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 0.35 CMOS 1.65 V to 3.6 V Single SPDT Switch/2:1 MUX ADG839
FEATURES
1.65 V to 3.6 V operation Ultralow on resistance: 0.35 typical 0.5 max at 2.7 V supply Excellent audio performance, ultralow distortion: 0.055 typical 0.09 max RON flatness High current carrying capability: 300 mA continuous 500 mA peak current at 3.3 V Automotive temperature range: -40C to +125C Rail-to-rail switching operation Typical power consumption (<0.1 W)
FUNCTIONAL BLOCK DIAGRAM
ADG839
S2 D S1 IN
04449-001
SWITCHES SHOWN FOR A LOGIC 1 INPUT
Figure 1.
APPLICATIONS
Cellular phones PDAs MP3 players Power routing Battery-powered systems PCMCIA cards Modems Audio and video signal routing Communication systems
PRODUCT HIGHLIGHTS
1. 2. 3. 4. 5. 0.6 over full temperature range of -40C to +125C. Compatible with 1.8 V CMOS logic. High current handling capability (300 mA continuous current at 3.3 V). Low THD + N (0.01% typ). Tiny SC70 package.
GENERAL DESCRIPTION
The ADG839 is a low voltage CMOS device containing a singlepole, double-throw (SPDT) switch. This device offers ultralow on resistance of less than 0.6 over the full temperature range. The ADG839 is fully specified for 1.8 V, 2.5 V, and 3.3 V supply operation. Each switch conducts equally well in both directions when on and has an input signal range that extends to the supplies. The ADG839 exhibits break-before-make switching action. The ADG839 is available in a 6-lead SC70 package. Table 1. ADG839 Truth Table
Logic 0 1 Switch 2 (S2) Off On Switch 1 (S1) On Off
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.326.8703 (c) 2004 Analog Devices, Inc. All rights reserved.
ADG839 TABLE OF CONTENTS
Specifications--2.7 V to 3.6 V ........................................................ 3 Specifications--2.3 V to 2.7 V ........................................................ 4 Specifications--1.65 V to 1.95 V .................................................... 5 Absolute Maximum Ratings............................................................ 6 ESD Caution.................................................................................. 6 Pin Configuration and Function Descriptions............................. 7 Typical Performance Characteristics ..............................................8 Terminology .................................................................................... 11 Test Circuits..................................................................................... 12 Outline Dimensions ....................................................................... 14 Ordering Guide .......................................................................... 14
REVISION HISTORY
10/04--Initial Version: Revision 0
Rev. 0 | Page 2 of 16
ADG839 SPECIFICATIONS1--2.7 V TO 3.6 V
VDD = 2.7 V to 3.6 V, GND = 0 V, unless otherwise noted. Table 2.
