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H11AA814 Series, H11A617 Series, H11A817 Series 4-Pin Phototransistor Optocouplers
July 2006
H11AA814 Series, H11A617 Series, H11A817 Series 4-Pin Phototransistor Optocouplers
Features
AC input response (H11AA814 only) Compatible to Pb-free IR reflow soldering Compact 4-pin dual in-line package Current transfer ratio in selected groups:
tm
Applications
H11AA814 Series AC line monitor Unknown polarity DC sensor Telephone line interface H11A617 and H11A817 Series
Power supply regulators Digital logic inputs Microprocessor inputs
H11AA814: 20-300% H11A817: 50-600% H11AA814A: 50-150% H11A817A: 80-160% H11A617A: 40%-80% H11A817B: 130-260% H11A617B: 63%-125% H11A817C: 200-400% H11A617C: 100%-200% H11A817D: 300-600% H11A617D: 160%-320% C-UL, UL and VDE approved High input-output isolation voltage of 5000Vrms Minimum BVCEO of 70V guaranteed
Description
The H11AA814 consists of two gallium arsenide infrared emitting diodes, connected in inverse parallel, driving a silicon phototransistor output in a 4-pin dual in-line package. The H11A617/817 Series consists of a gallium arsenide infrared emitting diode driving a silicon phototransistor in a 4-pin dual in-line package.
Package
Schematics
H11AA814
4
ANODE, CATHODE 1
4 COLLECTOR
1
CATHODE, ANODE 2
3 EMITTER
H11A617 & H11A817
ANODE 1
4 COLLECTOR
CATHODE 2
3 EMITTER
(c)2005 Fairchild Semiconductor Corporation
1
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H11AA814 Series, H11A617 Series, H11A817 Series Rev. 1.0.8
H11AA814 Series, H11A617 Series, H11A817 Series 4-Pin Phototransistor Optocouplers
Absolute Maximum Ratings (TA = 25C Unless otherwise specified.)
Symbol
TOTAL DEVICE TSTG TOPR TSOL PD EMITTER IF VR PD DETECTOR VCEO VECO IC PD Collector-Emitter Voltage Emitter-Collector Voltage Continuous Collector Current Detector Power Dissipation (25C ambient) Derate above 90C All 814, 817 Series 617 Series All All 70 6 7 50 150 2.9 V V mA mW mW/C Continuous Forward Current Reverse Voltage LED Power Dissipation (25C ambient) No derating up to 100C 814 Series 617, 817 Series
617 Series 817 Series
Parameter
Storage Temperature Operating Temperature Lead Solder Temperature Total Device Power Dissipation (-55C to 50C)
Device*
All All All All
Value
-55 to +150 -55 to +100 260 for 10 sec 200 50 50 6 6 70
Units
C C C mW mA V mW
All
Electrical Characteristics (TA = 25C Unless otherwise specified.) Individual Component Characteristics
Symbol Parameter
EMITTER VF Input Forward Voltage IF = 60mA IF = 20mA IF = 20mA IR Reverse Leakage Current VR = 6.0V VR = 5.0V IC = 0.1 mA, IF = 0 IE = 10 A, IF = 0 VCE = 10V, IF = 0 617 Series 817 Series 814 Series 617 Series 817 Series ALL 814, 817 Series 617 Series H11AA814/A, 817 Series, H11A617C/D H11A617A/B 70 6 7 100 10 10 1 100 50 nA V V 1.35 1.2 1.2 .001 1.65 1.5 1.5 10 A V
Test Conditions
Device
Min. Typ.*
Max.
Unit
DETECTOR BVCEO BVECO ICEO Collector-Emitter Breakdown Voltage Emitter-Collector Breakdown Voltage Collector-Emitter Dark Current
*Typical values at TA=25C
2 H11AA814 Series, H11A617 Series, H11A817 Series Rev. 1.0.8
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H11AA814 Series, H11A617 Series, H11A817 Series 4-Pin Phototransistor Optocouplers
Transfer Characteristics (TA = 25C Unless otherwise specified.)
