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Freescale Semiconductor Technical Data Document Number: MMG3003NT1 Rev. 4, 5/2006 Heterojunction Bipolar Transistor Technology (InGaP HBT) Broadband High Linearity Amplifier The MMG3003NT1 is a General Purpose Amplifier that is internally input matched and internally output prematched. It is designed for a broad range of Class A, small - signal, high linearity, general purpose applications. It is suitable for applications with frequencies from 40 to 3600 MHz such as Cellular, PCS, BWA, WLL, PHS, CATV, VHF, UHF, UMTS and general small - signal RF. Features * Frequency: 40 - 3600 MHz * P1dB: 24 dBm @ 900 MHz * Small - Signal Gain: 20 dB @ 900 MHz * Third Order Output Intercept Point: 40.5 dBm @ 900 MHz * Single Voltage Supply * Internally Matched to 50 Ohms * Low Cost SOT - 89 Surface Mount Package * RoHS Compliant * In Tape and Reel. T1 Suffix = 1000 Units per 12 mm, 7 inch Reel. MMG3003NT1 40 - 3600 MHz, 20 dB 24 dBm InGaP HBT 12 3 CASE 1514 - 01, STYLE 1 SOT - 89 PLASTIC Table 1. Typical Performance (1) Characteristic Small - Signal Gain (S21) Input Return Loss (S11) Output Return Loss (S22) Power Output @1dB Compression Third Order Output Intercept Point Symbol Gp IRL ORL P1db IP3 900 MHz 20 - 15 - 9.3 24 40.5 2140 MHz 16.9 - 14.1 -14.5 23.3 40 3500 MHz 12 - 11.2 - 10.2 20.5 37 Unit dB dB dB dBm dBm Table 2. Maximum Ratings Rating Supply Voltage Supply Current RF Input Power Storage Temperature Range Junction Temperature (3) (2) (2) Symbol VCC ICC Pin Tstg TJ Value 7 400 15 - 65 to +150 150 Unit V mA dBm C C 2. Voltage and current applied to device. 3. For reliable operation, the junction temperature should not exceed 150C. 1. VCC = 6.2 Vdc, TC = 25C, 50 ohm system Table 3. Thermal Characteristics (VCC = 6.2 Vdc, ICC = 180 mA, TC = 25C) Characteristic Thermal Resistance, Junction to Case Symbol RJC Value (4) 31.6 Unit C/W 4. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf. Select Documentation/Application Notes - AN1955. (c) Freescale Semiconductor, Inc., 2006. All rights reserved. MMG3003NT1 6-1 Freescale Semiconductor RF Product Device Data Table 4. Electrical Characteristics (VCC = 6.2 Vdc, 900 MHz, TC = 25C, 50 ohm system, in Freescale Application Circuit) Characteristic Small - Signal Gain (S21) Input Return Loss (S11) Output Return Loss (S22) Power Output @ 1dB Compression Third Order Output Intercept Point Noise Figure Supply Current (1) Supply Voltage (1) Symbol Gp IRL ORL P1dB IP3 NF ICC VCC Min 19.3 -- -- -- -- -- 160 -- Typ 20 - 15 - 9.3 24 40.5 4 180 6.2 Max -- -- -- -- -- -- 205 -- Unit dB dB dB dBm dBm dB mA V 1. For reliable operation, the junction temperature should not exceed 150C. MMG3003NT1 6-2 Freescale Semiconductor RF Product Device Data Table 