1 Ramp generator Matching + balun
RF/IF U2761B 1 RSSI PU LC-Tank MIXER_IN TX_RF_OUT 2 3 4 5 6 7 8 9 10 11 12
13
14 VS
RAMP_OUT
14658
Figure 3. Typical application circuit
Recommended Baseband Filter (f3dB
14659
[ 570 kHz)
26
-
25 R3 6.8k R1 13k C1 18p C2 5.6p 27
28
+
Figure 4. Recommended baseband filter
6 (11)
Preliminary Information
TEMIC Semiconductor Rev. A4, 10-Mar-98
U2761B
Input / Output Interface Circuits
VS VS
2 1 RSSI PU
25k
25k
14660
14661
Figure 5.
Figure 8.
VS
VS
3 IF_TANK1
4 IF_TANK2
6 MIXER_IN1
7 MIXER_IN2
14662
14663
Figure 6.
Figure 9.
VS
VS
9 11 TX_RF_OUT IF_IN1 IF_IN2 4.3k 12
14664
14665
Figure 7.
Figure 10.
TEMIC Semiconductor Rev. A4, 10-Mar-98
7 (11)
Preliminary Information
U2761B
19 VS2 VS1 10 VS
AB- control
22 GND3 8 GND2 GND1
14666
13, 28 RAMP_OUT OP_OUT
5
14667
Figure 11.
VS
Figure 14.
VS
14 RAMP_SET 15, 16 TX_ON RX_ON 5k 5k
14668
14669
Figure 12.
Figure 15.
VS
VS
10k 24 QUAD_TANK2
10k 23 QUAD_TANK1
20 LO_IN1 200 200
21 LO_IN2
14670
14671
Figure 13.
Figure 16.
8 (11)
Preliminary Information
TEMIC Semiconductor Rev. A4, 10-Mar-98
U2761B
VS
17 MIXER_OUT1 18 MIXER_OUT2
25 DEMOD_OUT
14748
14672
Figure 17.
VS
Figure 19.
26 OP_N
27 OP_P
14673
Figure 18.
TEMIC Semiconductor Rev. A4, 10-Mar-98
9 (11)
Preliminary Information
U2761B
Package Information
Package SSO28
Dimensions in mm
9.10 9.01 5.7 5.3 4.5 4.3
1.30 0.25 0.65 8.45 28 15 0.15 0.05 6.6 6.3 0.15
technical drawings according to DIN specifications
13018
1
14
10 (11)
Preliminary Information
TEMIC Semiconductor Rev. A4, 10-Mar-98
U2761B
Ozone Depleting Substances Policy Statement
It is the policy of TEMIC Semiconductor GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances ( ODSs). The Montreal Protocol ( 1987) and its London Amendments ( 1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. TEMIC Semiconductor GmbH semiconductor division has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2 . Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency ( EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) respectively. TEMIC Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.
We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. TEMIC Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 49 ( 0 ) 7131 67 2831, Fax number: 49 ( 0 ) 7131 67 2423
TEMIC Semiconductor Rev. A4, 10-Mar-98
11 (11)
Preliminary Information
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