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GTL2008; GTL2107
12-bit GTL to LVTTL translator with power good control and high-impedance LVTTL and GTL outputs
Rev. 02 -- 26 September 2006 Product data sheet
1. General description
The GTL2008/GTL2107 is a customized translator between dual Xeon processors, Platform Health Management, South Bridge and Power Supply LVTTL and GTL signals. Functionally and footprint identical to the GTL2007, the GTL2008/GTL2107 LVTTL and GTL outputs were changed to put them into a high-impedance state when EN1 and EN2 are LOW, with the exception of 11BO because its normal state is LOW, so it is forced LOW. EN1 and EN2 will remain LOW until VCC is at normal voltage, the other inputs are in valid states and VREF is at its proper voltage to assure that the outputs will remain high-impedance through power-up. Both the GTL2008/GTL2107 and the GTL2007 are derived from the GTL2006. They add an enable function that disables the error output to the monitoring agent for platforms that monitor the individual error conditions from each processor. This enable function can be used so that false error conditions are not passed to the monitoring agent when the system is unexpectedly powered down. This unexpected power-down could be from a power supply overload, a CPU thermal trip, or some other event of which the monitoring agent is unaware. A typical implementation would be to connect each enable line to the system power good signal or the individual enables to the VRD power good for each processor. Typically Xeon processors specify a VTT of 1.1 V to 1.2 V, as well as a nominal Vref of 0.73 V to 0.76 V. To allow for future voltage level changes that may extend Vref to 0.63 of VTT (minimum of 0.693 V with VTT of 1.1 V) the GTL2008/GTL2107 allows a minimum Vref of 0.66 V. Characterization results show that there is little DC or AC performance variation between these levels. The GTL2008 is the companion chip to the GTL2009 3-bit GTL Front-Side Bus frequency comparator that is used in dual-processor Xeon applications. The GTL2107 is the Intel designation for the GTL2008.
2. Features
I Operates as a GTL to LVTTL sampling receiver or LVTTL to GTL driver I EN1 and EN2 disable error output I All LVTTL and GTL outputs are put in a high-impedance state when EN1 and EN2 are LOW I 3.0 V to 3.6 V operation I LVTTL I/O not 5 V tolerant
Philips Semiconductors
GTL2008; GTL2107
GTL translator with power good control and high-impedance outputs
I Series termination on the LVTTL outputs of 30 I ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per JESD22-A115, and 1000 V CDM per JESD22-C101 I Latch-up testing is done to JEDEC Standard JESD78 Class II, Level A which exceeds 500 mA I Package offered: TSSOP28
3. Quick reference data
Table 1. Quick reference data Tamb = 25 C Symbol Cio Parameter input/output capacitance Conditions A port; VO = 3.0 V or 0 V B port; VO = VTT or 0 V Vref = 0.73 V; VTT = 1.1 V tPLH LOW-to-HIGH propagation delay HIGH-to-LOW propagation delay nA to nBI; see Figure 4 nBI to nA or nAO (open-drain outputs); see Figure 14 nA to nBI; see Figure 4 nBI to nA or nAO (open-drain outputs); see Figure 14 nA to nBI; see Figure 4 nBI to nA or nAO (open-drain outputs); see Figure 14 nA to nBI; see Figure 4 nBI to nA or nAO (open-drain outputs); see Figure 14 1 2 2 2 4 13 5.5 4 8 18 10 10 ns ns ns ns Min Typ 2.5 1.5 Max 3.5 2.5 Unit pF pF
tPHL
Vref = 0.76 V; VTT = 1.2 V tPLH LOW-to-HIGH propagation delay HIGH-to-LOW propagation delay 1 2 2 2 4 13 5.5 4 8 18 10 10 ns ns ns ns
tPHL
4. Ordering information
Table 2. Ordering information Tamb = -40 C to +85 C Type number Topside mark Package Name TSSOP28 TSSOP28 Description plastic thin shrink small outline package; 28 leads; body width 4.4 mm plastic thin shrink small outline package; 28 leads; body width 4.4 mm Version SOT361-1 SOT361-1
GTL2008PW GTL2008 GTL2107PW GTL2107
The GTL2107 is the Intel designation for the GTL2008 and is identical to the GTL2008 except for the type number and the topside markings.