5. Functional Pin Description Pin Number 1 2 3 RFin Ground RFout/DC Supply 1 2 3 Pin Function 2 Figure 1. Functional Diagram Table 6. ESD Protection Characteristics Test Conditions/Test Methodology Human Body Model (per JESD 22 - A114) Machine Model (per EIA/JESD 22 - A115) Charge Device Model (per JESD 22 - C101) Class 1B (Minimum) A (Minimum) IV (Minimum) Table 7. Moisture Sensitivity Level Test Methodology Per JESD 22 - A113, IPC/JEDEC J - STD - 020 Rating 1 Package Peak Temperature 260 Unit C MMG3003NT1 Freescale Semiconductor RF Product Device Data 6-3 50 OHM TYPICAL CHARACTERISTICS 25 TC = 85C Gp, SMALL-SIGNAL GAIN (dB) 25C 20 -40C S11, S22(dB) -10 S22 0 15 -20 S11 VCC = 6.2 Vdc VCC = 6.2 Vdc ICC = 180 mA 2 f, FREQUENCY (GHz) 3 4 10 0 1 2 f, FREQUENCY (GHz) 3 4 -30 0 1 Figure 2. Small - Signal Gain (S21) versus Frequency Figure 3. Input/Output Return Loss versus Frequency 23 P1dB, 1 dB COMPRESSION POINT (dBm) 21 Gp, SMALL-SIGNAL GAIN (dB) 19 17 15 13 11 9 5 10 15 Pout, OUTPUT POWER (dBm) 20 3500 MHz, C5 = 0.5 pF VCC = 6.2 Vdc ICC = 180 mA 25 1960 MHz, C5, C6 = 1.3 pF 2140 MHz, C5, C6 = 1.3 pF 2600 MHz, C5 = 1.2 pF 900 MHz, C5 = 2.7 pF 25 24 23 22 21 20 19 18 17 0.5 1 1.5 2 2.5 f, FREQUENCY (GHz) VCC =6.2 Vdc ICC = 180 mA 3 3.5 Figure 4. Small - Signal Gain versus Output Power IP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm) 200 ICC, COLLECTOR CURRENT (mA) 45 Figure 5. P1dB versus Frequency 42 150 39 100 36 VCC = 6.2 Vdc ICC = 180 mA 100 kHz Tone Spacing 0 1 2 f, FREQUENCY (GHz) 3 4 50 33 0 4 4.5 5 5.5 6 6.5 VCC, COLLECTOR VOLTAGE (V) 30 Figure 6. Collector Current versus Collector Voltage Figure 7. Third Order Output Intercept Point versus Frequency MMG3003NT1 6-4 Freescale Semiconductor RF Product Device Data 50 OHM TYPICAL CHARACTERISTICS IP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm) 45 IP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm) 42 42 39 41 36 40 VCC = 6.2 Vdc f = 900 MHz 100 kHz Tone Spacing 8 Vdc Supply with 10 W Dropping Resistor -20 0 20 40 60 80 100 33 f = 900 MHz 100 kHz Tone Spacing 30 5.8 6 6.2 6.4 6.6 VCC, COLLECTOR VOLTAGE (V) 39 -40 T, TEMPERATURE (_C) Figure 8. Third Order Output Intercept Point versus Collector Voltage Figure 9. Third Order Output Intercept Point versus Case Temperature -30 IMD, THIRD ORDER INTERMODULATION DISTORTION (dBc) 105 -40 MTTF (YEARS) VCC = 6.2 Vdc ICC = 180 mA f = 900 MHz 100 kHz Tone Spacing 103 12 15 18 21 24 120 125 130 135 140 145 150 Pout, OUTPUT POWER (dBm) TJ, JUNCTION TEMPERATURE (C) NOTE: The MTTF is calculated with VCC = 6.2 Vdc, ICC = 180 mA -50 104 -60 -70 -80 9 Figure 10. Third Order Intermodulation versus Output Power Figure 11. MTTF versus Junction Temperature -20 VCC = 6.2 Vdc ICC = 180 mA f = 2140 MHz C5 = 1.3 pF Single-Carrier W-CDMA, 