Parameter ANALOG SWITCH Analog Signal Range On Resistance (RON) On Resistance Match between Channels (RON) On Resistance Flatness (RFLAT (ON)) LEAKAGE CURRENTS Source Off Leakage IS (OFF) Channel On Leakage ID, IS (ON) DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH CIN, Digital Input Capacitance DYNAMIC CHARACTERISTICS2 tON tOFF Break-Before-Make Time Delay (tBBM) Charge Injection Off Isolation Channel-to-Channel Crosstalk Total Harmonic Distortion (THD + N) Insertion Loss -3 dB Bandwidth CS (OFF) CD, CS (ON) POWER REQUIREMENTS IDD +25C -40C to +85C -40C to +125C 0 V to VDD 0.35 0.5 0.04 0.075 0.055 0.07 0.2 0.2 2 0.8 0.005 0.1 3.2 12 16 6.5 8.5 5 70 -57 -57 0.013 -0.01 25 74 120 0.003 1 4 0.56 0.085 0.082 0.61 0.095 0.09 Unit V typ max typ max typ max nA typ nA typ V min V max A typ A max pF typ ns typ ns max ns typ ns max ns typ ns min pC typ dB typ dB typ % dB typ MHz typ pF typ pF typ A typ A max VIN = VINL or VINH Test Conditions/Comments VDD = 2.7 V VDD = 2.7 V, VS = 0 V to VDD, IS = 100 mA; Figure 19 VDD = 2.7 V, VS = 0.9 V, IS = 100 mA VDD = 2.7 V, VS = 0 V to VDD, IS = 100 mA VDD = 3.6 V VS = 0.6 V/3.3 V, VD = 3.3 V/0.6 V; Figure 20 VS = VD = 0.6 V or 3.3 V; Figure 21
18 9
19 9.5 1
RL = 50 , CL = 35 pF VS = 1.5 V/0 V; Figure 22 RL = 50 , CL = 35 pF VS = 1.5 V; Figure 22 RL = 50 , CL = 35 pF; Figure 23 VS1 = VS2 = 1.5 V; VS = 1.5 V, RS = 0 , CL = 1 nF; Figure 24 RL = 50 , CL = 5 pF, f = 100 kHz; Figure 25 S1 -S2; RL = 50 , CL = 5 pF, f = 100 kHz; Figure 26 RL = 32 , f = 20 Hz to 20 kHz, VS = 3 V p-p RL = 50 , CL = 5 pF; Figure 27 RL = 50 , CL = 5 pF; Figure 27 VDD = 3.6 V Digital inputs = 0 V or 3.6 V
1 2
Temperature range for the Y version is -40C to +125C. Guaranteed by design; not subject to production test.
Rev. 0 | Page 3 of 16
ADG839 SPECIFICATIONS1--2.3 V TO 2.7 V
VDD = 2.5 V 0.2 V, GND = 0 V, unless otherwise noted. Table 3.
Parameter ANALOG SWITCH Analog Signal Range On Resistance (RON) On Resistance Match between Channels (RON) On Resistance Flatness (RFLAT (ON)) LEAKAGE CURRENTS Source Off Leakage IS (OFF) Channel On Leakage ID, IS (ON) DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH CIN, Digital Input Capacitance DYNAMIC CHARACTERISTICS2 tON tOFF Break-before-Make Time Delay (tBBM) Charge Injection Off Isolation Channel-to-Channel Crosstalk Total Harmonic Distortion (THD + N) Insertion Loss -3 dB Bandwidth CS (OFF) CD, CS (ON) POWER REQUIREMENTS IDD +25C -40C to +85C -40C to +125C 0 V to VDD 0.35 0.5 0.04 0.075 0.045 0.55 0.085 0.13 0.2 0.2 1.7 0.7 0.005 0.1 3.2 14.5 18 7.5 9.2 7 60 -57 -57 0.021 -0.01 25 78 127 0.003 1 4 0.6 0.095 0.13 Unit V typ max typ max typ max nA typ nA typ V min V max A typ A max pF typ ns typ ns max ns typ ns max ns typ ns min pC typ dB typ dB typ % dB typ MHz typ pF typ pF typ A typ A max VIN = VINL or VINH Test Conditions/Comments
VDD = 2.3 V, VS = 0 V to VDD, IS = 100 mA; Figure 19 VDD = 2.3 V, VS = 0.95 V, IS = 100 mA VDD = 2.3 V, VS = 0 V to VDD, IS = 100 mA VDD = 2.7 V VS = 0.6 V/2.4 V, VD = 2.4 V/0.6 V; Figure 20 VS = VD = 0.6 V or 2.4 V; Figure 21
20 9.5
21 9.8 1
RL = 50 , CL = 35 pF VS = 1.5 V/0 V; Figure 22 RL = 50 , CL = 35 pF VS = 1.5 V; Figure 22 RL = 50 , CL = 35 pF; Figure 23 VS1 = VS2 = 1.5 V; VS = 1.25 V, RS = 0 , CL = 1 nF; Figure 24 RL = 50 , CL = 5 pF, f = 100 kHz; Figure 25 S1-S2; RL = 50 , CL = 5 pF, f = 100 kHz; Figure 26 RL = 32 , f = 20 Hz to 20 kHz, VS = 2 V p-p RL = 50 , CL = 5 pF; Figure 27 RL = 50 , CL = 5 pF; Figure 27 VDD = 2.7 V Digital inputs = 0 V or 2.7 V
1 2
Temperature range for the Y version is -40C to +125C. Guaranteed by design; not subject to production test.
