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| Datasheet File OCR Text: |
| PDF: 2004 Feb 05 Philips Semiconductors Package outline HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad SOT545-3 c y exposed die pad side X Dh 36 37 25 24 ZE A e Eh wM bp pin 1 index 48 1 wM 12 ZD vM A 13 detail X Lp L E HE A A2 A1 (A 3) bp e D HD B vM B 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) A UNIT max. mm 1.2 A1 0.15 0.05 A2 1.05 0.95 A3 0.25 bp 0.27 0.17 c 0.20 0.09 D(1) 7.1 6.9 Dh 3.6 3.4 E(1) 7.1 6.9 Eh 3.6 3.4 e 0.5 HD 9.1 8.9 HE 9.1 8.9 L 1 Lp 0.75 0.45 v 0.2 w 0.08 y 0.08 ZD(1) ZE(1) 0.9 0.6 0.9 0.6 7 0 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT545-3 REFERENCES IEC JEDEC MS-026 JEITA EUROPEAN PROJECTION ISSUE DATE 04-02-05 |
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