Symbol DC Characteristic
CTR Current Transfer Ratio
Test Conditions
IF = 1mA, VCE = IF = 1mA, VCE = 5V(1) 5V(1) 5V(1)
Device
H11AA814 H11AA814A H11A617A H11A617B H11A617C H11A617D
Min Typ* Max Unit
20 50 40 63 100 160 50 80 130 200 300 13 22 34 56 0.2 0.4 0.2 4 3 18 18 s s 300 150 80 125 200 320 600 160 260 400 600 % % % % % % % % % % % % % % % V
(IF = 10mA, VCE =
(IF = 5mA, VCE =
5V(1)
H11A817 H11A817A H11A817B H11A817C H11A817D
IF = 1mA, VCE = 5V(1)
H11A617A H11A617B H11A617C H11A617D
VCE (SAT) Collector-Emitter Saturation Voltage
IC = 1mA, IF = 20mA IC = 2.5mA, IF = 10mA IC = 1mA, IF = 20mA
814 series 617 series 817 series ALL ALL
AC CHARACTERISTIC tr tf Rise Time Fall Time IC = 2mA, VCE = 2 V, RL = 100(2) IC = 2mA, VCE = 2 V, RL = 100(2)
Isolation Characteristics
Symbol
VISO RISO CISO
Characteristic
Input-Output Isolation Voltage (note 3) Isolation Resistance Isolation Capacitance
Test Conditions
(f = 60Hz, t = 1 min) (II-O 2A) (VI-O = 500 VDC) (VI-O = 0, f = 1 MHz)
Min.
5000 5x1010
Typ.*
Max.
Units
Vac(rms)
1011 0.6 1.0
pf
*Typical values at TA = 25C.
Notes: 1. Current Transfer Ratio (CTR) = IC/IF x 100%. 2. For test circuit setup and waveforms, refer to Figure 13. 3. For this test, Pins 1 and 2 are common, and Pins 3 and 4 are common.
3 H11AA814 Series, H11A617 Series, H11A817 Series Rev. 1.0.8
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H11AA814 Series, H11A617 Series, H11A817 Series 4-Pin Phototransistor Optocouplers
Typical Performance Curves
Fig. 1 Current Transfer Ratio vs. Forward Current
200 160 VCE = 5V Ta = 25C H11AA814 140 IF = 1mA VCE = 5V
Fig. 2. Relative Current Transfer Ratio vs. Ambient Temperature
CURRENT TRANSFER RATIO CTR ( %)
180 160 140 120 100 80 60 40 20 0 1 2 5 10 20 814 617 817
RELATIVE CURRENT TRANSFER RATIO (%)
120
100 80 60 40 20 0 -60 IF = 5mA VCE = 5V H11AA617 & H11AA817
50
-40
-20
0
20
40
60
80
100
FORWARD CURRENT IF (mA)
AMBIENT TEMPERATURE TA (C)
Fig. 4 Forward Current vs. Forward Voltage
100
Fig. 3 Collector-Emitter Saturation Voltage vs. Ambient Temperature
0.12
IF = 20 mA IC = 1 mA
VCE (SAT) - COLLECTOR-EMITTER SATURATION VOLTAGE (V)
FORWARD CURRENT IF (mA)
0.10
TA = 100C 75C
0.08
10
50C
0.06
25C 0C -30C
0.04
1
-55C
0.02
0.00 -60 -40 -20 0 20 40 60 80 100
0.1 0.5 1.0 1.5 2.0
TA - AMBIENT TEMPERATURE (C)
Fig. 5 Collector Current vs. Collector-Emitter Voltage (H11AA814)
50
FORWARD VOLTAGE VF (V)
Fig. 6 Collector Current vs. Collector-Emitter Voltage (H11AA617 and H11AA817)
30
Ta = 25C
I
COLLECTOR CURRENT IC (mA)
25
IF = 30mA 20mA
Ta = 25C
COLLECTOR CURRENT IC (mA)
I F = 30 m A
40
Pc(MAX.) 20
20mA
30
Pc (Max)
15 10 mA 10 5m A 5
10mA
20
5mA
10
1mA
0
0 0 10 20 30 40 50 60 70 80 90 100 0 1 2 3 4 5 6 7 8 9
COLLECTOR-EMITTER VOLTAGE VCE (V) COLLECTOR-EMITTER VOLTAGE VCE (V)
4 H11AA814 Series, H11A617 Series, H11A817 Series Rev. 1.0.8
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H11AA814 Series, H11A617 Series, H11A817 Series 4-Pin Phototransistor Optocouplers
Typical Performance Curves (Continued)
