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PREPARED BY:
Ln
DATE: lt6/4Y
SPEC.No. s#@#ARp ELECTRONIC COMPONENTS GROUP SHARP coRPORATION i ISSUE
DG996042 J&16/99
7-t uedl APPROVED BY:
DATE: `T qkc / /t/sf
PAGE 10 Pages REPRESENTATIVE DIVISIOON: Opto-Electronic Devices Division
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sd.A*
SPECIFICATION
DEVICE SPECIFICATION FOR
Light Emitting Diode
I
I
MODEL No.
GL5ZJ44
1. Thesespecificationsheets include materialsprotectedunderthe copyright of SharpCorporation ("Sharp"). Please not reproduceor causeanyone to reproducethem without Sharp's do consent. 2. When using this product, pleaseobservethe absolute maximumratingsandthe instructionsfor useoutlined in thesespecificationsheets, well asthe precautions as mentionedbelow.Sharpassumes responsibility no for any damage resultingfrom useof the product which doesnot comply with the absolutemaximum ratings and the instructionsincluded in thesespecificationsheets, the precautions and mentionedbelow. (Precautions) (1) This productsis designed usein the following applicationareas; for * OA equipment * Audio visual equipment * Homeappliance * Telecommunication equipment(Terminal) * Measuring equipment * Tooling machines * Computers 1 II If the useof the product in the above applicationareas for equipmentlisted in paragraphs is (2) or (3), pleasebe sureto observethe precautions given in thoserespectiveparagraphs. (2) Appropriate measures, suchasfail-safe designandredundant design considering the safety designof the overall systemandequipment,shouldbe takento ensurereliability and safety when this product is usedfor equipment which demands high reliability and safety in function and precision,suchas; * Transportationcontrol and safety equipment(aircraft, train, automobileetc.) * Traffic signals * Gasleakagesensor breakers * Rescue security equipment and * Other safety equipment [ (3) Please not usethis product for equipment do which requireextremely high reliability and safety in function andprecision, suchas; * Spaceequipment * Telecommunication equipment trunk lines) (for * Nuclear power control equipment * Medical equipment C (4) Please contact and consult with a Sharpsales representative thereareany questions if regardinginterpretation of the above threeparagraphs. 3. Please contact andconsultwith a Sharp sales representative anyquestions for aboutthis product. CUSTOMERS APPROVAL Department GeneralManager of EngineeringDept..III Opto-Electronic DevicesDivision Electronic Components Group SHARP CORPORATION
1
1
`DATE:
BY:
DG996042 MODEL No. GL5ZJ44
Jun/16/99
PAGE
l/10
GL5ZJ44 Sneeification
/
1. Application This specificationappliesto the light emitting diodedevice Model No. GL5a44. [AlGaIS (dicing or scribe/braketype) Orange LED device]
2. Outline dimensions pin connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage2. and
. 3. Ratingsandcharacteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage3-4. 3-l. Absolutemaximumratings 3-2. Electra-opticalcharacteristics 3-3. DeratingCurve 3-4. CharacteristicsDiagram
4. Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage5. 4- 1. Test itemsandtest conditions 4-2. Measurement itemsandFailurejudgementcriteria
5. Incoming inspection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage6. 5- 1. Applied standard 5-2. Samplingmethodandlevel 5-3. Test items,judgementcriteria andclassificaof defect 5-4. Test itemsthe surfaceis be appliedfor flat type, judgementcriteria andclassificaof defect
6. Supplement. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Refer to the attachedsheetPage7-8. 6-l. Packing 6-2. Luminousintensity rank 6-3. Dominantwavelengthrank 6-4. Environment
7. Precautions use . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..*.............. for 7-l. Lead forming method 7-2. Notice of installation 7-3. SolderingConditions .7-k For cleaning
Refer to the attachedsheetPage9- 10.
DG996042
MODEL No. GL5ZT44
JunA6/9!
PAGE 2/10
2. Outline dimensions and pin conmctions
,O.S
LO.1
r 0 :
1
pin CD. 0.
COMCCtiOllS Anode cathode
rote) Unspecified tol. to be +0.2mm rote) Cold.rolled steel leads are plated with but the tie-bar cut portions have no plating do not solder this part of the product.
unit
mm
Material Lead : (Fe) Cold rolled steel Package : Epoxy resin
Fiih Lead : Sn plated or wave soldering
Drawing No. 51106023
DG996042
MODEL No.
Jul/16/!I!
PAGE
GL5ZJ44
3110
3. Ratingsandcharacteristics 3-1. Absolutemaximumratings (Ta=25OC) Parameter S)lTdJOl Value unit Power dissipation P 130 mW Continuous forward current 50 mA 1, Peak forward current(Note1) 100 mA IN Derating factor 0.67 DC Pulse 1.33 IReversevoltage I Va I 5 IvI Operating temperature Topr 40 85 "C Storagetemperature Tstg -40 100 "C Solderingtemperature(Note 2) Tsol 260 (within 5 seconds) "C (Note 1) Duty ratio=l/lO,Pulse width=O.lms (Note 2) At the positionof 1.6mmfrom the bottom resinpackage
Terminal capacitance V=OV,f=lMHz 60 Ct I Viewing Angle 261/2 I IP=2OmA 15 (Note 3) Refer to the suplement item 6. regardingthe standard rank classification. of
-
pF deg.