Rev. 0 | Page 4 of 16
ADG839 SPECIFICATIONS1--1.65 V TO 1.95 V
VDD = 1.65 V 1.95 V, GND = 0 V, unless otherwise noted. Table 4.
Parameter ANALOG SWITCH Analog Signal Range On Resistance (RON) +25C -40C to +85C -40C to +125C 0 V to VDD 0.5 0.8 1.3 0.04 0.075 0.3 0.2 0.2 0.65 VDD 0.35 VDD 0.005 0.1 CIN, Digital Input Capacitance DYNAMIC CHARACTERISTICS2 tON tOFF Break-before-Make Time Delay (tBBM) Charge Injection Off Isolation Channel-to-Channel Crosstalk Total Harmonic Distortion (THD + N) Insertion Loss -3 dB Bandwidth CS (OFF) CD, CS (ON) POWER REQUIREMENTS IDD 3.2 20 28 8 10.1 12 50 -57 -57 0.033 -0.01 25 83 132 0.003 1 4 1.2 2.5 0.08 1.2 2.5 0.08 Unit V typ max max typ max typ nA typ nA typ V min V max A typ A max pF typ ns typ ns max ns typ ns max ns typ ns min pC typ dB typ dB typ % dB typ MHz typ pF typ pF typ A typ A max VIN = VINL or VINH Test Conditions/Comments
On Resistance Match between Channels (RON) On Resistance Flatness (RFLAT (ON)) LEAKAGE CURRENTS Source Off Leakage IS (OFF) Channel On Leakage ID, IS (ON) DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH
VDD = 1.8 V, VS = 0 V to VDD, IS = 100 mA; Figure 19 VDD = 1.65 V, VS = 0 V to VDD, IS = 100 mA VDD = 1.65 V, VS = TBD, IS = 100 mA IS = 100 mA VDD = 1.65 V, VS = 0 V to VDD, IS = 100 mA VDD = 1.95 V VS = 0.6 V/1.65 V, VD = 1.65 V/0.6 V; Figure 20 VS = VD = 0.6 V or 1.65 V; Figure 21
30 10.5
31 10.7 1
RL = 50 , CL = 35 pF VS = 1.5 /0 V; Figure 22 RL = 50 , CL = 35 pF VS = 1.5 V; Figure 22 RL = 50 , CL = 35 pF VS1 = VS2 = 1 V; Figure 23 VS = 1 V, RS = 0 V, CL = 1 nF; Figure 24 RL = 50 , CL = 5 pF, f = 100 kHz; Figure 25 S1 -S2; RL = 50 , CL = 5 pF, f = 100 kHz; Figure 26 RL = 32 , f = 20 Hz to 20 kHz, VS = 1 V p-p RL = 50 , CL = 5 pF; Figure 27 RL = 50 , CL = 5 pF; Figure 27 VDD = 1.95 V Digital inputs = 0 V or 1.95 V Digital inputs = 0 V or 1.95 V
1 2
Temperature range for the Y version is -40C to +125C. Guaranteed by design; not subject to production test.
Rev. 0 | Page 5 of 16
ADG839 ABSOLUTE MAXIMUM RATINGS
TA = 25C, unless otherwise noted. Table 5.
Parameter VDD to GND Analog Inputs1 Digital Inputs Peak Current, S or D 3.3 V Operation 2.5 V Operation 1.8 V Operation Continuous Current, S or D 3.3 V Operation 2.5 V Operation 1.8 V Operation Operating Temperature Range Automotive (Y Version) Storage Temperature Range Junction Temperature SC70 Package JA Thermal Impedance Lead Temperature, Soldering (10 seconds) IR Reflow, Peak Temperature
1
Rating -0.3 V to +4.6 V -0.3 V to VDD + 0.3 V -0.3 V to 4.6 V or 10 mA, whichever occurs first 500 mA 460 mA 420 mA (pulsed at 1 ms, 10% duty cycle max) 300 mA 275 mA 250 mA -40C to +125C -65C to +150C 150C 332C/W 120C/W 300C 220C
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time.