GTL2008_GTL2107_2
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 02 -- 26 September 2006
2 of 20
Philips Semiconductors
GTL2008; GTL2107
GTL translator with power good control and high-impedance outputs
5. Functional diagram
GTL2008/GTL2107
GTL VREF 1AO LVTTL outputs (open-drain) 2AO 1 2 27 1BI GTL inputs 3 26 2BI
5A LVTTL inputs/outputs (open-drain) 6A LVTTL input EN1
4
&
25
7BO1 GTL outputs
5 6
&
24
7BO2
23 7
(2)
EN2
LVTTL input
GTL input
11BI
1
22
11BO
GTL output
LVTTL input/output (open-drain)
11A
8
DELAY(1) 21 5BI
GTL input
9BI
9
DELAY(1) 20 6BI GTL inputs
3AO LVTTL outputs (open-drain) 4AO
10
19
3BI
11
18
4BI
1 10AI1 LVTTL inputs 10AI2 13 12 1
17
10BO1 GTL outputs
16
10BO2
15
9AO
LVTTL output
002aab968
(1) The enable on 7BO1/7BO2 include a delay that prevents the transient condition where 5BI/6BI go from LOW to HIGH, and the LOW to HIGH on 5A/6A lags up to 100 ns from causing a LOW glitch on the 7BO1/7BO2 outputs. (2) The 11BO output is driven LOW after VCC is powered up with EN2 LOW to prevent reporting of a fault condition before EN2 goes HIGH.
Fig 1. Logic diagram of GTL2008/GTL2107
GTL2008_GTL2107_2
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 02 -- 26 September 2006
3 of 20
Philips Semiconductors
GTL2008; GTL2107
GTL translator with power good control and high-impedance outputs
6. Pinning information
6.1 Pinning
VREF 1AO 2AO 5A 6A EN1 11BI 11A 9BI
1 2 3 4 5 6 7 8 9
28 VCC 27 1BI 26 2BI 25 7BO1 24 7BO2 23 EN2 22 11BO 21 5BI 20 6BI 19 3BI 18 4BI 17 10BO1 16 10BO2 15 9AO
002aab969
GTL2008PW GTL2107PW
3AO 10 4AO 11 10AI1 12 10AI2 13 GND 14
Fig 2. Pin configuration for TSSOP28
6.2 Pin description
Table 3. Symbol VREF 1AO 2AO 5A 6A EN1 11BI 11A 9BI 3AO 4AO 10AI1 10AI2 GND 9AO 10BO2 10BO1 4BI 3BI
GTL2008_GTL2107_2
Pin description Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 Description GTL reference voltage data output (LVTTL), open-drain data output (LVTTL), open-drain data input/output (LVTTL), open-drain data input/output (LVTTL), open-drain enable input (LVTTL) data input (GTL) data input/output (LVTTL), open-drain data input (GTL) data output (LVTTL), open-drain data output (LVTTL), open-drain data input (LVTTL) data input (LVTTL) ground (0 V) data output (LVTTL), 3-state data output (GTL) data output (GTL) data input (GTL) data input (GTL)
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 02 -- 26 September 2006
4 of 20
Philips Semiconductors
GTL2008; GTL2107
GTL translator with power good control and high-impedance outputs
Pin description ...continued Pin 20 21 22 23 24 25 26 27 28 Description data input (GTL) data input (GTL) data output (GTL) enable input (LVTTL) data output (GTL) data output (GTL) data input (GTL) data input (GTL) positive supply voltage
Table 3. Symbol 6BI 5BI 11BO EN2 7BO2 7BO1 2BI 1BI VCC
7. Functional description
Refer to Figure 1 "Logic diagram of GTL2008/GTL2107".
7.1 Function tables
Table 4. GTL input signals H = HIGH voltage level; L = LOW voltage level. Input 1BI/2BI/3BI/4BI/9BI L H
[1]
Output[1] 1AO/2AO/3AO/4AO/9AO L H
1AO, 2AO, 3AO, 4AO and 5A/6A condition changed by ENn power good signal as described in Table 5 and Table 6.