3-3. Derating Curve
Peak
Forward
Current
Derating
Curve
Forward
Current
Derating
Curve
60
60
0 -25 0 Ambient 25 50 75 =lOO ia 125
`:i
-25 0 Ambient 25 50 Temperature 75 Temperature
85
100
125
TarC)
DG996042 MODEL No.
Juld16/94
PAGE
I 4110
I
Peak Forward Current vs. Duty Ratio (Ta=25"C)
GL5ZJ44
loo
10 l/100 l/10 Duty Raito 1 DR 10
3-4. Characteristics
Forward
Diagram(typ) (Note 1)
Current vs.Forward Voltage (Ta=25%) Relative Luminous Intensity vs. Ambient Temperature (lF=2OmA)
100
10
1
0. 1 1 1.2 1.4 Forward 1.6 1.8 Voltage 2 2.22.42.6 VFW
-60 -40-20 Ambient 0 20 40 Temprature 60 80 Ta("C) 100 120
Relative
Luminous
Intensity
vs.
Frorard
Voltage
(Ta=25"C) 1000
100
10
0. 1 Forward
1 Current
10 IFhA)
loo
(Note 1) Above characteristic data are typical data and not a gmrantteed data.
DG996042
MODEL No.
JlJd16/99
PAGE
GL5ZJ44
5110
4. Reliability The reliability of products shall be satisfied with items listed below. 4- 1. Test items and test conditions Test items Solderability Soldering temperature Mechanical shock Variable frequency vibration Terminal strength (Tension) Terminal strength (Bending) Temperature cycling High temp. and high humidity storage Test conditions 230*5"c, 5s Prior disposition : Dip in rosin flux 260f5"C, 5s Confidence level: 90: Samples (n) LTF'D Defective (C) (o/o) n=ll, C=O 20 20 20 20 20 20 10 10 10 10 10
n=ll,C=O n=ll, n=ll. C=O C=O
15 OOOm/s2,05ms, 3times I kX,*Yp!Z direction 200m/s2, 100 to 2 000 to 1OOHJsweep for 4min. ,4timeslfX,fY,&Z direction Weight: lON, S/each Weight:SN,O" -90" /each terminal terminal * O"-+-90" -0"
n=ll, C=O n=ll,C=O n=22, C=O n=22, C=O n=22, C=O n=22, C=O n=22, C=O
40~(3Omin)~+1OO"c(3Omin).30 Ta=+6O"C, 9O%RH, t=lOOOh
cycles
High temperature storage Ta=lOO"C, t=lOOOh Low temperature storage Ta=AO"C, t=lOOOh Operation life Ta=25"c, IF MAX, t=lOOOh *3
4-2. Measurement items and Failure judgement criteria * 1 Measurement Forward voltage Reverse current Luminous intensity Symbol
vF
Failure judgement criteria *2 v, > U.S.L. x 1.2 IR > u.sL. x 2.0
IR
Iv
Iv > The first stage value X 2.0 or The first stage value X 0.5 > Iv
z Solderability : Solder shall be adhere at the area of 95% or more of dipped portion. z Terminal strength : Package is not destroyed, and terminal is not slack. * 1: Measuring condition is in accordance with speciiication. *2: U.S.L. is shown by Upper Specification Limit. *3: IF m.is shown by forward current of absolute maximum ratings.
DG996042 MODEL No. GL5ZJ44
Jun/16/99
PAGE 6110
5. Incoming inspection 5-1. Applied standard : IS0 2859-1 5-2. Sampling method and level : A single sampling plan,nonnal inspection level II : AQL Major defect : 0.065% Minor defect : 0.4%
Different from dimension Outline dimensions
8 9 10 11 12 13
Scratch Void Uneven density of material for scattering Unbalanced center Burr Insertion position of terminal
Exceed 4 0.3mm or O.lmm x l.Omm (on top view) Exceed Q,0.3mrn (on top view) Extremely uneven density Exceed ti.25mrn from package center Exceed +0.2mm againstprovided dimension Insertion position of terminal
Minor defect
5-4. Test items the surface is be applied for flat type, judgement criteria and classifica of defbct No. 14 15 Test items Chapped the surface Hollow the surface judgement criteria The surface chapped is striking for see the lamp top The surface hollow is striking for see the lamp top classifica of defer: Minor defect
DG996042 MODEL No.
