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ELEC-XROMC COMI'ONEXTS GROUP SW CORPORATION
f
\ DEVICE SPECIFICATION FOR
Light Emitting Diode
MODEL No.
1
LTlF67AF
/
1. These specification sheetsinclude materials protected under the copyrjght of Sharp Corporation ("Sharp"). Please do not reproduce or causeanyone to reproduce them without S*.. consent 2. When using this product, please 0bsen.e the absolute maximum ratin&!q.nd the instructions for use outlined in these specification sheets,as well as the precautions mentioned bei@%.Sharp assumesno responsibility for any damage resulting from use of the product which does not c&r+& the absolute maximum ratings tith and the instructions inchrded in these specification sheets,and the precautions mentioned below. .Ii:. ) (Precautions) (1) This products is designed for use in the foUowtig application areas; * OA equipment * Audio visual equipment * Home tippliance * Telecommunication equipment (Terminal) * Measur@g.equipment 3 * Tooling machines * Computers I [ If the use of the product in the above application areas is for equipment listed in paragraphs . (2) or (3), please be sure to observethe precautions given ixi those respective paragraphs. (2) Appropriate measures, such as fail-safe design and redundant design considering the safec design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which d&$nds high reliability and safety in function and precision, such as ; * Transportation control and safety equipment (aircraft, t@n, automobile etc.) * Traffic signals * Gas leakage sensorbreakers * R@ue and security equipment * Other safetyequipment L I (3) Please do not use this product for equipment which require extremely high reliability and safety in fnnction and precision, such as ; * Space equipment * Tekcommunication equipment (for trunk lines) + Nuclear power control equipment * Medical equipment C 1 (4) Please contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. Please contact and consult with a Sharp sales representative for any questions about this product. DATE: PRESENTED BY:
hp. & I t?b
.
CUSTOMER'S APPROVAL DATE: BY:
Department General Manager of Enginewing Dept.,BI Opto-Electronic Devices Division Electronic Components Group SHARP CORPORATION
:
This data sheet is to introduce Model No. LTlF61.G. delivered
the light
to
emitting
diode device'
l.Structure and characteristics Structure: CaP gellorgreen chip LED device Outline dimensions and pin connections: Taping specification: Packing specification: Soldering method:
See See See See
page page page page
2 3456 7 8
@ate l.)Duty ratio=l/lO,
Pulse width*.
lm~
(Note 2)Tore!ance: 4. Luminous intensity
415% rank . (Ta=25"C) Condition
c H I J K L
19.7 22.1 24.7 27.7 31.0 34.7
-
24. 0 26. 9 30. I 33.7 . 37. 0 42. 4
mcd
IF=201n4
Cvote 3)Measured
t.olerance; f 15? by SH.UP EC&C ~lODEL660 (RadiometeriPhotometersystem)
1. Plated. area j!:.;
ReqJ
area
M bxq
2. Pin Conection
0 Cathode
@
Anode
0-0
3. Unspecified tel. to be iO.1
Outline terminal
dimensions
connections
and
1.
This
&tO
0h~t
10
to
i*troduor
thr
lapin*
sodi,i,fi~mlioO
.Of
LJ!U
* dcrlcc.
lode1 Ho. LmwAF rptciflc2tioo .
2
2. I
taping spcciflcatlaa
tapiag
2.2
Shipment
table TABLE
/-Hodel number
`SHIPMENT
PA-IT NO.
QUANTITY
-Quantity
Lot amber*
of prodqcts
: noi3[1oaaa -m --v @ 0 `0 @8
LOT No.
SHARP
UADC IN JAI.4.Y
-
Luminous intensity
rank
. *:Lo e indication
0 Production plant code(to be indicated alphabetically)
$3 Production Lot(singie or double figures) 3 Year of producrion(che last tuo figures of the year) 8 Konch of production (to be indicated alphabetically with January corresponding
d Date of production(Ol-31)
to A)
2.3
Rcl+tcd l ttcrs 2.3.1. Packing
There should not be missing'rbova
continuous peel iag: F=
tbrte 0.1-O. 8N
products. (I=lO*
or Ied)
2.3.2.
true strength 1)Cover'trpe
strength
against
Forward 2) Tape strength against
The radius
+--
Cdneir bending
should
tape
of bending circ!e If it .is less than 30aa.`the
out of
be 30~ or aore. cover tape may psi.