Table 5. EN1 power good signal H = HIGH voltage level; L = LOW voltage level. EN1 L H 1AO and 2AO 1BI and 2BI disconnected (high-Z) follows BI 5A 5BI disconnected 5BI connected
Table 6. EN2 power good signal H = HIGH voltage level; L = LOW voltage level. EN2 L H 3AO and 4AO 3BI and 4BI disconnected (high-Z) follows BI 6A 6BI disconnected 6BI connected
GTL2008_GTL2107_2
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 02 -- 26 September 2006
5 of 20
Philips Semiconductors
GTL2008; GTL2107
GTL translator with power good control and high-impedance outputs
Table 7. SMI signals H = HIGH voltage level; L = LOW voltage level; X = Don't care. Inputs 10AI1/10AI2 L L H H L H EN2 H H H H L L 9BI L H L H X X Output 10BO1/10BO2 L L L H L H
Table 8. PROCHOT signals H = HIGH voltage level; L = LOW voltage level. Input 5BI/6BI L H H
[1]
Input/output 5A/6A (open-drain) L L[2] H
Output 7BO1/7BO2 H[1] L H
The enable on 7BO1/7BO2 includes a delay that prevents the transient condition where 5BI/6BI go from LOW to HIGH, and the LOW to HIGH on 5A/6A lags up to 100 ns from causing a low glitch on the 7BO1/7BO2 outputs. Open-drain input/output terminal is driven to logic LOW state by other driver.
[2]
Table 9. NMI signals H = HIGH voltage level; L = LOW voltage level; X = Don't care. Inputs 11BI L L H X X
[1]
Input/output EN2 H H H L L 11A (open-drain) H L[1] L H L[1]
Output 11BO L H H L H
Open-drain input/output terminal is driven to logic LOW state by other driver.
GTL2008_GTL2107_2
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 02 -- 26 September 2006
6 of 20
Philips Semiconductors
GTL2008; GTL2107
GTL translator with power good control and high-impedance outputs
8. Application design-in information
VTT
56 R 56
VTT
1.5 k to 1.2 k
VCC
2R 1.5 k
PLATFORM HEALTH MANAGEMENT CPU1 1ERR_L CPU1 THRMTRIP L CPU1 PROCHOT L CPU2 PROCHOT L
VCC VREF 1AO 2AO 5A 6A EN1 11B1 VCC 1BI 2BI 7BO1 7BO2 EN2 11B0 CPU1 IERR_L THRMTRIP L FORCEPR_L PROCHOT L NMI CPU1 DISABLE_L FORCEPR_L PROCHOT L IERR_L THRMTRIP L NMI CPU2 DISABLE_L CPU2
NMI_L
GTL2008 11A GTL2107 5BI
9BI 6BI 3BI 4BI 10BO1 10BO2 9AO 3AO 4AO 10AI1 10AI2 GND
(1)
CPU2 IERR_L CPU2 THRMTRIP L CPU1 SMI L CPU2 SMI L SMI_BUFF_L
SOUTHBRIDGE NMI SOUTHBRIDGE SMI_L power supply POWER GOOD
002aab970
(1) If 9AO needs to be HIGH before EN2 goes HIGH, a pull-up resistor is required because it is high-impedance until EN2 goes HIGH. All other outputs, both GTL and LVTTL, require pull-up resistors because they are open-drain.
Fig 3. Typical application
GTL2008_GTL2107_2
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 02 -- 26 September 2006
7 of 20
Philips Semiconductors
GTL2008; GTL2107
GTL translator with power good control and high-impedance outputs
9. Limiting values
Table 10. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol VCC IIK VI IOK VO IOL IOH Tstg Tj(max)
[1] [2] [3] [4]
Parameter supply voltage input clamping current input voltage output clamping current output voltage LOW-level output current[2]
Conditions VI < 0 V A port (LVTTL) B port (GTL) VO < 0 V output in OFF or HIGH state; A port output in OFF or HIGH state; B port A port B port A port
[4]
Min -0.5 -0.5[1] -0.5[1] -0.5[1] -0.5[1] -60 -
Max +4.6 -50 +4.6 +4.6 -50 +4.6 +4.6 32 30 -32 +150 +125
Unit V mA V V mA V V mA mA mA C C
HIGH-level output current[3] storage temperature maximum junction temperature
The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed. Current into any output in the LOW state. Current into any output in the HIGH state. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150 C.
