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| TB2903HQ Block Diagram C5 1 TAB 20 VCC1 6 VCC2 OUT1 (+) 9 C1 11 IN1 PW-GND1 8 OUT1 (-) 7 RL OUT2 (+) 12 IN2 5 RL C1 PW-GND2 2 OUT2 (-) 3 C6 16 AC-GND OUT3 (+) 15 IN3 17 RL C1 PW-GND3 18 OUT3 (-) 19 OUT4 (+) 14 IN4 21 RL C1 PW-GND4 24 OUT4 (-) 23 PRE-GND 13 RIP 10 C2 STBY 4 Off-set DET 25 MUTE 22 PLAY C4 R1 MUTE : PRE-GND : PW-GND 5V Note4: Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purpose. C3 2 2004-07-25 TB2903HQ Caution and Application Method (Description is made only on the single channel.) 1. Voltage Gain Adjustment This IC has no NF (negative feedback) Pins. Therefore, the voltage gain can not be adjusted, but it makes the device a space and total costs saver. Amp. 2A Amp. 1 Input Amp. 2B Figure 1 Block Diagram The voltage gain of amp.1 : GV1 = 0dB The voltage gain of amp.2A, B : GV2 = 20dB The voltage gain of BTL connection : GV (BTL) = 6dB Therefore, the total voltage gain is decided by expression below. GV = GV1 + GV2 + GV (BTL) = 0 + 20 + 6 = 26dB 2. Standby SW Function (pin 4) By means of controlling pin 4 (standby pin) to High and Low, the power supply can be set to ON and OFF. The threshold voltage of pin 4 is set at about 3VBE (typ.), and the power supply current is about 2 A (typ.) in the standby state. VCC ON OFF Power 4 10 k 2 VBE to BIAS CUTTING CIRCUIT Control Voltage of Pin 4: VSB Standby ON OFF Power OFF ON VSB (V) 0~1.5 3.5~6 V When changing the time constant of pin 4, check the pop noise. Figure 2 With pin 4 set to High, Power is turned ON Advantage of Standby SW (1) (2) Since VCC can directly be controlled to ON or OFF by the microcomputer, the switching relay can be omitted. Since the control current is microscopic, the switching relay of small current capacity is satisfactory for switching. 3 2004-07-25 TB2903HQ Large current capacity switch Battery Relay Battery VCC VCC - Conventional Method - From microcomputer Small current capacity switch Battery From microcomputer Battery Stand-By VCC Stand-By VCC - Standby Switch Method - Figure 3 3. Muting Function (pin 22) Audio muting function is enabled when pin 22 is Low. When the time constant of the muting function is determined by R1 and C4, it should take into account the pop noise. The pop noise which is generated when the power or muting function is turned ON/OFF will vary according to the time constant. (Refer to Figure 4 and Figure 5.) The pin 22 is designed to operate off 5 V. Moreover, this terminal (pin 22) serves as the source switch of current of an internal mute circuit. And it is designed so that the discharge current of this terminal (pin 22) may serve as 200 A. The outside pull-up resistor R1 is determind on the basic of this value. ex) When control voltage is changed in to 6 V from 5 V. 6 V/5 V x 47 k = 56 k To obtain enough mute attenuation, a series resistor, R1 at pin 22 should be 47 k or more. ATT - VMUTE 20 0 VCC = 13.2 