2.3.3.
Taking
products rt txeling.
tape.
11 Products 2) Products 2.3.4.. Jointing
There should
should be easily taken out. should not be attached to the eover'taph
not
of true be joint
of cover tape or csrrier
3: @anti
tp per reel Average: 4.000 pcs. per reel
4-1. Taping 4-1-I. Shape and diwnsion of tape(TYP. >
.
r3- \/I
Parameter ~ysbol~imens
:
P2
'
PI
-I
Benarks
iod
Concave square
hole lot part iasertion Round sprocket hole cer dimension Cover Carrier kickness unit 3 i-taterial
cape tape
`fere icai
Horitoatal Pitch Diameter
A
B pi Da
PO
1 1.1)am Dimeasioq excludes cocaes R I 1.9mm at inside bottom
1 4. Omm 1. sala
4.Omn
..
_
Pitch
Position Vert.dire Hori .dire Wid:h Thickness
Uidch
Center Co ten-
E P2 F ( W, 1 t3
1 wo
AccumuLa{:ed error i0.5mm/lO pitch 1.75mm DistaaciI:becueen tape edge and hole center Ceacer Line of the concave square hole and 2.omm
3.5ms
round
sprocket
hole
5.5mm
1
.
0. lnm [
8. Omm ) 0.2mm 1
of
the
Thickness entire
1 cl
Carrier
to cape . ..PET.
1.2IIFA
Cover
With cover tape...Polyescer
tape
and carrier
tape combined
1
X--I
a-l-2.Shapc
and dimensian of reel (TYP. )
Parameter Flange
Hub
Diameter Thickness Inner space direccioa External diameter Spindle bale diameter Key slit Width
Degch
1 Symbol } Dimension )' &e@rks 9178mm IA l.Smm Ic 1W Diqension 1anlm
E )6Qmm +13fUlQ
of shaft
core
C
1
1
E
U
1
2.0mm
4.5mm
Notation 3 Hatcrial:
for part came etc. Reel.. .Polystyrene
I Labeling on one side of f Lange. 1 (Part name.quantity,loc No.)
Packing
Specification
In order to avoid the absorption of humidity in transport .a& storage, the~devices are
psdtcd in alusim0 skve.
4
1. Storage Conditions The storage should lx done under follaaing Temperature . 5 to 3oc less than 6OUl-l Humidity 2. Treatment after Opening 1) Please makea soldering within 2 days after opening under following conditions: Temperature 5 to 3OC less than 60;YRH Humidity 2) In case the devices are not used for a long time after opening, the storage in dq box is recommendable.Or it is better to repack the devices with a desiccative by the sealer and put them in the samestorage conditions as 6-I. Then they should be used rithin 2
W?XkS.
conditions:
.-
3) Please makea soldering after a following baking treatment if unused term should be over the amditions of 2). Remmendable Gmdi tions: (TJ in taping Tesprature 60t Time 90 to 100 Hours @ in individual ( on PIB or metallic tray > Temperature 11OC Time 3 to 4 Nours
M aunt ing precautions 1. Soldering
l-1
Xeflow
soldering To be doae'undet
the following
conditiqa.
UN. EOse c P3(
ux. 5'5ec
Recommendable T hermal M ode1
1-2 Reflow soldering precautions Second time soldering shoufd be done witin 8 ham after the first one is l%shcd (Storage condition:at30C,RH(60%)
I
2. Soldering iron method At 3OOCwithln r seconds When using a soldering (Pay attion not to iran.care must be taken not to damage the package altou any undue stress or heat on package.)
1
Z X-l
LT1F67AF

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