10. Recommended operating conditions
Table 11. Symbol VCC VTT Vref VI VIH VIL IOH IOL Tamb Operating conditions Parameter supply voltage termination voltage reference voltage input voltage HIGH-level input voltage LOW-level input voltage HIGH-level output current LOW-level output current ambient temperature GTL GTL A port B port A port and ENn B port A port and ENn B port A port A port B port operating in free-air Conditions Min 3.0 0.64 0 0 2 Vref + 0.050 -40 Typ 3.3 1.2 0.8 3.3 VTT Max 3.6 1.1 3.6 3.6 0.8 Vref - 0.050 -16 16 15 +85 Unit V V V V V V V V V mA mA mA C
GTL2008_GTL2107_2
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 02 -- 26 September 2006
8 of 20
Philips Semiconductors
GTL2008; GTL2107
GTL translator with power good control and high-impedance outputs
11. Static characteristics
Table 12. Static characteristics Recommended operating conditions; voltages are referenced to GND (ground = 0 V). Tamb = -40 C to +85 C Symbol VOH VOL Parameter HIGH-level output voltage LOW-level output voltage Conditions 9AO; VCC = 3.0 V to 3.6 V; IOH = -100 A 9AO; VCC = 3.0 V; IOH = -16 mA A port; VCC = 3.0 V; IOL = 4 mA A port; VCC = 3.0 V; IOL = 8 mA A port; VCC = 3.0 V; IOL = 16 mA B port; VCC = 3.0 V; IOL = 15 mA IOH II HIGH-level output current input current open-drain outputs; A port other than 9AO; VO = VCC; VCC = 3.6 V A port; VCC = 3.6 V; VI = VCC A port; VCC = 3.6 V; VI = 0 V B port; VCC = 3.6 V; VI = VTT or GND ICC ICC[3] Cio supply current additional supply current input/output capacitance A or B port; VCC = 3.6 V; VI = VCC or GND; IO = 0 mA per input; A port or control inputs; VCC = 3.6 V; VI = VCC - 0.6 V A port; VO = 3.0 V or 0 V B port; VO = VTT or 0 V
[2] [2] [2] [2] [2] [2]
Min VCC - 0.2 2.1 -
Typ[1] 3.0 2.3 0.15 0.3 0.6 0.13 8 2.5 1.5
Max 0.4 0.55 0.8 0.4 1 1 1 1 12 500 3.5 2.5
Unit V V V V V V A A A A mA A pF pF
[1] [2] [3]
All typical values are measured at VCC = 3.3 V and Tamb = 25 C. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. This is the increase in supply current for each input that is at the specified LVTTL voltage level rather than VCC or GND.
GTL2008_GTL2107_2
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 02 -- 26 September 2006
9 of 20
Philips Semiconductors
GTL2008; GTL2107
GTL translator with power good control and high-impedance outputs
12. Dynamic characteristics
Table 13. Dynamic characteristics VCC = 3.3 V 0.3 V Symbol Parameter Vref = 0.73 V; VTT = 1.1 V tPLH LOW-to-HIGH propagation delay nA to nBI; see Figure 4 9BI to 9AO; see Figure 5 nBI to nA or nAO (open-drain outputs); see Figure 14 9BI to 10BOn 11A to 11BO; see Figure 10 11BI to 11A; see Figure 9 11BI to 11BO 5BI to 7BO1 or 6BI to 7BO2; see Figure 7 tPHL HIGH-to-LOW propagation delay nA to nBI; see Figure 4 9BI to 9AO; see