V f = 1kHz RL = 4 VOUT = 20dBm (dB) Mute attenuation ATT -20 -40 -60 -80 -100 -120 0 5V 1 k Mute ON/OFF control R1 22 C4 0.5 1 1.5 2 2.5 3 Pin 22 control voltage: VMUTE (V) Figure 4 Muting Function Figure 5 Mute Attenuation - VMUTE (V) 4 2004-07-25 TB2903HQ 4. Off-set detection function In case of Appearing output offset voltage by Generating a Large Leakage Current on the input Capacitor etc. V DC Voltage (+) Amp (at leak) (RS1) VCC/2 (normal DC voltage) Vref Leak or short RS1 Elec. vol RS2 - Vbias 25 A L.P.F. B To CPU 5V Vref/2 + DC Voltage (-) Amp (at short) (RS2) Offset voltage (at leak or short) Figure 6 Application and Detection Mechanism Threshold level (RS1) (+) Amp output VCC/2 Threshold level (RS2) GND t Voltage of point (A) GND t Voltage of point (B) GND RS2 t Figure 7 Wave Form 5 2004-07-25 TB2903HQ 5. Pop Noise Suppression Since the AC-GND pin (pin 16) is used as the NF pin for all amps, the ratio between the input capacitance (C1) and the AC-to-GND capacitance (C6) should be 1:4. Also, if the power is turned OFF before the C1 and C6 batteries have been completely charged, pop noise will be generated because of the DC input unbalance. To counteract the noise, it is recommended that a longer charging time be used for C2 as well as for C1 and C6. Note that the time which audio output takes to start will be longer, since the C2 makes the muting time (the time from when the power is turned ON to when audio output starts) is fix. The pop noise which is generated when the muting function is turned ON/OFF will vary according to the time constant of C4. The greater the capacitance, the lower the pop noise. Note that the time from when the mute control signal is applied to C4 to when the muting function is turned ON/OFF will be longer. 6. External Component Constants Component Recommended Name Value Effect Purpose Lower than recommended value Cut-off frequency is increased Powering ON/OFF is faster Higher than recommended value Cut-off frequency is reduced Powering ON/OFF takes longer Notes C1 0.22 F 10 F 0.1 F To eliminate DC Pop noise is generated when VCC is ON C2 To reduce ripple To provide sufficient oscillation margin To reduce pop noise Ripple filter NF for all outputs C3 Reduces noise and provides sufficient oscillation margin High pop noise. Duration until Low pop noise. Duration until muting function is turned muting function is turned ON/OFF is short ON/OFF is long Power supply ripple filtering Pop noise is suppressed when C1:C6 = 1:4 Pop noise is generated when VCC is ON C4 C5 C6 1 F 3900 F 1 F Note5: If recommended value is not used. 6 2004-07-25 TB2903HQ Maximum Ratings (Ta = 25C) Characteristics Peak supply voltage (0.2 s) DC supply voltage Operation supply voltage Output current (peak) Power dissipation Operation temperature Storage temperature Symbol VCC (surge) VCC (DC) VCC (opr) IO (peak) PD (Note 6) Topr Tstg Rating 50 25 18 9 125 -40~85 -55~150 Unit