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| BAS101; BAS101S High-voltage switching diodes Rev. 01 -- 8 September 2006 Product data sheet 1. Product profile 1.1 General description High-voltage switching diodes, encapsulated in a SOT23 small Surface-Mounted Device (SMD) plastic package. Table 1. Product overview Package Philips BAS101 BAS101S SOT23 SOT23 JEITA single dual series Configuration Type number 1.2 Features I High switching speed: trr 50 ns I Low leakage current I Repetitive peak reverse voltage: VRRM 300 V I Low capacitance: Cd 2 pF I Reverse voltage: VR 300 V I Small SMD plastic package 1.3 Applications I High-speed switching I High-voltage switching I Voltage clamping I Reverse polarity protection 1.4 Quick reference data Table 2. Symbol Per diode IF IR VR trr [1] Quick reference data Parameter forward current reverse current reverse voltage reverse recovery time [1] Conditions Min - Typ - Max 200 150 300 50 Unit mA nA V ns VR = 250 V - When switched from IF = 30 mA to IR = 30 mA; RL = 100 ; measured at IR = 3 mA. Philips Semiconductors BAS101; BAS101S High-voltage switching diodes 2. Pinning information Table 3. Pin BAS101 1 2 3 anode not connected cathode 1 2 3 1 3 2 006aaa764 Pinning Description Simplified outline Symbol BAS101S 1 2 3 anode (diode 1) cathode (diode 2) cathode (diode 1), anode (diode 2) 3 1 1 2 3 2 006aaa763 3. Ordering information Table 4. Ordering information Package Name BAS101 BAS101S Description plastic surface-mounted package; 3 leads Version SOT23 Type number 4. Marking Table 5. BAS101 BAS101S [1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China Marking codes Marking code[1] *HQ *HR Type number BAS101_BAS101S_1 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 01 -- 8 September 2006 2 of 11 Philips Semiconductors BAS101; BAS101S High-voltage switching diodes 5. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per diode VRRM VR IF IFRM IFSM Per device Ptot Tj Tamb Tstg [1] [2] Parameter repetitive peak reverse voltage reverse voltage Conditions Min - Max 300 600 300 600 200 100 1 9 Unit V V V V mA mA A A series connection series connection [1] forward current series connection repetitive peak forward current non-repetitive peak forward current total power dissipation junction temperature ambient temperature storage temperature Tj = 25 C prior to surge. tp 1 ms; 0.25 square wave; tp 1 s Tamb 25 C - [2] -65 -65 250 150 +150 +150 mW C C C Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 6. Thermal characteristics Table 7. Symbol Per device Rth(j-a) [1] Thermal characteristics Parameter thermal resistance from junction to ambient Conditions in free air [1] Min - Typ - Max 500 Unit K/W Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. BAS101_BAS101S_1 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 01 -- 8 September 2006 3 of 11 Philips Semiconductors BAS101; BAS101S High-voltage switching diodes 7. Characteristics Table 8. Characteristics Tamb = 25 C unless otherwise specified. Symbol Parameter Per diode VF IR Cd trr [1] [2] Conditions IF = 100 mA VR = 250 V VR = 250 V; Tj = 150 C VR = 0 V; f = 1 MHz [2] [1] Min - Typ - Max 1.1 150 100 2 50 Unit V nA A pF ns forward voltage reverse current diode capacitance reverse recovery time Pulse test: tp 300 s; 0.02. When switched from IF = 30 mA to IR = 30 mA; RL = 100 ; measured at IR = 3 mA. BAS101_BAS101S_1 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 01 -- 8 September 2006 4 of 11 Philips Semiconductors BAS101; BAS101S High-voltage switching diodes 500 IF (mA) 400 mhc618 102 IFSM (A) 10 mbg703 300 200 1 100 (1) (2) (3) 0 0 0.5 1 10-1 VF (V) 1.5 1 10 102 103 tp (s) 104 (1) Tamb = 150 C (2) Tamb = 75 C (3) Tamb = 25 C Based on square wave currents. Tj = 25 C; prior to surge Fig 1. Forward current as a function of forward voltage; typical values 102 IR (A) 10 mhc619 Fig 2. Non-repetitive peak forward current as a function of pulse duration; maximum values mhc621 0.42 Cd (pF) 0.38 1 0.34 10-1 10-2 0 40 80 120 160 200 Tj (C) 0.3 0 10 20 30 VR (V) 40 VR = 300 V f = 1 MHz; Tamb = 25 C Fig 3. Reverse current as a function of junction temperature; typical values Fig 4. Diode capacitance as a function of reverse voltage; typical values BAS101_BAS101S_1 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 01 -- 8 September 2006 5 of 11 Philips Semiconductors BAS101; BAS101S High-voltage switching diodes 8. Test information tr D.U.T. RS = 50 V = VR + IF x RS IF SAMPLING OSCILLOSCOPE Ri = 50 VR mga881 tp t 10 % + IF trr t 90 % input signal output signal (1) (1) IR = 3 mA Fig 5. Reverse recovery time test circuit and waveforms 9. Package outline 3.0 2.8 3 1.1 0.9 0.45 0.15 2.5 1.4 2.1 1.2 1 2 1.9 Dimensions in mm 0.48 0.38 0.15 0.09 04-11-04 Fig 6. Package outline SOT23 (TO-236AB) 10. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package BAS101 BAS101S [1] For further information and the availability of packing methods, see Section 15. Description 4 mm pitch, 8 mm tape and reel Packing quantity 3000 10000 -235 -215 SOT23 BAS101_BAS101S_1 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 01 -- 8 September 2006 6 of 11 Philips Semiconductors BAS101; BAS101S High-voltage switching diodes 11. Soldering 2.90 2.50 solder lands solder resist 0.85 3.00 0.85 1.30 3 0.60 (3x) 0.50 (3x) 0.60 (3x) 1.00 3.30 MSA439 2 1 2.70 occupied area solder paste Dimensions in mm Fig 7. Reflow soldering footprint SOT23 (TO-236AB) 3.40 1.20 (2x) solder lands solder resist occupied area 2 4.60 4.00 1.20 3 1 preferred transport direction during soldering 2.80 4.50 MSA427 Dimensions in mm Fig 8. Wave soldering footprint SOT23 (TO-236AB) BAS101_BAS101S_1 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 01 -- 8 September 2006 7 of 11 Philips Semiconductors BAS101; BAS101S High-voltage switching diodes 12. Mounting 43.4 0.6 0.7 40 0.6 0.7 0.5 Dimensions in mm 006aaa527 PCB thickness = 1.6 mm Fig 9. FR4 PCB, standard footprint SOT23 (TO-236AB) BAS101_BAS101S_1 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 01 -- 8 September 2006 8 of 11 Philips Semiconductors BAS101; BAS101S High-voltage switching diodes 13. Revision history Table 10. Revision history Release date 20060908 Data sheet status Product data sheet Change notice Supersedes Document ID BAS101_BAS101S_1 BAS101_BAS101S_1 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 01 -- 8 September 2006 9 of 11 Philips Semiconductors BAS101; BAS101S High-voltage switching diodes 14. Legal information 14.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.semiconductors.philips.com. 14.2 Definitions Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. Philips Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local Philips Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. malfunction of a Philips Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. Philips Semiconductors accepts no liability for inclusion and/or use of Philips Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- Philips Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.semiconductors.philips.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by Philips Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 14.3 Disclaimers General -- Information in this document is believed to be accurate and reliable. However, Philips Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- Philips Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- Philips Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or 14.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 15. Contact information For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com BAS101_BAS101S_1 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 01 -- 8 September 2006 10 of 11 Philips Semiconductors BAS101; BAS101S High-voltage switching diodes 16. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 14 14.1 14.2 14.3 14.4 15 16 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 Packing information. . . . . . . . . . . . . . . . . . . . . . 6 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Contact information. . . . . . . . . . . . . . . . . . . . . 10 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'. (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved. For more information, please visit: http://www.semiconductors.philips.com. For sales office addresses, email to: sales.addresses@www.semiconductors.philips.com. Date of release: 8 September 2006 Document identifier: BAS101_BAS101S_1 |
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