3.84 MHz Channel Bandwidth PAR = 8.5 dB @ 0.01% Probability (CCDF) ACPR, ADJACENT CHANNEL POWER RATIO (dB) 4 8 -30 NF, NOISE FIGURE (dB) 6 -40 4 -50 2 VCC = 6.2 Vdc ICC = 180 mA 0 0 0.5 1 1.5 2 2.5 3 3.5 f, FREQUENCY (GHz) -60 -70 9 11 13 15 17 19 Pout, OUTPUT POWER (dBm) Figure 12. Noise Figure versus Frequency Figure 13. Single - Carrier W - CDMA Adjacent Channel Power Ratio versus Output Power MMG3003NT1 Freescale Semiconductor RF Product Device Data 6-5 50 OHM APPLICATION CIRCUIT: 40- 800 MHz VSUPPLY R1 C3 L1 RF INPUT DUT C4 Z1 C1 Z2 Z3 Z4 C2 Z5 C5 Z6 RF OUTPUT VCC Z5 Z6 PCB Z1 Z2 Z3 Z4 0.347 0.575 0.172 0.403 x 0.058 Microstrip x 0.058 Microstrip x 0.058 Microstrip x 0.058 Microstrip 0.286 x 0.058 Microstrip 0.061 x 0.058 Microstrip Getek Grade ML200C, 0.031, r = 4.1 Figure 14. 50 Ohm Test Circuit Schematic 30 S21 20 S21, S11, S22 (dB) 10 0 S22 -10 -20 -30 0 200 S11 400 f, FREQUENCY (MHz) C1 L1 C2 C5 VCC = 6.2 Vdc ICC = 180 mA 600 800 R1 C4 C3 MMG30XX Rev 2 Figure 15. S21, S11 and S22 versus Frequency Figure 16. 50 Ohm Test Circuit Component Layout Table 8. 50 Ohm Test Circuit Component Designations and Values Part C1, C2, C4 C3 C5 (1) L1 R1 Description 0.01 F Chip Capacitors 68 pF Chip Capacitor 2.7 pF Chip Capacitor for 40 - 800 MHz 470 nH Chip Inductor 7.5 W Chip Resistor Part Number 0603A103JAT2A 0805K680JBT 12105J2R7BBT BK2125HM471 RK73B2AT7R5J Manufacturer AVX AVX AVX Taiyo Uden KOA Speer 1. Tuning capacitor: Capacitor value and location on the transmission line are varied for different frequencies. Table 9. Supply Voltage versus R1 Values Supply Voltage R1 Value 7 4.4 8 10 9 15.6 10 21 11 27 12 32 V Note: To provide VCC = 6.2 Vdc and ICC = 180 mA at the device. MMG3003NT1 6-6 Freescale Semiconductor RF Product Device Data 50 OHM APPLICATION CIRCUIT: 800 - 1100 MHz VSUPPLY R1 C3 L1 RF INPUT DUT C4 Z1 C1 Z2 Z3 Z4 C5 Z5 C2 Z6 RF OUTPUT VCC Z4 Z5 PCB Z1, Z6 Z2 Z3 0.347 x 0.058 Microstrip 0.575 x 0.058 Microstrip 0.172 x 0.058 Microstrip 0.333 x 0.058 Microstrip 0.07 x 0.058 Microstrip Getek Grade ML200C, 0.031, r = 4.1 Figure 17. 50 Ohm Test Circuit Schematic 30 S21 20 10 S21, S11, S22 (dB) 0 S22 -10 -20 S11 -30 -40 600 VCC = 6.2 Vdc ICC = 180 mA 700 800 900 1000 1100 1200 MMG30XX Rev 2 C1 C5 L1 C2 R1 C4 C3 f, FREQUENCY (MHz) Figure 18. S21, S11 and S22 versus Frequency Figure 19. 50 Ohm Test Circuit Component Layout Table 10. 