V V V A W C C Note 6: Package thermal resistance j-T = 1C/W (typ.) (Ta = 25C, with infinite heat sink) The absolute maximum ratings of a semiconductor device are a set of specified parameter values, which must not be exceeded during operation, even for an instant. If any of these rating would be exceeded during operation, the device electrical characteristics may be irreparably altered and the reliability and lifetime of the device can no longer be guaranteed. Moreover, these operations with exceeded ratings may cause break down, damage and/or degradation to any other equipment. Applications using the device should be designed such that each maximum rating will never be exceeded in any operating conditions. Before using, creating and/or producing designs, refer to and comply with the precautions and conditions set forth in this documents. Electrical Characteristics Characteristics Quiescent current (unless otherwise specified, VCC = 13.2 V, f = 1 kHz, RL = 4 , Ta = 25C) Symbol ICCQ POUT MAX (1) Output power POUT MAX (2) POUT (1) POUT (2) Total harmonic distortion Voltage gain Voltage gain ratio Output noise voltage THD GV GV VNO (1) VNO (2) Ripple rejection ratio Cross talk Output offset voltage Input resistance Standby current Standby control voltage R.R. C.T. VOFFSET RIN ISB VSB H VSB L Mute control voltage VM H VM L Mute attenuation ATT M Test Circuit VIN = 0 VCC = 14.4 V, max POWER VCC = 13.7 V, max POWER VCC = 14.4 V, THD = 10% THD = 10% POUT = 5 W VOUT = 0.775 Vrms VOUT = 0.775 Vrms Rg = 0 , DIN45405 Rg = 0 , BW = 20 Hz~20 kHz frip = 100 Hz, Rg = 620 Vrip = 0.775 Vrms Rg = 620 VOUT = 0.775 Vrms Standby condition POWER: ON POWER: OFF MUTE: OFF MUTE: ON, R1 = 47 k MUTE: ON VOUT = 7.75 VrmsMute: OFF Test Condition Min 23 24 -1.0 50 -150 3.5 0 3.0 0 80 Typ. 200 47 43 29 25 0.015 26 0 100 90 60 70 0 90 2 90 Max 400 0.15 28 1.0 200 150 10 6.0 V 1.5 6.0 V 0.5 dB dB dB mV k A % dB dB Vrms W Unit mA 7 2004-07-25 TB2903HQ Offset detection Detection threshold voltage Voff-set Rpull-up = 47 k, +V = 5.0V Based on output DC voltage 1.0 1.5 2.0 V Test Circuit 3900 F 1 TAB 20 VCC1 6 VCC2 OUT1 (+) 9 0.22 F C1 11 IN1 PW-GND1 8 OUT1 (-) 7 RL OUT2 (+) 0.22 F C1 12 IN2 5 RL PW-GND2 2 OUT2 (-) 3 1 F C6 16 AC-GND OUT3 (+) 0.1 0.22 F 17 RL C1 15 IN3 PW-GND3 18 OUT3 (-) 19 OUT4 (+) 0.22 F C1 14 IN4 21 RL PW-GND4 24 OUT4 (-) 23 PRE-GND 13 RIP 10 10 F C2 STBY 4 Off-set DET 25 MUTE 22 47 k 1 F C4 R1 PLAY MUTE : PRE-GND : PW-GND 5V Components in the test circuits are only used to obtain and confirm the device characteristics. These components and circuits do not warrant to prevent the application equipment from malfunction or failure. C3 0.1 F C5 8 2004-07-25 TB2903HQ THD - POUT (ch1) 100 VCC = 13.2 V 50 RL = 4 30 Filter 100 Hz : ~30 kHz 10 5 1kHz : 400 Hz~30 kHz 10 kHz : 400 Hz~ 20 kHz : 400 Hz~ 5 100 THD - POUT (ch2) VCC = 13.2 V VCC = 13.2 V 50 RL = 4 RL = 4 30 Filterch Filter Hz : ~30 kHz 100 