Fig. 7 Collector Dark Current vs Ambient Temperature
10000 500
V
CE
Fig. 8 Response Time vs. Load Resistance
VCE = 2V 200 100 IC = 2mA Ta = 25C
COLLECTOR DARK CURRENT ICEO (nA)
= 20V
1000
RESPONSE TIME (ms)
100
50 20 10 5 2 1 0.5 ts
tr tf td
10
1
0.1
0.01 -60
-40
-20
0
20
40
60
80
100
0.2 0.05
0.1
0.2
0.5
1
2
5
10
AMBIENT TEMPERATURE TA (C)
LOAD RESISTANCE RL (kW)
Fig. 9. Frequency Response (H11AA814)
VCE = 2V IC = 2mA Ta = 25C 0
Fig. 10. Frequency Response (H11AA617 and H11AA817)
VCE = 2V IC = 2mA 0 Ta = 25C
VOLTAGE GAIN AV (dB)
VOLTAGE GAIN AV (dB)
10 RL=10k 1k 100
RL= 10k -10
1k
100
20
-20 0.2
0.5
15
2
10
100
1000
0.5
1
2
5
10
20
50 100
500
FREQUENCY f (kHz)
Fig. 11. LED Power Dissipation vs. Ambient Temperature
FREQUENCY f (kHz)
Fig. 12. Collector Power Dissipation vs. Ambient Temperature
COLLECTOR POWER DISSIPATION PC (mW)
200
100
LED POWER DISSIPATION PLED (mW)
80
150
60
100
40
50
20
0 -55
-40
-20
0
20
40
60
80
100
120
0 -55
-40
-20
0
20
40
60
80
100
120
AMBIENT TEMPERATURE TA (C)
AMBIENT TEMPERATURE TA (C)
5 H11AA814 Series, H11A617 Series, H11A817 Series Rev. 1.0.8
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H11AA814 Series, H11A617 Series, H11A817 Series 4-Pin Phototransistor Optocouplers
Test Circuit
Figure 13. Test Circuit
Test Circuit for Response Time
Vcc Input RD RL Input Output Output
10% 90%
td tr
ts tf
Test Circuit for Frequency Response
Vcc RD RL Output
6 H11AA814 Series, H11A617 Series, H11A817 Series Rev. 1.0.8
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H11AA814 Series, H11A617 Series, H11A817 Series 4-Pin Phototransistor Optocouplers
Package Dimensions
Through Hole
0.312 (7.92) 0.288 (7.32)
Surface Mount
SEATING PLANE
0.157 (4.00) 0.118 (3.00)
SEATING PLANE
0.200 (5.10) 0.161 (4.10)
0.276 (7.00) 0.236 (6.00)
0.200 (5.10) 0.161 (4.10)
0.312 (7.92) 0.288 (7.32) 0.276 (7.00) 0.236 (6.00)
0.157 (4.00) 0.118 (3.00) 0.010 (0.26)
0.130 (3.30) 0.091 (2.30)
0.020 (0.51) TYP
0.051 (1.30) 0.043 (1.10)
0.024 (0.60) 0.004 (0.10)
0.049 (1.25) 0.030 (0.76) 0.412 (10.46) 0.388 (9.86)
0.150 (3.80) 0.110 (2.80) 0.024 (0.60) 0.016 (0.40)
0.010 (0.26) 0.300 (7.62) typ
0.110 (2.79) 0.090 (2.29) Lead Coplanarity 0.004 (0.10) MAX
0.110 (2.79) 0.090 (2.29)
0.4" Lead Spacing
0.312 (7.92) 0.288 (7.32) 0.157 (4.00) 0.118 (3.00) 0.276 (7.00) 0.236 (6.00)
Footprint Dimensions (Surface Mount)
SEATING PLANE
0.200 (5.10) 0.161 (4.10)
Footprint Dimensions (Surface Mount) 1.5
1.3
0.130 (3.30) 0.091 (2.30) 0.150 (3.80) 0.110 (2.80) 0.024 (0.60) 0.016 (0.40) 0.110 (2.79) 0.090 (2.29) 0.42 (10.66) 0.38 (9.66) 0.110 (2.80) 0.011 (1.80)
0.291 (7.40) 0.252 (6.40)
9
0.010 (0.26)
2.54
Note: All dimensions are in inches (millimeters)
7 H11AA814 Series, H11A617 Series, H11A817 Series Rev. 1.0.8
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H11AA814 Series, H11A617 Series, H11A817 Series 4-Pin Phototransistor Optocouplers
Ordering Information
Part Number Example
H11AA814S H11AA814SD H11AA814W H11AA814300 H11AA814300W H11AA8143S H11AA8143SD
Description
