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| MF35 MF35 Fast Recovery Diode Replaces March 1998 version, DS4625-3.1 DSDS4625-4.0 January 2000 APPLICATIONS s Inverse, Parallel Or Series Connected Diode s Power Supplies s High Frequency Applications FEATURES s Glass Passivation s High Voltage Capability s Fast Recovery Characteristics KEY PARAMETERS VRRM 1200V IF(AV) 40A IFSM 400A Qr 10C trr 0.2ns VOLTAGE RATINGS Type Number Repetitive Peak Reverse Voltage VRRM V 1200 1000 800 600 Conditions MF35 - 1200 MF35 - 1000 MF35 - 800 MF35 - 600 VRSM = VRRM +100V Lower voltage grades available. For stud anode add suffix 'R' to type number. e.g. MF35-1200R. Outline type code: DO5. See Package Details for further information. CURRENT RATINGS Symbol IF(AV) IF(RMS) IF Parameter Mean forward current RMS value Continuous (direct) forward current Conditions Half sine wave resistive load, Tcase = 65oC Tcase = 65oC Tcase = 65oC Max. 40 63 50 Units A A A 1/8 MF35 SURGE RATINGS Symbol IFSM I2t Parameter Surge (non-repetitive) forward current I2t for fusing Conditions 10ms half sine; with VRRM 10V, Tj = 125oC 10ms half sine; Tj = 125oC Max. 400 800 Units A A2s THERMAL AND MECHANICAL DATA Symbol Rth(j-c) Rth(c-h) Parameter Thermal resistance - junction to case Thermal resistance - case to heatsink dc Mounting torque 3.5Nm with mounting compound Forward (conducting) Tvj Virtual junction temperature Reverse (blocking) Tstg Storage temperature range Mounting torque -55 3.2 125 125 3.8 o Conditions Min. - Max. 0.8 0.2 125 Units o C/W o C/W o C C C Nm CHARACTERISTICS Symbol VFM IRM trr QR VTO rT Forward voltage Peak reverse current Reverse recovery time Recovered charge Threshold voltage Slope resistance Parameter Conditions At 120A peak, Tcase = 25 C At VRRM, Tcase = 100oC IF = 1A, diRR/dt = 25A/s, Tcase = 25C, VR = 100V IF = 50A, diRR/dt = 50A/s, Tcase = 25C, VR = 100V At Tvj = 125 C At Tvj = 125 C o o o Typ. - Max. 2.0 5 200 10 1.2 7.0 Units V mA ns C V m 2/8 MF35 CURVES 200 80 Measured under pulse conditions Tj = 25C Tcase = 25C 95% Instantaneous forward current - (A) Transient forward voltage - (V) 150 60 5% Tj = 125C 100 40 50 20 0 0 0 1.0 2.0 3.0 Instantaneous forward voltage - (V) 0 200 400 600 800 1000 1200 Rate of rise of forward current - (A/s) Fig.1 Maximum (limit) forward characteristics Fig.2 Forward recovery voltage vs rate of rise of forward voltage Peak half sinewave forward current - (A) 400 Thermal impedance - C/W Tcase = 125C VR = VRRM 1.00 d.c. 0.75 350 300 0.50 250 0.25 200 1 2 3 45 10 50 0 0.001 0.01 Cycles at 50Hz Duration Fig.3 Surge (non-repetitive) forward current vs time 0.1 Time - (s) 1.0 10 Fig.4 Maximum transient thermal impedance 3/8 MF35 1200 Tcase = 125C (No snubber) 1000 Recovery time - (ns) 800 600 400 200 IF = 100A IF = 50A IF = 10A 1 10 100 Rate of rise of reverse current - (A/s) Fig.5 Recovery time vs dIR/dt 1000 60 Peak reverse current - (A) Tcase = 125C (No snubber) IF = 100A IF = 50A 50 40 30 20 10 0 IF = 10A 1 10 100 Rate of change of reverse current - (A/s) Fig.6 Peak reverse current vs dIR/dt 1000 20 IF = 100A T = 125C (No snubber) 18 case 16 IF = 50A 14 12 10 8 IF = 10A 6 4 2 0 1 10 100 Rate of change of reverse current - (A/s) Fig.7 Recovered charge vs dIR/dt Recovered charge - (C) 1000 4/8 MF35 500 Tcase = 65 Peak current - (A) 100 50 10 00 0 50 00 25 00 10 00 50 0 30 0 H 10 z 0 10 10 100 1000 Pulse width - (s) Fig.8 Frequency curves - square waveform 10000 500 Tcase = 85 Peak current - (A) 100 50 10 00 0 50 00 25 00 10 00 50 0 30 0 H 10 z 0 10 10 100 1000 Pulse width - (s) Fig.9 Frequency curves - square waveform 10000 500 0.05 Peak current - (A) 0.1 0.2 0.5 1.0 2.0J 100 10 10 100 1000 Pulse width - (s) Fig.10 Energy per pulse - square waveform 10000 5/8 MF35 500 Tcase = 65 Peak current - (A) 100 10 00 0 50 00 25 00 10 00 50 0 30 0 50 H 10 z 0 10 10 100 1000 Pulse width - (s) Fig.11 Frequency curves - sine waveform 10000 500 Tcase = 85 Peak current - (A) 100 10 00 50 25 00 10 00 50 30 50 H 10 z 0 0 00 0 0 10 10 100 1000 Pulse width - (s) Fig.12 Frequency curves - sine waveform 10000 500 0.05 0.1 Peak current - (A) 0.2 0.5 1.0 2.0J 100 10 10 100 1000 Pulse width - (s) Fig.13 Energy per pulse - sine waveform 10000 6/8 MF35 PACKAGE DETAILS For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE. Hex. 17.35mm AF max O4.0 23 11.5 Thread 1/4 in 28 UNF 2A Weight: 20g Package outline type code: DO5 ASSOCIATED PUBLICATIONS Title Calculating the junction temperature or power semiconductors Thyristor and diode measurement with a multi-meter Use of V , r on-state characteristic TO T Application Note Number AN4506 AN4853 AN5001 7/8 MF35 POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution (PACs). HEATSINKS Power Assembly has it's own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the factory. http://www.dynexsemi.com e-mail: power_solutions@dynexsemi.com HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. Unit 7 - 58 Antares Drive, Nepean, Ontario, Canada K2E 7W6. Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) CUSTOMER SERVICE CENTRES France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444 UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 Germany Tel: 07351 827723 North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. (c) Dynex Semiconductor 2000 Publication No. DS4625-4 Issue No. 4.0 January 2000 TECHNICAL DOCUMENTATION - NOT FOR RESALE. PRINTED IN UNITED KINGDOM Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification. This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. 8/8 |
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