___________________________________________________________
Overvoltages at S or D are clamped by internal diodes. Current should be limited to the maximum ratings given.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Rev. 0 | Page 6 of 16
ADG839 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
IN 1 VDD 2 6 S2 5D TOP VIEW GND 3 (Not to Scale) 4 S1
ADG839
Figure 2. Pin Configuration
Table 6. Pin Function Descriptions
Pin No. 1 2 3 4, 6 5 Mnemonic IN VDD GND S1, S2 D Description Logic control input. Most positive power supply potential. Ground (0 V) reference. Source terminal. Can be an input or output. Drain terminal. Can be an input or output.
For more information, refer to the Terminology section.
Rev. 0 | Page 7 of 16
04449-002
ADG839 TYPICAL PERFORMANCE CHARACTERISTICS
0.40 VDD = 3.0V 0.35 VDD = 3.3V 0.30 0.50 0.45 0.40 VDD = 3.6V 0.25 0.20 0.15 0.10 0.10
04449-022 04449-025
+125C +85C +25C -40C
ON RESISTANCE ()
ON RESISTANCE ()
0.35 0.30 0.25 0.20 0.15
0.05 TA = 25C 0 0 0.5 1.0 1.5 2.0 VD, VS (V) 2.5 3.0 3.5
VDD = 3.3V 0.05 0 0 0.5 1.0 1.5 2.0 VD, VS (V) 2.5 3.0
Figure 3. On Resistance vs. VD (VS) VDD = 3 V to 3.6 V
Figure 6. On Resistance vs. VD (VS) for Different Temperature, VDD = 3.3 V
0.45 VDD = 2.3V 0.40 VDD = 2.5V 0.35
0.6
0.5
+125C +85C
ON RESISTANCE ()
ON RESISTANCE ()
0.30 VDD = 2.7V 0.25 0.20 0.15 0.10
0.4
0.3 +25C -40C 0.2
0.1 0.05 TA = 25C 0 0 0.5 1.0 1.5 VD, VS (V) 2.0 2.5
04449-023
VDD = 2.5V 0 0 0.5 1.0 1.5 VD, VS (V) 2.0 2.5
Figure 4. On Resistance vs. VD (VS) VDD = 2.5 V 0.2 V
Figure 7. On Resistance vs. VD (VS) for Different Temperature, VDD = 2.5 V
0.8 VDD = 1.65V 0.7 0.6
0.7 +125C 0.6 +25C +85C 0.5
ON RESISTANCE ()
0.5 0.4 VDD = 1.95V 0.3 0.2
04449-024
ON RESISTANCE ()
VDD = 1.80V
0.4 -40C 0.3 0.2 0.1 VDD = 1.8V 0 0 0.2 0.4 0.6 0.8 1.0 VD, VS (V) 1.2 1.4 1.6 1.8
TA = 25C 0 0 0.2 0.4 0.6 0.8 1.0 1.2 VD, VS (V) 1.4 1.6 1.8 2.0
Figure 5. On Resistance vs. VD (VS) VDD = 1.8 V 0.15 V
Figure 8. On Resistance vs. VD (VS) for Different Temperature, VDD = 1.8 V
Rev. 0 | Page 8 of 16
04449-027
0.1
04449-026
ADG839
100 VDD = 3.3V 90 80
140 160 VDD = 3.3V 180 TA = 25C
70
CURRENT (nA)
60 50 40 30 20 10
ID, IS (ON)
CHARGE INJECTION (pC)
120 100 VDD = 2.5V 80 60 VDD = 1.8V 40 20 0 0 0.5 1.0 1.5 VD (V) 2.0 2.5 3.0
04449-015
0 -10 -40 -20 0 20 40 60 TEMPERATURE (C) 80
100
120
Figure 9. Leakage Current vs. Temperature, VDD = 3.3 V
04449-012
IS (OFF)
Figure 12. Charge Injection vs. Source Voltage
80 VDD = 2.5V 70 60 ID, IS (ON) 50
25
tON
20
VDD = 1.8V
CURRENT (nA)
40 30 20 10 0 IS (OFF) -10 -40 -20 0 20 40 60 TEMPERATURE (C) 80 100 120
04449-013
TIME (ns)
15
VDD = 2.5V VDD = 3.3V
10
tOFF
VDD = 1.8V VDD = 2.5V VDD = 3.3V -20 0 20 40 60 TEMPERATURE (C) 80 100 120
5
0 -40
Figure 10. Leakage Current vs. Temperature, VDD = 2.5 V
Figure 13. tON/tOFF Times vs. Temperature
70 VDD = 1.8V 60 ID, IS (ON) 50
1 0 -1 -2 TA = 25C VDD = 3.3V/2.5V/1.8V
CURRENT (nA)
40 30 20 10
04449-014
ON RESPONSE (dB)
-3 -4 -5 -6 -7 -8 -9
