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MPSW56 MPSW56 C TO-226 B E PNP General Purpose Amplifier This device is designed for general purpose medium power amplifiers and switches requiring collector currents to 800 mA. Sourced from Process 79. Absolute Maximum Ratings* Symbol VCEO VCBO VEBO IC TJ, Tstg Collector-Base Voltage Emitter-Base Voltage Collector Current - Continuous TA = 25C unless otherwise noted Parameter Collector-Emitter Voltage Value 80 80 4.0 1.0 -55 to +150 Units V V V A C Operating and Storage Junction Temperature Range *These ratings are limiting values above which the serviceability of any semiconductor device may be impaired. NOTES: 1) These ratings are based on a maximum junction temperature of 150 degrees C. 2) These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations. Thermal Characteristics Symbol PD RJC RJA TA = 25C unless otherwise noted Characteristic Total Device Dissipation Derate above 25C Thermal Resistance, Junction to Case Thermal Resistance, Junction to Ambient 2 Max MPSW56 1.0 8.0 50 125 Units W mW/C C/W C/W *Device mounted on FR-4 PCB 36 mm X 18 mm X 1.5 mm; mounting pad for the collector lead min. 6 cm . 2000 Fairchild Semiconductor Corporation MPSW56, Rev A MPSW56 PNP General Purpose Amplifier (continued) Electrical Characteristics Symbol Parameter TA = 25C unless otherwise noted Test Conditions Min Max Units OFF CHARACTERISTICS V (B R )C E O V (B R )C B O V (B R )E B O IC B O IC E O IE B O C o lle c to r-E m itte r B re a k d o w n V o lta g e C o lle c to r-B a s e B re a k d o w n V o lta g e E m itte r-B a s e B re a k d o w n V o lta g e C o lle c to r-C u to ff C u rre n t C o lle c to r-C u to ff C u rre n t E m itte r-C u to ff C u rre n t I C = 1 .0 m A , I B = 0 IC = 1 0 0 A , IE = 0 I E = 1 .0 m A , I C = 0 V C B = 6 0 V , IE = 0 V CE = 60 V V E B = 3 .0 V , I C = 0 80 80 4 .0 0 .1 0 .5 0 .1 0 V V V A A A ON CHARACTERISTICS* hFE VCE(sat) VBE(on) DC Current Gain Collector-Emitter Saturation Voltage Base-Emitter On Voltage IC = 50 mA, VCE = 1.0 V IC = 250 mA, VCE = 1.0 V IC = 250 mA, IB = 10 mA IC = 250 mA, VCE = 5.0 V 100 50 0.5 1.2 V V SMALL SIGNAL CHARACTERISTICS fT Cob Current Gain-Bandwidth Product Collector-Base Capacitance IC = 250 mA, VCE = 5.0 V, f = 20 MHz VCB = 10 V, IE = 0, f = 1.0 MHz 50 15 MHz pF *Pulse Test: Pulse Width 300 s, Duty Cycle 1.0% Typical Characteristics VCESAT- COLLECTOR EMITTER VOLTAGE (V) h FE - TYPICAL PULSED CURRENT GAIN Typical Pulsed Current Gain vs Collector Current 200 125 C Collector-Emitter Saturation Voltage vs Collector Current 2 1 = 10 V CE = 1.0 V 150 25 C 100 25 C 0.1 - 40 C 125 C 50 - 40 C 0 0.01 0.02 0.05 0.1 0.5 I C - COLLECTOR CURRENT (mA) 1 0.01 10 100 I C - COLLECTOR CURRENT (mA) P 1000 MPSW56 PNP General Purpose Amplifier (continued) Typical Characteristics (continued) VBEON - BASE EMITTER ON VOLTAGE (V) VBESAT- BASE EMITTER VOLTAGE (V) Base-Emitter Saturation Voltage vs Collector Current 1 = 10 Base Emitter ON Voltage vs Collector Current 1 0.8 - 40 C 25 C 0.8 - 40 C 25 C 0.6 125 C 0.6 125 C 0.4 0.4 1 10 100 I C - COLLECTOR CURRENT (mA) 1000 V CE = 