10 100 Hz : ~300 kHz kHz 1kHz : 400 Hz~30 1kHz : 400 Hz~ kHz 10 kHz : 400 Hz~30 10 kHz : 400 Hz~ 20 kHz : 400 Hz~ 30 kHz : 400 Hz~ (%) 3 (%) 3 Total harmonic distortion THD 1 0.5 0.3 Total harmonic distortion THD 20 kHz 1 0.5 0.3 20 kHz 10 kHz 10 kHz 0.1 0.05 0.03 1 kHz 0.01 0.005 0.003 f = 100 Hz 0.1 0.05 0.03 1 kHz 0.01 f = 100 Hz 0.005 0.003 0.001 0.1 0.3 0.5 1 3 5 10 30 50 100 0.001 0.1 0.3 0.5 1 3 5 10 30 50 100 Output power POUT (W) Output power POUT (W) THD - POUT (ch3) 100 VCC = 13.2 V 50 RL = 4 30 Filter 100 Hz : ~30 kHz 10 5 1kHz : 400 Hz~30 kHz 10 5 10 kHz : 400 Hz~ 20 kHz : 400 Hz~ 50 100 VCC = 13.2 V RL = 4 30 Filter THD - POUT (ch4) 100 Hz : ~30 kHz 1kHz : 400 Hz~30 kHz 10 kHz : 400 Hz~ 20 kHz : 400 Hz~ (%) 3 (%) 3 Total harmonic distortion THD 1 0.5 0.3 20 kHz Total harmonic distortion THD 1 0.5 0.3 20 kHz 10 kHz 10 kHz 0.1 0.05 0.03 1 kHz 0.01 0.005 0.003 f = 100 Hz 0.1 0.05 0.03 1 kHz 0.01 f = 100 Hz 0.005 0.003 0.001 0.1 0.3 0.5 1 3 5 10 30 50 100 0.001 0.1 0.3 0.5 1 3 5 10 30 50 100 Output power POUT (W) Output power POUT (W) 9 2004-07-25 TB2903HQ THD - POUT (ch1) 100 50 30 VCC = 13.2 V RL = 4 f = 1 kHz Filter 10 5 400 Hz~30 kHz 10 5 13.2 V 100 50 30 VCC = 13.2 V RL = 4 f = 1 kHz Filter THD - POUT (ch2) 13.2 V 400 Hz~30 kHz (%) 3 (%) 3 Total harmonic distortion THD 1 0.5 0.3 VCC = 9.0 V 16.0 V Total harmonic distortion THD 1 0.5 0.3 VCC = 9.0 V 16.0 V 0.1 0.05 0.03 0.1 0.05 0.03 0.01 0.005 0.003 0.01 0.005 0.003 0.001 0.1 0.3 0.5 1 3 5 10 30 50 100 0.001 0.1 0.3 0.5 1 3 5 10 30 50 100 Output power POUT (W) Output power POUT (W) THD - POUT (ch3) 100 50 30 VCC = 13.2 V RL = 4 f = 1 kHz Filter 10 5 400 Hz~30 kHz 10 5 13.2 V 100 50 30 VCC = 13.2 V RL = 4 f = 1 kHz Filter THD - POUT (ch4) 13.2 V 400 Hz~30 kHz (%) 3 (%) 3 Total harmonic distortion THD 1 0.5 0.3 VCC = 9.0 V 16.0 V Total harmonic distortion THD 1 0.5 0.3 VCC = 9.0 V 16.0 V 0.1 0.05 0.03 0.1 0.05 0.03 0.01 0.005 0.003 0.01 0.005 0.003 0.001 0.1 0.3 0.5 1 3 5 10 30 50 100 0.001 0.1 0.3 0.5 1 3 5 10 30 50 100 Output power POUT (W) Output power POUT (W) 10 2004-07-25 TB2903HQ muteATT - f 0 VCC = 13.2 V 0 VCC = 13.2 V RL = 4 RG = 620 Vrip =0dBm R.R. - f Mute attenuation muteATT (dB) -20 RL = 4 VOUT = 20dBm (dB) Ripple rejection ratio R.R. -20 -40 -60 -40 -80 1 ch ~4ch -100 4ch -60 3ch 1ch 2ch 100 1k 10 k 100 k -120 10 100 1k 10 k 100 k -80 10 frequency f (Hz) frequency f (Hz) GV - f 40 3 VCC = 13.2 V 1 0.3 0.1 0.03 0.01 3ch 0.003 0.001 10 1ch 2ch RL = 4 POUT = 5 W No filter THD - f GV (dB) 30 1 ch ~4ch Voltage gain 20 Total harmonic distortion THD (%) 4ch 10 VCC = 13.2 V RL = 4 VOUT = 0dBm 0 10 100 1k 10 k 100 k 100 1k 10 k 100 k frequency f (Hz) frequency f (Hz) 11 2004-07-25 TB2903HQ VIN - POUT (ch1) 40 1 kHz 100 Hz 40 1 kHz VIN - POUT (ch2) 100 Hz Output power POUT (W) 30 Output power POUT (W) 10 kHz 30 10 kHz 20 f = 20 kHz 20 f = 20 kHz 10 VCC = 13.2 V RL = 4 No filter 10 VCC = 13.2 V RL = 4 No