-11 -12 100 1k 10k 100k 1M FREQUENCY (Hz) 10M
-10 -40
-20
0
20 40 60 TEMPERATURE (C)
80
100
120
100M
Figure 11. Leakage Current vs. Temperature, VDD = 1.8 V
Figure 14. Bandwidth
Rev. 0 | Page 9 of 16
04449-017
0
IS (OFF)
-10
04449-016
ADG839
0 TA = 25C VDD = 3.3V/2.5V/1.8V -20 0.04 0.05 TA = 25C 32 LOAD
OFF ISOLATION (dB)
-40
VDD = 1.8V; V p-p = 1V
-60
THD+N (%)
0.03
-80 0.02 -100
04449-018
VDD = 2.5V; V p-p = 2V
-120 100
1k
10k
100k 1M FREQUENCY (Hz)
10M
100M
1G
0.01 10
100
1k FREQUENCY (Hz)
10k
100k
Figure 15. Off Isolation vs. Frequency
Figure 17. Total Harmonic Distortion + Noise
0 TA = 25C VDD = 3.3V/2.5V/1.8V -20
0 TA = 25C VDD = 3.3V/2.5V/1.8V -20
CROSS TALK (dB)
-40
-40
-60
PSRR (dB)
-60
-80
-80
-100
04449-019
-100
04449-021
-120 100
1k
10k
100k 1M FREQUENCY (Hz)
10M
100M
1G
-120 100
1k
10k FREQUENCY (Hz)
100k
1M
Figure 16. Crosstalk vs. Frequency
Figure 18. AC PSRR
Rev. 0 | Page 10 of 16
04449-020
VDD = 3.3V; V p-p = 3V
ADG839 TERMINOLOGY
IDD Positive supply current. VD (VS) Analog voltage on Terminals D and S. RON Ohmic resistance between D and S. RFLAT (ON) Flatness is defined as the difference between the maximum and minimum value of on resistance as measured. RON On resistance match between any two channels. IS (OFF) Source leakage current with the switch off. ID (OFF) Drain leakage current with the switch off. ID, IS (ON) Channel leakage current with the switch on. VINL Maximum input voltage for Logic 0. VINH Minimum input voltage for Logic 1. IINL (IINH) Input current of the digital input. CS (OFF) Off switch source capacitance. Measured with reference to ground. CD (OFF) Off switch drain capacitance. Measured with reference to ground. CD, CS (ON) On switch capacitance. Measured with reference to ground. CIN Digital input capacitance. tON Delay time between the 50% and the 90% points of the digital input and switch on condition. tOFF Delay time between the 50% and the 90% points of the digital input and switch off condition. tBBM On or off time measured between the 80% points of both switches when switching from one to another. Charge Injection A measure of the glitch impulse transferred from the digital input to the analog output during on-off switching. Off Isolation A measure of unwanted signal coupling through an off switch. Crosstalk A measure of unwanted signal which is coupled through from one channel to another as a result of parasitic capacitance. -3 dB Bandwidth The frequency at which the output is attenuated by 3 dB. On Response The frequency response of the on switch. Insertion Loss The attenuation between the input and output ports of the switch when the switch is in the on condition, and is due to the on resistance of the switch. THD + N The ratio of the harmonic amplitudes plus noise of a signal to the fundamental. PSRR Power Supply Rejection Ratio. This is a measure of the coupling of unwanted ac signals on the power supply to the switch output when the supply is not decoupled.