Figure 5 nBI to nA or nAO (open-drain outputs); see Figure 14 9BI to 10BOn 11A to 11BO; see Figure 10 11BI to 11A; see Figure 9 11BI to 11BO 5BI to 7BO1 or 6BI to 7BO2; see Figure 7 tPLZ LOW to OFF-state propagation delay EN1 to nAO or EN2 to nAO; see Figure 8 EN1 to 5A (I/O) or EN2 to 6A (I/O); see Figure 8 tPZL OFF-state to LOW propagation delay EN1 to nAO or EN2 to nAO; see Figure 8 EN1 to 5A (I/O) or EN2 to 6A (I/O); see Figure 8 tPHZ tPZH HIGH to OFF-state propagation delay OFF-state to HIGH propagation delay EN2 to 9AO; see Figure 11 EN2 to 9AO; see Figure 11
[2]
Conditions
Min 1 2 2 2 1 2 2 4 2 2 2 2 1 2 2 100 1 1 2 2 2 1
Typ[1] 4 5.5 13 6 4 7.5 8 7 5.5 5.5 4 6 5.5 8.5 14 205 3 3 7 7 5 4
Max 8 10 18 11 8 11 13 12 10 10 10 11 10 13 21 350 10 7 10 10 10 10
Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
GTL2008_GTL2107_2
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 02 -- 26 September 2006
10 of 20
Philips Semiconductors
GTL2008; GTL2107
GTL translator with power good control and high-impedance outputs
Table 13. Dynamic characteristics ...continued VCC = 3.3 V 0.3 V Symbol Parameter Vref = 0.76 V; VTT = 1.2 V tPLH LOW-to-HIGH propagation delay nA to nBI; see Figure 4 9BI to 9AO; see Figure 5 nBI to nA or nAO (open-drain outputs); see Figure 14 9BI to 10BOn 11A to 11BO; see Figure 10 11BI to 11A; see Figure 9 11BI to 11BO 5BI to 7BO1 or 6BI to 7BO2; see Figure 7 tPHL HIGH-to-LOW propagation delay nA to nBI; see Figure 4 9BI to 9AO; see Figure 5 nBI to nA or nAO (open-drain outputs); see Figure 14 9BI to 10BOn 11A to 11BO; see Figure 10 11BI to 11A; see Figure 9 11BI to 11BO 5BI to 7BO1 or 6BI to 7BO2; see Figure 7 tPLZ LOW to OFF-state propagation delay EN1 to nAO or EN2 to nAO; see Figure 8 EN1 to 5A (I/O) or EN2 to 6A (I/O); see Figure 8 tPZL OFF-state to LOW propagation delay EN1 to nAO or EN2 to nAO; see Figure 8 EN1 to 5A (I/O) or EN2 to 6A (I/O); see Figure 8 tPHZ tPZH HIGH to OFF-state propagation delay OFF-state to HIGH propagation delay EN2 to 9AO; see Figure 11 EN2 to 9AO; see Figure 11
[2]
Conditions
Min 1 2 2 2 1 2 2 4 2 2 2 2 1 2 2 100 1 1 2 2 2 2
Typ[1] 4 5.5 13 6 4 7.5 8 7 5.5 5.5 4 6 5.5 8.5 14 205 3 3 7 7 5 4
Max 8 10 18 11 8 11 13 12 10 10 10 11 10 13 21 350 10 7 10 10 10 10
Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
[1] [2]
All typical values are at VCC = 3.3 V and Tamb = 25 C. Includes ~7.6 ns RC rise time of test load pull-up on 11A, 1.5 k pull-up and 21 pF load on 11A has about 23 ns RC rise time.
GTL2008_GTL2107_2
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 02 -- 26 September 2006
11 of 20
Philips Semiconductors
GTL2008; GTL2107
GTL translator with power good control and high-impedance outputs
12.1 Waveforms
VM = 1.5 V at VCC 3.0 V for A ports; VM = Vref for B ports.