50 Ohm Test Circuit Component Designations and Values Part C1, C2 C3 C4 C5 (1) L1 R1 Description 47 pF Chip Capacitors 68 pF Chip Capacitor 0.01 F Chip Capacitor 2.7 pF Chip Capacitor for 800 - 1100 MHz 22 nH Chip Inductor 7.5 W Chip Resistor Part Number 0805K470JBT 0805K680JBT 0603A103JAT2A 06035J2R7BBT HK160822NJ - T RK73B2AT7R5J Manufacturer AVX AVX AVX AVX Taiyo Uden KOA Speer 1. Tuning capacitor: Capacitor value and location on the transmission line are varied for different frequencies. MMG3003NT1 Freescale Semiconductor RF Product Device Data 6-7 50 OHM APPLICATION CIRCUIT: 1800- 2400 MHz VSUPPLY R1 C3 L1 RF INPUT DUT C4 Z1 C1 Z1, Z7 Z2 Z3 Z4 Z2 Z3 Z4 C5 Z5 C6 Z6 C2 RF OUTPUT Z7 VCC 0.347 0.575 0.172 0.047 x 0.058 Microstrip x 0.058 Microstrip x 0.058 Microstrip x 0.058 Microstrip Z5 Z6 PCB 0.062 x 0.058 Microstrip 0.466 x 0.058 Microstrip Getek Grade ML200C, 0.031, r = 4.1 Figure 20. 50 Ohm Test Circuit Schematic 30 20 10 S21, S11, S22 (dB) 0 -10 -20 -30 -40 1600 1800 2000 2200 2400 2600 f, FREQUENCY (MHz) S11 C1 C5 C6 S22 VCC = 6.2 Vdc ICC = 180 mA MMG30XX Rev 2 L1 C2 S21 R1 C4 C3 Figure 21. S21, S11 and S22 versus Frequency Figure 22. 50 Ohm Test Circuit Component Layout Table 11. 50 Ohm Test Circuit Component Designations and Values Part C1, C2 C3 C4 C5 (1) C6 L1 R1 (1) Description 47 pF Chip Capacitors 68 pF Chip Capacitor 0.01 F Chip Capacitor 1.2 pF Chip Capacitor for 1800 - 2400 MHz 0.1 pF Chip Capacitor for 1800 - 2400 MHz 22 nH Chip Inductor 7.5 W Chip Resistor Part Number 0805K470JBT 0805K680JBT 0603A103JAT2A 06035J1R2BBT 06035J0R1BBT HK160822NJ - T RK73B2AT7R5J Manufacturer AVX AVX AVX AVX AVX Taiyo Uden KOA Speer 1. Tuning capacitor: Capacitor value and location on the transmission line are varied for different frequencies. MMG3003NT1 6-8 Freescale Semiconductor RF Product Device Data 50 OHM APPLICATION CIRCUIT: 2500 - 2700 MHz VSUPPLY R1 C3 L1 RF INPUT DUT C4 Z1 C1 Z2 Z3 C5 Z4 Z5 C2 Z6 RF OUTPUT VCC Z1, Z6 Z2 Z3 0.347 x 0.058 Microstrip 0.575 x 0.058 Microstrip 0.086 x 0.058 Microstrip Z4 Z5 PCB 0.085 x 0.058 Microstrip 0.404 x 0.058 Microstrip Getek Grade ML200C, 0.031, r = 4.1 Figure 23. 50 Ohm Test Circuit Schematic 30 20 S21, S11, S22 (dB) 10 0 S22 -10 -20 S11 -30 -40 2200 VCC = 6.2 Vdc ICC = 180 mA 2300 2400 2500 2600 2700 2800 MMG30XX Rev 2 C1 C5 C2 L1 S21 R1 C4 C3 f, FREQUENCY (MHz) Figure 24. S21, S11 and S22 versus Frequency Figure 25. 50 Ohm Test Circuit Component Layout Table 12. 50 Ohm Test Circuit Component Designations and Values Part C1, C2 C3 C4 C5 (1) L1 R1 Description 2.2 pF Chip Capacitors 68 pF Chip Capacitor 0.01 F Chip Capacitor 1.2 pF Chip Capacitor for 2500 - 2700 MHz 39 nH Chip Inductor 7.5 W Chip Resistor Part Number 0603A5J2R2BBT 0805K680JBT 0603A103JAT2A 06035J1R2BBT HK160839NJ - T RK73B2AT7R5J Manufacturer AVX AVX AVX AVX Taiyo Uden KOA Speer 1. Tuning capacitor: Capacitor value and location on the transmission line are varied for different frequencies. MMG3003NT1 Freescale Semiconductor RF Product Device Data 6-9 50 OHM APPLICATION CIRCUIT: 3400 - 3600 MHz VSUPPLY R1 C3 L1 RF INPUT DUT C4 Z1 C1 Z2 Z3 C5 Z4 Z5 C2 Z6 RF OUTPUT VCC Z1, Z6 Z2 Z3 0.347 x 0.058 Microstrip 0.575 x 0.058 Microstrip 0.086 x 0.058 Microstrip Z4 Z5 PCB 0.085 x 0.058 Microstrip 0.404 x 0.058 Microstrip Getek Grade ML200C, 0.031, r = 4.1 Figure 26. 