I
GL5ZJ44
JunJ16/99 PAGE I 7110
6. Supplement 6-l. Packing 6-l- 1. Inner package Put 25Opcs the same luminous intensity rank products into pack and put following label by pack. Product weight : 0.28g (One Product,Typ.) (Indication label sample) SHIPMENT TABLE I GL5ZJ44 + Model number PART No. *cl cl --- 00clcl q 250 - Quantity of products QUANTITY M99819 + Lot number * LOT No. 0 0 00 0 r3-Cl Luminous intensity rank dominant wavelength rank SHARP - Production country !dADE IN JAPAN
4
0 @ @ @ 0
Production plant code(to be indicated alphabetically) Support code Year of production(the last two figures of the year) (to be indicated alphabetically with January corresponding to A) Month of production Date of production(01 N 3 1)
6-l-2. Outer package Put 8 packs (the same luminous intensity rank) into outer package. (approximately 670g per one outer package) 6-l-3. Outer package out line dimension Width: 14Omm, Depth: 225mm, Hight: 9Omm
~l
(Note 1) Tolerance:flS% In regard to luminous intensity , the following ranking shall be carried out. However the quantity of each rank shall not be pre scribed. In case of the distribution of the lurninous intensity shift to high, at that point new upper rank is prescribed and lower rank is delete. :Ta=25"C) 6-3.Dominar-n wavelength rank (Note 2) Rank Dominant wavelength unit Condition . T 613.5 617.0 U 616.0 619.5 V 618.5 622.0 nm IF2omA W 1 621.0 624.5 X i 623.5 627.0 1 (Note 2) The condition of measurement : The measurement of 1 : light emission from the front side of lamp. This rank value is the setting value of when that classifies it the rank and be not a guarantee value. Also I shall not ask the delivery ratio of each rank.
c
Do996042
MODEL No.
Jud16/99
PAGE
I
GL5ZJ44
8110
6-4. Environment 641. Ozonosphere destructivechemicals. (1) The devicedoesn't containfollowing substance. (2) The devicedoesn't have a production line whoseprocess requiresfollowing substance. Restricted part CFCs,halones,C~,TrichLoroethane(Methychloroforn) 642. Bromic non-burning materials The device doesu't containbromic non-burning materials(PBBOs,PBBs)
DC396042
MODEL No.
Jun/16/99
PAGE
GLSZJ44
g/10
7. Precautions use for
7 - 1. Lead forming method Avoid forming a lead pin with the lead pin base as a fulcrum:be sure to hold a lead pin firmly when forming. Lead pins should be formed before soldering.
7 - 2. Notice of installation
7-Z-l installation on a PWB Yhen mounting an LED lamp on a PW, do not apply physical stress to the lead pins. The lead pin pitch should match the P'#Bpin-hole pitch:absolutely avoid widening or narrowing the lead pins. Whenpositioning an LED lamp.basically employ an LEDwith tie-bar cut or use a spacer. 7-Z-2 Whenan LED 1 is mounted directly on a P WB If the bottom face of an LED lamp is mounted directly on single-sided PWB, base of the the lead pins may be subjected to physical stress due to PYBwarp,cutting or clinching of lead pins.Prior to use,be sure to check that no disconnection inside of the resin or damageto resin etc., is found. Bhen an LED lamp is mounted on a double-sided PW,the heat during soldering affects the resin;therefore.keep the LED lamp more that 1.6mmafloat above the P!B. 7-2-3 Installation using a holder During an LEDlamp positioning,when a holder is used,a holder should be designed not to subject lead pins to any undue stress. (Note)Pay attention to the thermal expansion coefficient of the material used for the holder-since the holder expands and contracts due to preheat and soldering heat, mechanical stress may be applied to the lead pins, resulting in disconnection. 7-2-4 Installation to the case Do not fix part C with adhesives when fixed to the case as shown in Figure..1 hole of the case should be designed not to subject the ins ide of res in to any undue stress.
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DG996042
MODEL No.
Jud16/99
PAGE
I
GL5ZT44
I
lo/lo
7 - 3. Soldering Conditions Solder the lead pins under the following conditions Type of Soldering Conditions 1. Manual soldering 29SC+5"c, within 3 seconds 2. Wave soldering 26O"c+5"c. within 5 seconds 3. Auto soldering P reheating 70C to 80C. vithin 30 seconds Soldering 245"c*YC, within 5 seconds (Note) Avoid dipping resin into soldering bath. Avoid applying stress to lead pins while they are heated-For example , when the LED lamp is moved with the heat applied to the lead pins during manual soldering or solder repair,disconnection mayoccur.
7 - 4. For cleaning ( 1) Solvent cleaning : Solvent temperature 45C or less Immersion for 3 ruin or less
( 2 > Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs by cleaning bath size,ultrasonic power output, cleaning time,PBB size or device mounting condition etc. Please test it in actual using condition and confirm that doesn't occur any defect before starting the ultrasonic cleaning. ( 3 > Applicable solvent : Ethyl alcohol. Yethyl alcohol, Isopropyl alcohol In case when the other solvent is used,there are cases that the packaging resin is eroded. Please use the other solvent after thorough confirmation is performed in actual using condition.

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