3.0 V input 1.5 V tPLH VOH VM VM 0V
002aaa999 002aab000
1.5 V 0V tPHL VTT Vref Vref VOL
tp output
VM = 1.5 V for A port and Vref for B port
A port to B port
a. Pulse duration Fig 4. Voltage waveforms
b. Propagation delay times
VTT input Vref tPLH output 1.5 V Vref
1/ V 3 TT
VTT input Vref tPZL Vref tPLZ
1/ V 3 TT
tPHL VOH 1.5 V VOL
002aab001
VCC output 1.5 V VOL + 0.3 V
002aab002
PRR 10 MHz; Zo = 50 ; tr 2.5 ns; tf 2.5 ns
Fig 5. Propagation delay, 9BI to 9AO
VTT input Vref tPLH Vref tPHL
1/ V 3 TT
Fig 6. nBI to nA (I/O) or nBI to nAO open-drain outputs
3.0 V input 1.5 V tPLZ 1.5 V 0V tPZL VOH output VOL VOL + 0.3 V 1.5 V VOL
002aab005
VTT output Vref Vref
002aac195
Fig 7. 5BI to 7BO1 or 6BI to 7BO2
Fig 8. EN1 to 5A (I/O) or EN2 to 6A (I/O) or EN1 to nAO or EN2 to nAO
GTL2008_GTL2107_2
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 02 -- 26 September 2006
12 of 20
Philips Semiconductors
GTL2008; GTL2107
GTL translator with power good control and high-impedance outputs
VTT input Vref tPLZ Vref 0V tPZL VOH output VOL + 0.3 V 1.5 V VOL
002aac196 002aac197
3.0 V input 1.5 V tPLH output Vref 1.5 V 0V tPHL VTT Vref VOL
Fig 9. 11BI to 11A
Fig 10. 11A to 11BO
3.0 V input 1.5 V tPHZ 1.5 V 0V tPZH VOH output VOL + 0.3 V 1.5 V VOL
002aab980
Fig 11. EN2 to 9AO
GTL2008_GTL2107_2
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 02 -- 26 September 2006
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Philips Semiconductors
GTL2008; GTL2107
GTL translator with power good control and high-impedance outputs
13. Test information
VCC PULSE GENERATOR VI DUT
RT CL 50 pF RL 500
VO
002aab981
Fig 12. Load circuit for A outputs (9AO)
VTT VCC PULSE GENERATOR VI DUT
RT CL 30 pF 50
VO
002aab264
Fig 13. Load circuit for B outputs
VCC VCC PULSE GENERATOR VI DUT
RT CL 21 pF RL 1.5 k
VO
002aab265
Fig 14. Load circuit for open-drain LVTTL I/O and open-drain outputs
6V VCC PULSE GENERATOR VI DUT
RT CL 50 pF RL 500 RL 500
VO
002aab982
Fig 15. Load circuit for 9AO OFF-state to LOW and LOW to OFF-state
RL -- Load resistor CL -- Load capacitance; includes jig and probe capacitance RT -- Termination resistance; should be equal to Zo of pulse generators.
GTL2008_GTL2107_2
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 02 -- 26 September 2006
14 of 20
Philips Semiconductors
GTL2008; GTL2107
GTL translator with power good control and high-impedance outputs
14. Package outline
TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm SOT361-1
D
E
A
X
c y HE vMA
Z
28
15
Q A2 pin 1 index A1 (A 3) A
Lp L detail X
1
e bp
14
wM
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 9.8 9.6 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.8 0.5 8 o 0
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT361-1 REFERENCES IEC JEDEC MO-153 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19
Fig 16. Package outline SOT361-1 (TSSOP28)
GTL2008_GTL2107_2 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 02 -- 26 September 2006
15 of 20
Philips Semiconductors
GTL2008; GTL2107
GTL translator with power good control and high-impedance outputs
15. Soldering
15.1 Introduction to soldering surface mount packages
There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended.
15.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. Typical reflow temperatures range from 215 C to 260 C depending on solder paste material. The peak top-surface temperature of the packages should be kept below:
Table 14. SnPb eutectic process - package peak reflow temperatures (from J-STD-020C July 2004) Volume mm3 < 350 240 C + 0/-5 C 225 C + 0/-5 C Volume mm3 350 225 C + 0/-5 C 225 C + 0/-5 C
Package thickness < 2.5 mm 2.5 mm Table 15.
Pb-free process - package peak reflow temperatures (from J-STD-020C July 2004) Volume mm3 < 350 260 C + 0 C 260 C + 0 C 250 C + 0 C Volume mm3 350 to 2000 260 C + 0 C 250 C + 0 C 245 C + 0 C Volume mm3 > 2000 260 C + 0 C 245 C + 0 C 245 C + 0 C
Package thickness < 1.6 mm 1.6 mm to 2.5 mm 2.5 mm
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
15.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
* Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
* For packages with leads on two sides and a pitch (e):
GTL2008_GTL2107_2 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 02 -- 26 September 2006
16 of 20
Philips Semiconductors
GTL2008; GTL2107
GTL translator with power good control and high-impedance outputs
- larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end.