filter 0 0 2 4 6 8 10 0 0 2 4 6 8 10 Input voltage VIN (Vrms) Input voltage VIN (Vrms) VIN - POUT (ch3) 40 1 kHz 100 Hz 40 1 kHz VIN - POUT (ch4) 100 Hz Output power POUT (W) 30 10 kHz Output power POUT (W) 30 10 kHz f = 20 kHz 20 20 f = 20 kHz 10 VCC = 13.2 V RL = 4 No filter 10 VCC = 13.2 V RL = 4 No filter 0 0 2 4 6 8 10 0 0 2 4 6 8 10 Input voltage VIN (Vrms) Input voltage VIN (Vrms) ICCQ -VCC 400 RL = VIN = 0 300 120 PD MAX - Ta Allowable power dissipation PD MAX (W) (1) NFINITE HEAT SINK RJC = 1C/W 100 (2) HEAT SINK (RHS = 3.5C/W) RJC + RHS = 4.5C/W 80 (1) 60 (3) NO HEAT SINK RJA = 39C/W Quiescent Current ICCQ 200 (mA) 40 100 20 (3) 0 0 25 50 75 (2) 0 0 10 20 30 100 125 150 Supply voltage VCC (V) Ambient temperature Ta (C) 12 2004-07-25 TB2903HQ C.T. - f (ch1) 0 VCC = 13.2 V RL = 4 VOUT = 0dBm RG = 620 0 VCC = 13.2 V RL = 4 VOUT = 0dBm RG = 620 C.T. - f (ch2) Cross talk C.T. (dB) -40 Cross talk C.T. (dB) -20 -20 -40 ch2 -60 ch3 ch4 -80 10 100 1k 10 k 100 k -60 ch1 ch3 ch4 -80 10 100 1k 10 k 100 k frequency f (Hz) frequency f (Hz) C.T. - f (ch3) 0 VCC = 13.2 V RL = 4 VOUT = 0dBm RG = 620 0 VCC = 13.2 V RL = 4 VOUT = 0dBm RG = 620 C.T. - f (ch4) Cross talk C.T. (dB) -40 Cross talk C.T. (dB) -20 -20 -40 ch1 -60 ch2 ch4 -60 ch1 ch3 ch2 -80 10 100 1k 10 k 100 k -80 10 100 1k 10 k 100 k frequency f (Hz) frequency f (Hz) VNO - Rg 300 PD - POUT 80 f = 1 kHz RL = 4 4ch drive 60 (Vrms) VCC = 13.2 V RL = 4 Filter ~20 kHz 200 (W) 18 V Output noise voltage VNO Power dissipation PD 16 V 40 100 1ch~4ch 20 9.0 V 13.2 V 0 10 100 1k 10 k 100 k 0 0 10 15 20 25 Signal source resistance Rg () Output power POUT (W) 13 2004-07-25 TB2903HQ Package Dimensions Weight: 7.7 g (typ.) 14 2004-07-25 TB2903HQ About solderability, following conditions were confirmed * Solderability (1) Use of Sn-63Pb solder Bath * solder bath temperature = 230C * dipping time = 5 seconds * the number of times = once * use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath * solder bath temperature = 245C * dipping time = 5 seconds * the number of times = once * use of R-type flux RESTRICTIONS ON PRODUCT USE * The information contained herein is subject to change without notice. 030619EBF * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * The products described in this document are subject to the foreign exchange and foreign trade laws. * TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced and sold, under any law and regulations. * This product generates heat during normal operation. However, substandard performance or malfunction may cause the product and its peripherals to reach abnormally high temperatures. The product is often the final stage (the external output stage) of a circuit. Substandard performance or malfunction of the destination device to which the circuit supplies output may cause damage to the circuit or to the product. 15 2004-07-25 |
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