5V 0.2 1 10 100 I C - COLLECTOR CURRENT (mA) 1000 C OBO - COLLECTOR-BASE CAPACITANCE (pF) Collector-Cutoff Current vs. Ambient Temperature ICBO- COLLECTOR CURRENT (nA) 100 V CB = 60V Collector-Base Capacitance vs Collector-Base Voltage 40 f = 1.0 MHz 30 10 1 20 0.1 10 0.01 25 50 75 100 TA - AMBIENT TEMPERATURE ( C) 125 0 0 4 8 12 Pr79 16 20 24 28 V CB - COLLECTOR-BASE VOLTAGE (V) f T - GAIN BANDWIDTH PRODUCT (MHz) Gain Bandwidth Product vs Collector Current 250 V CE = 10V 200 150 100 50 0 Safe Operating Area TO-226 10 I C - COLLECTOR CURRENT (A) 10 S * 1 DC T 100 S* DC T 0.1 *PULSED OPERATION T A = 25 C CO 1.0 LLE CT m OR s* LE AM AD =2 BIE 5 C NT = 25 C LIMIT DETERMINED BY BV CEO 1 10 100 I C - COLLECTOR CURRENT (mA) 1000 0.01 1 10 V CE - COLLECTOR-EMITTER VOLTAGE (V) P9 100 MPSW56 PNP General Purpose Amplifier (continued) Typical Characteristics (continued) Power Dissipation vs Ambient Temperature 1 PD - POWER DISSIPATION (W) 0.75 TO-226 SOT-223 0.5 0.25 0 0 25 50 75 100 TEMPERATURE ( o C) 125 150 TO-226AE Tape and Reel Data and Package Dimensions TO -226AE Packaging Configuratio n: Figur e 1.0 TAPE and REEL OPTION FSCINT Label sampl e FAIRCHILD SEMICONDUCTOR CORPORATION LOT: CBVK741B019 HTB:B QTY: 10000 See Fig 2 for various .0 Reeling Styles NSID: PN2222N SPEC: D/C1: D9842 SPEC REV: QA REV: B2 FSCINT Labe l (FSCINT) 5 Reels per Int ermediate Box F63TNR Labe l Custom ized Labe l 375mm x 267mm x 375mm Int ermediate Box F63TNR Label sampl e LOT: CBVK741B019 FSID: PN222N D/C1: D9842 D/C2: QTY1: QTY2: QTY: 2000 SPEC: SPEC REV: CPN: N/F: F Custom ized Labe l (F63TNR)3 AMMO PACK OPTION See Fig 3 for 2 Ammo .0 Pack Options TO-226AE TNR/AMMO PACKING INFORMATION Packing Reel Style A E Ammo M P Quantity 2,000 2,000 2,000 2,000 EOL code D26Z D27Z D74Z D75Z FSCINT Labe l 327mm x 158mm x 135mm Immed iate Box Custom ized Labe l 5 Ammo box es per Int ermediate Box F63TNR Barcode Label 333mm x 231mm x 183mm Int ermediate Box Unit weight = 0.300gm Reel weight with components = 0.868 kg Ammo weight with components = 0.880 kg Max quanti ty per intermediate box = 10,000 units Custom ized Labe l BULK OPTION See Bulk Packing Informat ion table Anti-static Bubble Sheets FSCINT Barcode Label (TO-226AE ) BULK PACKING INFORMATION EOL CODE J18Z J05Z NO EOL CODE DESCRIPTION TO-18 OPTION STD TO-5 OPTION STD TO-226 STANDARD STRAIGHT LEADCLIP DIMENSION NO LEAD CLIP NO LEAD CLIP NO LEADCLIP QUANTITY 1.0 K / BOX 1.0 K / BOX 1.5 K / BOX 1,500 un its per EO70 box for std o ption 114mm x 102mm x 51mm EO70 Immediate Box 5 EO70 boxes per Int ermediate Box 530mm x 130mm x 83mm Intermediate box Customized Label FSCINT Labe l 7,500 un its maximum per intermediate box for std opt ion October 1999, Rev. A1 TO-226AE Tape and Reel Data and Package Dimensions, continued TO-226AE Reeling Style Configuration: Figure 2.0 Machine Option "A" (H) Machine Option "E" (J) Style "A", D26Z, D70Z (s/h) Style "E", D27Z, D71Z (s/h) TO-226AE Radial Ammo Packaging Configuration: Figure 3.0 FIRST WIRE OFF IS COLLECTOR (ON PKG. 92) ADHESIVE TAPE IS ON THE TOP SIDE FLAT OF TRANSISTOR IS ON TOP FIRST WIRE OFF IS EMITTER (ON PKG. 