* For packages with leads on four sides, the footprint must be placed at a 45 angle to
the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
15.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 C and 320 C.
15.5 Package related soldering information
Table 16. Package[1] BGA, HTSSON..T[3], LBGA, LFBGA, SQFP, SSOP..T[3], TFBGA, VFBGA, XSON DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC[5], SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP CWQCCN..L[8],
[1] [2]
Suitability of surface mount IC packages for wave and reflow soldering methods Soldering method Wave not suitable not suitable[4] Reflow[2] suitable suitable
suitable not not WQCCN..L[8] recommended[5][6] recommended[7]
suitable suitable suitable not suitable
PMFP[9],
not suitable
For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods.
GTL2008_GTL2107_2
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 02 -- 26 September 2006
17 of 20
Philips Semiconductors
GTL2008; GTL2107
GTL translator with power good control and high-impedance outputs
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. Hot bar soldering or manual soldering is suitable for PMFP packages.
[4]
[5] [6] [7] [8]
[9]
16. Abbreviations
Table 17. Acronym CDM CMOS CPU DUT ESD GTL HBM LVTTL MM PRR TTL VRD Abbreviations Description Charged Device Model Complementary Metal Oxide Semiconductor Central Processing Unit Device Under Test ElectroStatic Discharge Gunning Transceiver Logic Human Body Model Low Voltage Transistor-Transistor Logic Machine Model Pulse Rate Repetition Transistor-Transistor Logic Voltage Regulator Down
17. Revision history
Table 18. Revision history Release date 20060926 Data sheet status Product data sheet Change notice Supersedes GTL2008_1 Document ID GTL2008_GTL2107_2 Modifications:
* * * * *
Added type number GTL2017 Section 1 "General description": added new 7th paragraph Section 4 "Ordering information": added type number GTL2107PW to Table 2 "Ordering information" and following paragraph Table 10 "Limiting values": removed (old) Table note 1 (information is now in Section 18 "Legal information") added "DUT" to Table 17 "Abbreviations" Product data sheet
Rev. 02 -- 26 September 2006
GTL2008_1
GTL2008_GTL2107_2
20060502
-
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
18 of 20
Philips Semiconductors
GTL2008; GTL2107
GTL translator with power good control and high-impedance outputs
18. Legal information
18.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.semiconductors.philips.com.
18.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. Philips Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local Philips Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
malfunction of a Philips Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. Philips Semiconductors accepts no liability for inclusion and/or use of Philips Semiconductors products in such equipment or applications and therefore such inclusion and/or use is for the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- Philips Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.semiconductors.philips.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by Philips Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
18.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, Philips Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- Philips Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- Philips Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
19. Contact information
For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
GTL2008_GTL2107_2
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 02 -- 26 September 2006
19 of 20
Philips Semiconductors
GTL2008; GTL2107
GTL translator with power good control and high-impedance outputs
20. Contents
1 2 3 4 5 6 6.1 6.2 7 7.1 8 9 10 11 12 12.1 13 14 15 15.1 15.2 15.3 15.4 15.5 16 17 18 18.1 18.2 18.3 18.4 19 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Function tables . . . . . . . . . . . . . . . . . . . . . . . . . 5 Application design-in information . . . . . . . . . . 7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8 Recommended operating conditions. . . . . . . . 8 Static characteristics. . . . . . . . . . . . . . . . . . . . . 9 Dynamic characteristics . . . . . . . . . . . . . . . . . 10 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Test information . . . . . . . . . . . . . . . . . . . . . . . . 14 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 16 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 16 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 17 Package related soldering information . . . . . . 17 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18 Legal information. . . . . . . . . . . . . . . . . . . . . . . 19 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Contact information. . . . . . . . . . . . . . . . . . . . . 19 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) Koninklijke Philips Electronics N.V. 2006.
All rights reserved.
For more information, please visit: http://www.semiconductors.philips.com. For sales office addresses, email to: sales.addresses@www.semiconductors.philips.com. Date of release: 26 September 2006 Document identifier: GTL2008_GTL2107_2

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