Rev. 0 | Page 11 of 16
ADG839 TEST CIRCUITS
V
IS (OFF) ID (OFF) S D A
04449-004
S VS
D
04449-003
A
ID (ON) VD
04449-005
IDS
VS
VD
NC
S
D
A
Figure 19. On Resistance
Figure 20. Off Leakage
Figure 21. On Leakage
VDD 0.1F VIN VDD VS S2 S1 D RL 50 GND VOUT CL 35pF VIN 50% 50% 50% 50%
90% VOUT
90%
IN VIN
Figure 22. Switching Times, tON, tOFF
VDD 0.1F
VDD VS S2 S1 VIN D RL 50 GND VOUT CL 35pF VOUT 80% IN VIN 80%
tBBM
tBBM
04449-007
Figure 23. Break-before-Make Time Delay, tBBM
VDD 0.1F VIN (NORMALLY CLOSED SWITCH) VDD S2 VS D S1 IN GND CL 1nF
04449-008
ON
OFF
NC VOUT
VIN (NORMALLY OPEN SWITCH)
VOUT
VOUT QINJ = CL x VOUT
Figure 24. Charge Injection
Rev. 0 | Page 12 of 16
04449-006
tON
tOFF
ADG839
VDD 0.1F NETWORK ANALYZER 50 VS
VDD 0.1F NETWORK ANALYZER VOUT S1 RL 50 S2 50
RL 50 VOUT
04449-009
VDD S1
VDD
NC S2 50
IN
D
R 50
D VIN GND
VS
IN GND
OFF ISOLATION = 20 LOG
VOUT VS
CHANNEL-TO-CHANNEL CROSSTALK = 20 LOG
VOUT VS
Figure 25. Off Isolation
Figure 26. Channel-to-Channel Crosstalk
VDD 0.1F NETWORK ANALYZER
NETWORK ANALYZER VDD VDD 50mV
VDD S1
NC S2
IN
50 VS
50 VS
04449-011
BIAS TEE
VDD
D VIN GND RL 50 VOUT
IN S1 RL 50 NC S2 GND D
VOUT
04449-010
VIN
NC
04449-028
INSERTION LOSS = 20 LOG
VOUT WITH SWITCH VOUT WITHOUT SWITCH
Figure 27. Bandwidth
Figure 27. PSRR
Rev. 0 | Page 13 of 16
ADG839 OUTLINE DIMENSIONS
2.00 BSC
6 5 2 4
1.25 BSC
1 3
2.10 BSC
PIN 1 0.65 BSC 1.30 BSC 1.00 0.90 0.70 1.10 MAX 0.22 0.08 0.30 0.15 0.10 COPLANARITY COMPLIANT TO JEDEC STANDARDS MO-203AB SEATING PLANE 8 4 0
0.10 MAX
0.46 0.36 0.26
Figure 28. 6-Lead Thin Shrink Small Outline Transistor Package [SC70] (KS-6) Dimensions shown in millimeters
ORDERING GUIDE
Model ADG839YKSZ-500RL72 ADG839YKSZ-REEL2 ADG839YKSZ-REEL72 Temperature Range -40C to +125C -40C to +125C -40C to +125C Package Description 6-Lead Thin Shrink Small Outline Transistor Package 6-Lead Thin Shrink Small Outline Transistor Package 6-Lead Thin Shrink Small Outline Transistor Package Package Option KS-6 KS-6 KS-6 Branding1 SUA SUA SUA
1 2
Branding on this package is limited to three characters due to space constraints. Z = Pb-free part.
Rev. 0 | Page 14 of 16
ADG839 NOTES
Rev. 0 | Page 15 of 16
ADG839 NOTES
(c) 2004 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D04449-0-10/04(0)
Rev. 0 | Page 16 of 16


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