50 OhmTest Circuit Schematic 20 15 S21, S11, S22 (dB) 10 5 0 C1 -5 -10 S11 -15 -20 3200 3300 3400 3500 3600 VCC = 6.2 Vdc ICC = 180 mA 3700 3800 MMG30XX Rev 2 S22 C5 L1 C2 S21 R1 C4 C3 f, FREQUENCY (MHz) Figure 27. S21, S11 and S22 versus Frequency Figure 28. 50 Ohm Test Circuit Component Layout Table 13. 50 OhmTest Circuit Component Designations and Values Part C1, C2 C3 C4 C5 (1) L1 R1 Description 2.2 pF Chip Capacitors 68 pF Chip Capacitor 0.01 F Chip Capacitor 0.5 pF Chip Capacitor for 3400 - 3600 MHz 39 nH Chip Inductor 7.5 W Chip Resistor Part Number 0603A5J2R2BBT 0805K680JBT 0603A103JAT2A 06035J0R5BBT HK160839NJ - T RK73B2AT7R5J Manufacturer AVX AVX AVX AVX Taiyo Uden KOA Speer 1. Tuning capacitor: Capacitor value and location on the transmission line are varied for different frequencies. MMG3003NT1 6 - 10 Freescale Semiconductor RF Product Device Data 50 OHM TYPICAL CHARACTERISTICS Table 14. Class A Common Emitter S - Parameters at VCC = 6.2 Vdc, ICC = 180 mA, TC = 255C f GHz 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.7 0.75 0.8 0.85 0.9 0.95 1 1.05 1.1 1.15 1.2 1.25 1.3 1.35 1.4 1.45 1.5 1.55 1.6 1.65 1.7 1.75 1.8 1.85 1.9 1.95 2 2.05 2.1 2.15 2.2 2.25 2.3 2.35 S11 |S11| 0.141 0.153 0.155 0.152 0.147 0.139 0.135 0.129 0.123 0.117 0.112 0.106 0.101 0.096 0.090 0.086 0.081 0.076 0.073 0.069 0.065 0.062 0.059 0.056 0.054 0.051 0.048 0.046 0.033 0.030 0.027 0.024 0.023 0.021 0.021 0.022 0.023 0.025 0.027 0.029 0.031 0.033 0.036 0.039 0.042 0.045 178.297 175.556 160.177 159.068 156.309 153.853 150.838 148.378 145.160 142.332 139.364 136.769 133.592 131.187 128.979 126.711 124.541 122.189 121.191 119.451 118.827 118.851 118.882 119.703 120.919 123.223 125.019 128.063 135.869 139.127 142.585 146.640 152.580 158.266 166.196 171.633 177.431 - 176.142 - 173.137 - 170.367 - 168.467 - 168.388 - 169.515 - 170.197 - 171.944 - 173.747 |S21| 12.985 12.654 13.067 12.851 12.685 12.519 12.327 12.124 11.915 11.694 11.470 11.238 11.004 10.770 10.532 10.298 10.066 9.841 9.611 9.393 9.170 8.957 8.742 8.541 8.340 8.143 7.957 7.774 7.640 7.475 7.322 7.170 7.040 6.890 6.756 6.621 6.495 6.371 6.251 6.135 6.025 5.921 5.815 5.716 5.618 5.525 S21 173.850 0 168.9 164.046 160.334 156.518 152.664 149.087 145.521 142.009 138.634 135.366 132.093 128.948 125.882 122.88 119.942 117.117 114.276 111.625 108.992 106.412 103.879 101.417 99.039 96.664 94.364 92.107 89.892 87.599 85.482 83.442 81.444 79.397 77.439 75.477 73.576 71.695 69.952 67.988 66.175 64.385 62.595 60.823 59.079 57.331 55.573 |S12| 0.057 0.057 0.059 0.058 0.058 0.058 0.057 0.057 0.057 0.057 0.057 0.057 0.057 0.057 0.056 0.056 0.056 0.056 0.056 