92) ADHESIVE TAPE IS ON THE TOP SIDE FLAT OF TRANSISTOR IS ON BOTTOM ORDER STYLE D74Z (M) ORDER STYLE D75Z (P) FIRST WIRE OFF IS EMITTER ADHESIVE TAPE IS ON BOTTOM SIDE FLAT OF TRANSISTOR IS ON BOTTOM FIRST WIRE OFF IS COLLECTOR ADHESIVE TAPE IS ON BOTTOM SIDE FLAT OF TRANSISTOR IS ON TOP October 1999, Rev. A1 TO-226AE Tape and Reel Data and Package Dimensions, continued TO-226AE Tape and Reel Taping Dimension Configuration: Figur e 4.0 Hd P Pd b Hb H1 HO d L L1 W1 S WO W2 W t t1 P1 F1 P2 DO ITEM DESCRIPTION PO Base of Package to Lead Bend Component Height Lead Clinch Height Component B ase Height Component A lignment ( side/side ) Component A lignment ( front/back ) Component Pitch Feed Hole Pitch Hole Center to First Lead Hole Center to Component Center Lead Spread Lead Thickness Cut Lead Lengt h Taped Lead Lengt h Taped Lead Thic kness SYMBOL b Hb HO H1 Pd Hd P PO P1 P2 F1/F2 d L L1 t t1 W WO W1 W2 DO S DIMENSION 0.098 (max) 1.078 (+/- 0.050) 0.630 (+/- 0.020) 0.748 (+/- 0.020) 0.040 (max) 0.031 (max) 0.500 (+/- 0.020) 0.500 (+/- 0.008) 0.150 (+0.009, -0.010) 0.247 (+/- 0.007) 0.104 (+/- 0 .010) 0.018 (+0.002, -0.003) 0.429 (max) 0.209 (+0.051, -0.052) 0.032 (+/- 0.006) 0.021 (+/- 0.006) 0.708 (+0.020, -0.019) 0.236 (+/- 0.012) 0.035 (max) 0.360 (+/- 0.025) 0.157 (+0.008, -0.007) 0.004 (max) User Direction of Feed TO-226AE Reel Configuration: Figur e 5.0 Carrier Tape Thickness Carrier Tape Widt h Hold - down Tape Width Hold - down Tape position Feed Hole Position Sprocket Hole Diameter Lead Spring Out ELECT ROSTA TIC SEN SITIVE D EVICES Note : All dimens io ns are in in ches. D4 D1 ITEM DESCRIPTION SYMBOL MINIMUM MAXI MUM F63TNR Label Custom ized Label D2 Reel Diame ter Arbor Hole Diameter (Standard) (Small Hole) Core Diameter Hub Recess Inner Diameter Hub Recess Depth Flange to Flange Inner Width W1 Hub to Hub Cent er Widt h W3 Note: All dimensions are inches D1 D2 D2 D3 D4 W1 W2 W3 13.975 1.160 0.650 3.100 2.700 0.370 1.630 14.025 1.200 0.700 3.300 3.100 0.570 1.690 2.090 W2 D3 October 1999, Rev. A1 TO-226AE Tape and Reel Data and Package Dimensions, continued TO-226AE (FS PKG Code 95, 99) 1:1 Scale 1:1 on letter size paper Dimensions shown below are in: inches [millimeters] Part Weight per unit (gram): 0.300 S4.70- 4.32; S1.52- 1.02; 2 TYP S7.73- 7.10; 2 TYP S7.87- 7.37; S1.65- 1.27; 0.51 S0.76- 0.36; S15.61-14.47; S0.51- 0.36; S1.40- 1.14; S1.40- 1.14; PIN S0.48- 0.30; 99 E B C 95 E C B S4.45- 3.81; 1 5 TYP 1 2 3 2 3 TO-226AE (95,99) S2.41- 2.13; For leadformed option ordering, refer to Tape & Reel data information. October 1999, Rev. A1 TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM CoolFETTM CROSSVOLTTM E2CMOSTM FACTTM FACT Quiet SeriesTM FAST(R) FASTrTM GTOTM HiSeCTM DISCLAIMER ISOPLANARTM MICROWIRETM POPTM PowerTrench QFETTM QSTM Quiet SeriesTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogicTM UHCTM VCXTM FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Preliminary First Production No Identification Needed Full Production Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. D |
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