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 SUD50N02-12P
Vishay Siliconix
N-Channel 20-V (D-S) 175_C MOSFET
FEATURES PRODUCT SUMMARY
VDS (V)
20
rDS(on) (W)
0.012 @ VGS = 10 V 0.026 @ VGS = 4.5 V
ID (A)a
40c 27c
D TrenchFETr Power MOSFET D 175_C Junction Temperature D PWM Optimized for High Efficiency
APPLICATIONS
D High-Side Synchronous Buck DC/DC Conversion - Desktop - Server
D
TO-252
G Drain Connected to Tab G D S
Top View Order Number: SUD50N02-12P S N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Currenta Pulsed Drain Current Continuous Source Current (Diode Conduction)a TC = 25_C Maximum Power Dissipation Operating Junction and Storage Temperature Range TA = 25_C TC = 25_C TC= 100_C ID IDM IS PD PD TJ, Tstg
Symbol
VDS VGS
Limit
20 "20 40c 28c 90 4 33.3 6a - 55 to 175
Unit
V
A
W _C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction to Ambienta Junction-to-Ambient Maximum Junction-to-Case Notes a. Surface Mounted on FR4 Board, t v 10 sec. b. Limited by package c. Based on maximum allowable Junction Temperature. Package limitation current is 30 A. Document Number: 72095 S-31269--Rev. B, 16-Jun-03 www.vishay.com t v 10 sec Steady State RthJA RthJC
Symbol
Typical
20 40 3.7
Maximum
25 50 4.5
Unit
_C/W C/W
1
SUD50N02-12P
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter Static
Drain-Source Breakdown Voltage Gate Threshold Voltage Gate-Body Leakage Zero Gate Voltage Drain Current On-State Drain Currentb Drain Source On State Drain-Source On-State Resistanceb Forward Transconductanceb V(BR)DSS VGS(th) IGSS IDSS ID(on) rDS(on) gfs VGS = 0 V, ID = 250 mA VDS = VGS, ID = 250 mA VDS = 0 V, VGS = "20 V VDS = 16 V, VGS = 0 V VDS = 16 V, VGS = 0 V, TJ = 125_C VDS = 5 V, VGS = 10 V VGS = 10 V, ID = 20 A VGS = 10 V, ID = 20 A, TJ = 125_C VGS = 4.5 V, ID = 15 A VDS = 15 V, ID = 20 A 10 0.021 50 0.0095 0.012 0.0143 0.026 S W 20 0.8 3.0 "100 1 50 V nA mA A
Symbol
Test Condition
Min
Typa
Max
Unit
Dynamica
Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance Total Gate Chargec Gate-Source Chargec Gate-Drain Chargec Turn-On Delay Timec Rise Timec Turn-Off Delay Timec Fall Timec Ciss Coss Crss RG Qg Qgs Qgd td(on) tr td(off) tf VDD = 10 V, RL = 0.2 W ID ^ 50 A, VGEN = 10 V, RG = 2.5 W VDS = 10 V, VGS = 4.5 V, ID = 50 A VGS = 0 V, VDS = 10 V, f = 1 MHz 1000 370 180 3.0 7.5 3.5 2.6 11 10 24 9 20 15 35 15 ns 12 nC W p pF
Source-Drain Diode Ratings and Characteristic (TC = 25_C)
Pulsed Current Diode Forward Voltageb Source-Drain Reverse Recovery Time ISM VSD trr IF = 50 A, VGS = 0 V IF = 50 A, di/dt = 100 A/ms 1.1 20 100 1.5 40 A V ns
Notes a. Guaranteed by design, not subject to production testing. b. Pulse test; pulse width v 300 ms, duty cycle v 2%. c. Independent of operating temperature.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
90 6V 75 I D - Drain Current (A) VGS = 10 thru 7 V I D - Drain Current (A) 75 25_C 60 125_C 90 TC = - 55_C
Transfer Characteristics
60
5V
45
45
30
4V
30
15 3V 0 0 2 4 6 8 10
15
0 0 1 2 3 4 5 6 7
VDS - Drain-to-Source Voltage (V) www.vishay.com
VGS - Gate-to-Source Voltage (V) Document Number: 72095 S-31269--Rev. B, 16-Jun-03
2
SUD50N02-12P
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Transconductance
50 0.040 0.035 g fs - Transconductance (S) 40 r DS(on)- On-Resistance ( W ) TC = - 55_C 0.030 0.025 0.020 0.015 0.010 0.005 0 0 10 20 30 40 50 0.000 0 15 30 45 60 75 90 VGS = 10 V
On-Resistance vs. Drain Current
VGS = 4.5 V
30
25_C 125_C
20
10
ID - Drain Current (A)
ID - Drain Current (A)
Capacitance
1500 10
Gate Charge
1200 C - Capacitance (pF)
V GS - Gate-to-Source Voltage (V)
Ciss
8
VDS = 10 V ID = 50 A
900
6
600 Coss 300 Crss
4
2
0 0 4 8 12 16 20
0 0 4 8 12 16
VDS - Drain-to-Source Voltage (V)
Qg - Total Gate Charge (nC)
On-Resistance vs. Junction Temperature
1.8 VGS = 10 V ID = 30 A I S - Source Current (A) 100
Source-Drain Diode Forward Voltage
1.6 r DS(on)- On-Resistance ( W ) (Normalized)
1.4
TJ = 150_C 10
TJ = 25_C
1.2
1.0
0.8
0.6 - 50
1 - 25 0 25 50 75 100 125 150 175 0 0.3 0.6 0.9 1.2 1.5 TJ - Junction Temperature (_C) VSD - Source-to-Drain Voltage (V)
Document Number: 72095 S-31269--Rev. B, 16-Jun-03
www.vishay.com
3
SUD50N02-12P
Vishay Siliconix
THERMAL RATINGS
Maximum Drain Current vs. Ambiemt Temperature
20 1000 Limited by rDS(on) 16 I D - Drain Current (A) I D - Drain Current (A) 100 10, 100 ms 1 ms 10 ms 100 ms 1s 10 s 100 s dc
Safe Operating Area
12
10
8
1
4
0.1
TA = 25_C Single Pulse
0 0 25 50 75 100 125 150 175
0.01 0.1 1 10 100 TA - Ambient Temperature (_C) VDS - Drain-to-Source Voltage (V)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2 1 Normalized Effective Transient Thermal Impedance
Duty Cycle = 0.5
0.2 0.1 0.1 0.02 0.05
Single Pulse 0.01 10 -4 10 -3 10 -2 10 -1 1 10 100 1000
Square Wave Pulse Duration (sec)
www.vishay.com
4
Document Number: 72095 S-31269--Rev. B, 16-Jun-03


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