 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| Production Process Released AdvancedMESFET Foundry Service GaAs Passives Foundry Service Features * * TQRLC TQTRx * * * * * * Thick 4 Layer Metal; > 9 m total thickness High Density Interconnects: * 3 Global * 1 Local High-Q Passives; Inductor Q >50 @ 2 GHz Low Cost: Passives Only Thin Film Resistors Dielectric Encapsulated Metals Planarized Surface; simplified plastic packaging Volume Production Process TQRLC Process Cross-Section TQTRx Applications * General Description TriQuint's TQRLC is a pure passives process. It is targeted at high performance, small size passive-only circuits and utilizes over 9 m of gold metal. High density interconnections are accomplished with three thick global and one surface metal interconnect layers. The four metal layers are encapsulated in a high performance, low dielectric constant material that allows wiring flexibility and plastic packaging simplicity. Precision NiCr resistors, inductors, and high value MIM capacitors are available. The process is based on the TQTRx process, currently TriQuint's highest volume process. The TQRLC process is available on 150-mm (6 inch) wafers. * * * * Passive Components: * Phase Shifters * Baluns * Transformers * Couplers * Mixers (with off-chip diode arrays) Circuits Requiring High-Q Passive Elements Matching Circuits RF Module Front-End Filters General RF and Microwave Impedance Matching TriQuint Semiconductor TriQuint Semiconductor 2300 NE Brookwood Pkwy 2300 NE Brookwood Pkwy Hillsboro, Oregon 97124 Hillsboro, Oregon 97124 Semiconductors for Communications www.triquint.com Page 1 of 7; Rev 1.0 11/15/01 Page 1 of 3; Rev 2.3 3/18/04 Phone: 503-615-9000 Phone: 503-615-9000 Fax: 503-615-8905 Fax: 503-615-8905 Email: info@triquint.com Email: info@triquint.com Production Process Released AdvancedMESFET Foundry Service Passives Foundry Service TQRLC Process Details Element Interconnects TQRLC TQTRx Units m m m m Parameter Metal Layers Space Width Trace Width Value Four: 0.4,2,2,5.5 Met3= 5; Met1&2= 3 Met3= 5; Met1&2= 2 ILD1= 1 +/-0.1; ILD2&3= 3.2 +/- 0.2 2.8 600 50+/-3 No BCB Dielectric Nom. Thickness Dielectric Constant MIM Caps Resistors Vias Mask Layers Values NiCr pF/mm2 Ohms/sq No Vias 10 Maximum Ratings Capacitor Breakdown Voltage 40 V Met3 Passivation Via3 Met2 Via2 Met1 Via1 Met0 MIM ILD3 dielectric ILD2 dielectric ILD1 dielectric Example of Metal Stack Configurations Possible with TQRLC Process; Edge- or Parallel-Coupled Structures Through The ILD Layers Are Also Possible. Specifications Subject to Change TriQuint Semiconductor TriQuint Semiconductor 2300 NE Brookwood Pkwy 2300 NE Brookwood Pkwy Hillsboro, Oregon 97124 Hillsboro, Oregon 97124 Semiconductors for Communications www.triquint.com Page 2 of 7; Rev 1.0 11/15/01 Page 2 of 3; Rev 2.3 3/18/04 Phone: 503-615-9000 Phone: 503-615-9000 Fax: 503-615-8905 Fax: 503-615-8905 Email: info@triquint.com Email: info@triquint.com Production Process Advanced Passives Foundry Service Prototyping and Development * Prototype Development Quickturn (PDQ): * Shared Mask Set; * Run Monthly; * Hot Lot Cycle Time; Prototype Wafer Option (PWO): * Customer-specific Masks, Customer Schedule * 2 wafers delivered * With thinning and sawing * * * TQRLC Process Qualification Status TQRLC is a fully-released process Reliability Reports * TQRLC Process Qualification * TQTRx Element Qualification Report For more information on Quality and Reliability, contact TriQuint or visit: www.tqs.com/Manufacturing/QR/bdy_qr-pubs.htm. * Applications Support Services Design Tool Status * * * * * Design Manual Available Now Device Library of Circuit Elements includes Thin Film Resistors, Capacitors, Inductors Agilent ADS Definition File for E-M Simulation Now Layout/Verification Kit for ICEditors Cadence Layout Library Available Now * * * * Tiling of GDSII Stream Files including PCM Design Rule Check Services Layout versus Schematic Check Services Engineering Services: * Packaging Development * Test Development Engineering (on-wafer and packaged parts) * Thermal Analysis Engineering * Yield Enhancement Engineering Part Qualification Services Failure Analysis * * Manufacturing Services * GaAs Design Classes: * Half Day Introduction; Upon Request * Four Day Technical Training; Fall & Spring at TriQuint Oregon facility For Training Schedules, please visit: www.triquint.com/foundry/ Training * * * * * * * * * Mask Making Production 150 mm Wafer Fab Wafer Thinning Wafer Sawing DC Die Sort Testing RF On-Wafer Testing Plastic Packaging RF Packaged Part Testing Please contact your local TriQuint Semiconductor Representative or Foundry Services Staff for additional information: E-mail: sales@triquint.com Phone: (503) 615-9000 Fax: (503) 615-8905 TriQuint Semiconductor 2300 NE Brookwood Pkwy Hillsboro, Oregon 97124 Semiconductors for Communications www.triquint.com Page 3 of 3; Rev 2.3 3/18/04 Phone: 503-615-9000 Fax: 503-615-8905 Email: info@triquint.com |
Price & Availability of TQRLC
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |