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| CYStech Electronics Corp. Advanced Schottky Barrier Diodes Spec. No. : C343SN Issued Date : 2003.08.19 Revised Date :2003.12.05 Page No. : 1/4 ASD723SN Features: Designed for mounting on small surface Low stored charge Majority carrier conduction Mechanical data: Case: 0805(2012) Standard package, molded plastic Terminals : Solder plated, solderable per MIL-STD-750, method 2026. Polarity: Indicated by cathode band Mounting position: Any Weight: 4.8mg (approximately) Absolute Maximum Ratings(Ta=25) Characteristics Continuous Reverse Voltage Average Rectified Current Forward Surge Current @ 8.3ms single half sine-wave superimposed on rated load(JEDEC method) Capacitance between Terminals @ f=1MHz and applied 10VDC Reverse Voltage Junction Temperature Storage Temperature Range Symbol VR IO IFSM CT Tj Tstg Value 30 200 1.5 20 -40 to +125 -40 to +125 Unit V mA A pF C C Electrical Characteristics ( TA=25C, unless otherwise noted) Parameter Forward Voltage Reverse Current Condition IF = 200mADC VR = 30VDC Symbol VF IR Min Typ Max 0.55 15 Unit V A ASD723SN CYStek Product Specification CYStech Electronics Corp. Characteristic Curves Forward Current Derating Curve 120 Percentage of Rated Forward Current---(%) 100 80 60 40 20 0 0 25 50 75 100 125 150 1 0 0.1 0.2 100 Spec. No. : C343SN Issued Date : 2003.08.19 Revised Date :2003.12.05 Page No. : 2/4 Forward Current vs Forward Voltage Forward Current---I F(mA) M ounting on glass epoxy PCBs 125 75 10 25 - 25 0.3 0.4 0.5 0.6 Ambient Temperature---TA() Forward Voltage---VF(V) Reverse Leakage Current vs Reverse Voltage Capacitance between terminals---C T(pF) 10 Reverse Leakage Current---I R(mA) 1 0.1 75 Capacitance vs Reverse Voltage 100 125 10 0.01 0.001 0.0001 0 10 20 30 40 Reverse Voltage---VR(V) 25 1 0 5 10 15 20 25 30 35 Reverse Voltage---VR(V) ASD723SN CYStek Product Specification CYStech Electronics Corp. Packing Information Spec. No. : C343SN Issued Date : 2003.08.19 Revised Date :2003.12.05 Page No. : 3/4 ASD723SN CYStek Product Specification CYStech Electronics Corp. 0805(2012) Dimension A B Spec. No. : C343SN Issued Date : 2003.08.19 Revised Date :2003.12.05 Page No. : 4/4 Marking Code : 4 R C D 0805 surface mount package CYStek package code: SN *:Typical DIM A B R Inches Min. Max. 0.079 0.087 0.016(typ.) 0.008(tup.) Millimeters Min. Max. 2.00 2.20 0.40(typ.) 0.20(typ.) DIM C D Inches Min. Max. 0.047 0.055 0.035 0.043 Millimeters Min. Max. 1.20 1.40 0.90 1.10 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. * CYStek reserves the right to make changes to its products without notice. * CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. ASD723SN CYStek Product Specification |
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