0.056 0.056 0.056 0.056 0.056 0.056 0.056 0.056 0.056 0.057 0.057 0.057 0.057 0.058 0.058 0.058 0.058 0.058 0.059 0.059 0.059 0.060 0.060 0.060 0.061 0.061 0.061 S12 0.785 0 - 0.913 - 2.423 - 2.897 - 3.227 - 3.971 - 4.471 - 4.799 - 5.285 - 5.623 - 6.012 - 6.295 - 6.705 - 7.044 - 7.277 - 7.495 - 7.847 - 8.05 - 8.311 - 8.582 - 8.89 - 9.079 - 9.405 - 9.615 - 9.805 - 10.198 - 10.536 - 10.724 - 11.197 - 11.434 - 11.649 - 11.993 - 12.335 - 12.616 - 12.879 - 13.16 - 13.445 - 13.806 - 14.176 - 14.413 - 14.882 - 15.338 - 15.659 - 16.136 - 16.513 - 16.98 |S22| 0.087 0.136 0.125 0.159 0.187 0.212 0.239 0.263 0.285 0.306 0.326 0.345 0.362 0.378 0.394 0.408 0.422 0.435 0.447 0.458 0.470 0.480 0.490 0.498 0.507 0.515 0.522 0.530 0.529 0.536 0.541 0.546 0.552 0.555 0.560 0.563 0.566 0.570 0.573 0.577 0.580 0.583 0.586 0.589 0.591 0.593 S22 - 167.704 - 137.479 - 131.397 - 130.233 - 128.649 - 128.651 - 129.263 - 130.237 - 131.637 - 133.294 - 135.284 - 137.146 - 139.07 - 141.171 - 143.273 - 145.372 - 147.618 - 149.849 - 151.947 - 154.142 - 156.289 - 158.481 - 160.544 - 162.608 - 164.561 - 166.501 - 168.351 - 170.229 - 172.918 - 174.487 - 175.93 - 177.394 - 179.018 179.899 178.582 177.318 176.139 175.08 173.812 172.704 171.566 170.426 169.283 168.164 167.003 165.803 MMG3003NT1 Freescale Semiconductor RF Product Device Data 6 - 11 Table 14. Class A Common Emitter S - Parameters at VCC = 6.2 Vdc, ICC = 180 mA, TC = 255C (continued) f GHz 2.4 2.45 2.5 2.55 2.6 2.65 2.7 2.75 2.8 2.85 2.9 2.95 3 3.05 3.1 3.15 3.2 3.25 3.3 3.35 3.4 3.45 3.5 3.55 3.6 S11 |S11| 0.048 0.052 0.056 0.060 0.063 0.067 0.071 0.074 0.079 0.083 0.087 0.091 0.095 0.099 0.103 0.107 0.110 0.114 0.117 0.119 0.122 0.126 0.12826 0.13168 0.13497 - 175.268 - 177.409 - 178.703 179.650 177.705 175.894 174.932 172.453 170.595 168.962 167.373 165.543 164.513 163.309 162.077 161.249 160.222 159.057 158.018 156.94 155.757 154.754 153.898 152.875 152.157 |S21| 5.431 5.345 5.258 5.173 5.096 5.015 4.938 4.861 4.788 4.715 4.643 4.573 4.506 4.438 4.373 4.308 4.244 4.182 4.121 4.061 4.004 3.949 3.895 3.84045 3.78882 S21 53.848 52.136 50.405 48.736 47.012 45.266 43.452 41.831 40.113 38.402 36.711 35.036 33.356 31.684 29.98 28.307 26.653 25.007 23.381 21.791 20.196 18.618 17.049 15.491 13.97 |S12| 0.062 0.062 0.062 0.063 0.063 0.063 0.064 0.064 0.065 0.065 0.065 0.066 0.066 0.066 0.067 0.067 0.067 0.068 0.068 0.068 0.069 0.069 0.06938 0.06971 0.07016 S12 - 17.435 - 17.955 - 18.404 - 19.004 - 19.505 - 20.1 - 20.75 - 21.297 - 21.999 - 22.577 - 23.239 - 23.942 - 24.652 - 25.269 - 26.085 - 26.717 - 27.483 - 28.223 - 29.013 - 29.779 - 30.535 - 31.29 - 31.957 - 32.814 - 33.474 |S22| 0.595 0.597 0.598 0.600 0.602 0.603 0.605 0.607 0.609 0.610 0.612 0.614 0.616 0.618 0.620 0.622 0.624 0.626 0.629 0.631 0.633 