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| CYStech Electronics Corp. Silicon NPN Epitaxial Planar Transistor Spec. No. : C855FP Issued Date : 2004.08.15 Revised Date : Page No. : 1/4 BTD1857AFP Description * High BVCEO * High current capability * Complementary to BTB1236AFP Symbol BTD1857AFP Outline TO-220FP BBase CCollector EEmitter BCE Absolute Maximum Ratings (Ta=25C) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current (DC) Collector Current (Pulse) Power Dissipation @TA=25 Power Dissipation @TC=25 Junction Temperature Storage Temperature Symbol VCBO VCEO VEBO IC ICP PD Tj Tstg Limits 180 160 5 1.5 3 2 20 150 -55~+150 Unit V V V A A W W C C BTD1857AFP CYStek Product Specification CYStech Electronics Corp. Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(on) hFE1 hFE2 fT Cob Min. 180 160 5 60 30 Typ. 140 27 Max. 1 1 0.6 1.5 320 Unit V V V A A V V MHz pF Spec. No. : C855FP Issued Date : 2004.08.15 Revised Date : Page No. : 2/4 Test Conditions IC=50A, IE=0 IC=1mA, IB=0 IE=50A, IC=0 VCB=160V, IE=0 VEB=4V, IC=0 IC=1A, IB=100mA VCE=5V, IC=150mA VCE=5V, IC=150mA VCE=5V, IC=500mA VCE=5V, IC=150mA VCB=10V, IE=0, f=1MHz *Pulse Test: Pulse Width 380s, Duty Cycle2% Classification of hFE 1 Rank Range P 82~190 Q 120~200 R 180~320 BTD1857AFP CYStek Product Specification CYStech Electronics Corp. Characteristic Curves Current Gain vs Collector Current 1000 VCE=5V Tj=125 Spec. No. : C855FP Issued Date : 2004.08.15 Revised Date : Page No. : 3/4 Saturation Voltage vs Collector Current 1000 VCE(SAT)@IC=10IB Saturation Voltage---(mV) Current Gain---HFE 100 Tj=75 Tj=25 100 Tj=125 Tj=75 Tj=25 10 1 10 100 1000 Collector Current---IC(mA) 10000 10 10 100 1000 Collector Current---IC(mA) 10000 Saturation Voltage vs Collector Current 1000 Tj=25 On Voltage vs Collector Current 1000 Tj=25 Saturation Voltage---(mV) Tj=125 Tj=75 On Voltage---(mV) Tj=125 Tj=75 VBE(SAT)@IC=10IB VBE(ON)@VCE=5V 100 1 10 100 1000 10000 Collector Current---IC(mA) 100 1 10 100 1000 10000 Collector Current---IC(mA) Power Derating Curve 2.5 Power Dissipation---PD(W) 2 1.5 1 0.5 0 0 50 100 150 200 Ambient Temperature---TA() BTD1857AFP Power Derating Curve 25 20 15 10 5 0 0 50 100 150 200 Case Temperature---TC() CYStek Product Specification Power Dissipation---PD(W) CYStech Electronics Corp. TO-220FP Dimension Marking: Spec. No. : C855FP Issued Date : 2004.08.15 Revised Date : Page No. : 4/4 D1857A Style: Pin 1.Base 2.Collector 3.Emitter 4.Collector 3-Lead TO-220FP Plastic Package CYStek Package Code: FP *: Typical DIM A A1 A2 A3 b b1 b2 c Inches Min. Max. 0.169 0.185 0.051 REF 0.110 0.126 0.098 0.114 0.020 0.030 0.043 0.053 0.069 0.059 0.020 0.030 Millimeters Min. Max. 4.300 4.700 1.300 REF 2.800 3.200 2.500 2.900 0.500 0.750 1.100 1.350 1.750 1.500 0.500 0.750 DIM D E e F L L1 L2 Inches Min. Max. 0.408 0.392 0.583 0.598 0.100 TYP 0.106 REF 0.138 REF 1.102 1.118 0.067 0.075 0.075 0.083 Millimeters Min. Max. 10.360 9.960 14.800 15.200 2.540 TYP 2.700 REF 3.500 REF 28.000 28.400 1.700 1.900 1.900 2.100 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: * Lead: 42 Alloy ; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. * CYStek reserves the right to make changes to its products without notice. * CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BTD1857AFP CYStek Product Specification |
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