Surface Mount Lead Bend Surface Mount; Tape and reel 0.4" Lead Spacing VDE Approved VDE Approved, 0.4" Lead Spacing VDE Approved, Surface Mount VDE Approved, Surface Mount, Tape & Reel
*To specify the new construction version which needs 260C max reflow peak temperature rating: add "NF098" to the end of the part number. The non-NF098 version is rated for 260C peak reflow temperature only for parts marked with date code 0550 and later.
Marking Information
4 5
V X ZZ Y
3
6
814
1
2
Definitions
1 2 3 4 5 6 Fairchild logo Device number VDE mark (Note: Only appears on parts ordered with VDE option - See order entry table) One digit year code Two digit work week ranging from `01' to `53' Assembly package code
8 H11AA814 Series, H11A617 Series, H11A817 Series Rev. 1.0.8
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H11AA814 Series, H11A617 Series, H11A817 Series 4-Pin Phototransistor Optocouplers
Carrier Tape Specifications
O1.550.05 P2 P0 1.750.1
F W B0 A0 P1 0.30.05
K0
Note: All dimensions are in millimeters
Description
Tape wide Pitch of sprocket holes Distance of compartment Distance of compartment to compartment Compartment
Symbol
W P0 F P2 P1 A0 B0 K0
Dimensions in mm (inches)
16 0.3 (.63) 4 0.1 (.15) 7.5 0.1 (.295) 2 0.1 (.079) 12 0.1 (.472) 10.45 0.1 (.411) 5.30 0.1 (.209) 4.25 0.1 (.167)
9 H11AA814 Series, H11A617 Series, H11A817 Series Rev. 1.0.8
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H11AA814 Series, H11A617 Series, H11A817 Series 4-Pin Phototransistor Optocouplers
Lead Free Recommended IR Reflow Condition
Tp
Temperature (C)
Tsmax
Ramp-down
Tsmin
25C ts (Preheat) Time (sec)
Profile Feature
Preheat condition (Tsmin-Tsmax / ts) Melt soldering zone Peak temperature (Tp) Ramp-down rate
Soldering zon
Pb-Sn solder assembly
100C ~ 150C 60 ~ 120 sec 183C 60 ~ 120 sec 240 +0/-5C 6C/sec max.
Lead Free assembly
150C ~ 200C 60 ~120 sec 217C 30 ~ 90 sec 260 +0/-5C 6C/sec max.
Recommended Wave Soldering condition
Profile Feature
Peak temperature (Tp)
For all solder assembly
Max 260C for 10 sec
10 H11AA814 Series, H11A617 Series, H11A817 Series Rev. 1.0.8
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H11AA814 Series, H11A617 Series, H11A817 Series 4-Pin Phototransistor Optocouplers
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. FACT Quiet SeriesTM GlobalOptoisolatorTM GTOTM HiSeCTM I2CTM i-LoTM ImpliedDisconnectTM IntelliMAXTM ISOPLANARTM LittleFETTM MICROCOUPLERTM MicroFETTM MicroPakTM MICROWIRETM MSXTM MSXProTM Across the board. Around the world.TM The Power Franchise(R) Programmable Active DroopTM DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD'S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
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LIFE SUPPORT POLICY
FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS Definition of Terms
Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. I20
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
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