0.635 0.6367 0.6392 0.64031 S22 164.669 163.447 162.182 160.854 159.516 158.1 156.649 155.174 153.675 152.104 150.539 148.941 147.251 145.747 144.105 142.483 140.894 139.31 137.737 136.267 134.76 6 131.951 130.655 129.412 MMG3003NT1 6 - 12 Freescale Semiconductor RF Product Device Data 1.7 7.62 0.305 diameter 3.48 5.33 1.27 1.27 0.86 0.64 3.86 0.58 2.49 2.54 Recommended Solder Stencil NOTES: 1. THERMAL AND RF GROUNDING CONSIDERATIONS SHOULD BE USED IN PCB LAYOUT DESIGN. 2. DEPENDING ON PCB DESIGN RULES, AS MANY VIAS AS POSSIBLE SHOULD BE PLACED ON THE LANDING PATTERN. 3. IF VIAS CANNOT BE PLACED ON THE LANDING PATTERN, THEN AS MANY VIAS AS POSSIBLE SHOULD BE PLACED AS CLOSE TO THE LANDING PATTERN AS POSSIBLE FOR OPTIMAL THERMAL AND RF PERFORMANCE. 4. RECOMMENDED VIA PATTERN SHOWN HAS 0.381 x 0.762 MM PITCH. Figure 29. Recommended Mounting Configuration MMG3003NT1 Freescale Semiconductor RF Product Device Data 6 - 13 NOTES MMG3003NT1 6 - 14 Freescale Semiconductor RF Product Device Data PACKAGE DIMENSIONS 3 A 4 4.70 4.40 1.87 1.79 0.15 M C A B B 0.60 0.40 2X R0.15 TYP 1.70 1.40 3 4 2.70 2.40 4.50 3.70 2X 4 TYP 1.30 0.70 5 0.48 0.38 1 2 3 2X 0.20 M C B 0.48 0.38 0.58 0.48 0.15 M C A B 0.15 M C A B 0.46 0.40 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. ALL DIMENSIONS ARE IN MILLIMETERS. 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.5MM PER END. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.5MM PER SIDE. 4. DIMENSIONS ARE DETERMINED AT THE OUTMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 2X 4 TYP E.P. 2X R0.20 4X 0.10 C SEATING PLANE 1.50 1.50 1.65 1.55 C 0.65 0.55 1.35 1.25 STYLE 1: PIN 1. RF INPUT 2. GROUND 3. RF OUTPUT CASE 1514 - 01 ISSUE C SOT - 89 PLASTIC BOTTOM VIEW MMG3003NT1 Freescale Semiconductor RF Product Device Data 6 - 15 How to Reach Us: Home Page: www.freescale.com E - mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1 - 800 - 521 - 6274 or +1 - 480 - 768 - 2130 support@freescale.com Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) support@freescale.com Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1 - 8 - 1, Shimo - Meguro, Meguro - ku, Tokyo 153 - 0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1 - 800 - 441 - 2447 or 303 - 675 - 2140 Fax: 303 - 675 - 2150 LDCForFreescaleSemiconductor@hibbertgroup.com Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals", must be validated for each customer application by customer's technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescalet and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. (c) Freescale Semiconductor, Inc. 2006. All rights reserved. MMG3003NT1 Rev. 4, 6 - 16 5/2006 Document Number: MMG3003NT1 Freescale Semiconductor RF Product Device Data |
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