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FUJITSU SEMICONDUCTOR DATA SHEET
DS04-27300-4E
ASSP
BIPOLAR
VOLTAGE DETECTOR
MB3761
DESCRIPTION
Designed for voltage detector applications, the Fujitsu MB3761 is a dual comparator with a built-in high precision reference voltage generator. Outputs are open-collector outputs and enable use of the OR-connection between both channels. Both channels have hysteresis control outputs. Because of a wide power supply voltage range and a low power supply current, the MB3761 is suitable for power supply monitors and battery backup systems.
FEATURES
* * * * * Wide power supply voltage range: 2.5 V to 40 V Low power and small voltage dependency supply current: 250 A Typ Built-in stable low voltage generator: 1.20 V Typ Easy-to-add hysteresis characteristics. One type of package (SOP-8pin : 1 type)
APPLICATIONS
* Industrial Equipment * Arcade Amusement etc.
Copyright(c)1994-2006 FUJITSU LIMITED All rights reserved
MB3761
PIN ASSIGNMENT
(TOP VIEW)
IN-B
1 B
(+) (-)
8
VCC
HYS-A
2 (+)
7
HYS-B
IN-A
3
A (-)
6
OUT-B
OUT-A
4
5
GND
(FPT-8P-M01)
2
MB3761
ABSOLUTE MAXIMUM RATINGS
Parameter Power Supply Voltage Output Voltage Output Current Input Voltage Power Dissipation Storage Temperature Symbol VCC VO IO VIN PD TSTG Rating Min - 0.3 - 55 Max 41 41 50 + 6.5 350 (TA +70C) + 125 Unit V V mA V mW
C
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
RECOMMENDED OPERATING CONDITIONS
Parameter Power Supply Voltage Operating Ambient Temperature Output Current at pin 4 Output Current at pin 6 Symbol VCC TA IO4 IO6 Value Min 2.5 - 20 Max 40 + 75 4.5 3.0 Unit V C mA mA
WARNING: The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of the device's electrical characteristics are warranted when the device is operated within these ranges. Always use semiconductor devices within their recommended operating condition ranges. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their FUJITSU representatives beforehand.
3
MB3761
ELECTRICAL CHARACTERISTICS
(TA=+25C, VCC=5 V) Parameter Power Supply Voltage Threshold Voltage Deviation of Threshold Voltage Symbol ICCL ICCH VTH Conditions VCC= 40 V, VIL= 1.0 V VCC= 40 V, VIH= 1.5 V IO = 2 mA, VO= 1 V 2.5 V VCC 5.5 V 4.5 V VCC 40 V IOA= 4.5 mA, VOA= 2 V, IHA= 20 A, VHA= 3 V IOB= 3 mA, VOB= 2 V, IHB= 3 mA, VHB= 2 V -20C TA +70C VIL= 1.0 V VIH= 1.5 V VO= 40 V, VIL= 1.0 V VCC= 40 V, VHA= 0 V, VIL= 1.0 V VHB= 40 V, VIH= 1.5 V VO= 1.0 V, VIH= 1.5 V VO= 1.0 V, VIH= 1.5 V VH= 0 V, VIH= 1.5 V VH= 1.0 V,VIL = 1.0 V IO= 4.5 mA, VIH= 1.5 V IO= 3.0 mA, VIH= 1.5 V IH= 20 A, VIH= 1.5 V IH= 3.0 mA, VIL= 1.0 V RL= 5 k RL= 5 k Value Min 1.15 -10 6 4 40 4 Typ 250 400 1.20 3 10 2.0 2.0 Max 400 600 1.25 12 40 +10 Unit A A V mV mV mV mV mV/C mV nA 500 1 0.1 1 400 400 200 400 nA A A A mA mA A mA mV mV mV mV s s
VTH1 VTH2
VOOSA VOSSB
Offset Voltage between Outputs Temperature Coefficient of Threshold Voltage Difference Voltage on Threshold Voltage between Channel Input Current Output Leakage Current Hysteresis Output Leakage Current Output Sink Current Hysteresis Current Output Saturation Voltage Hysteresis Saturation Output Delay Time
0.05
5 100 12 10 80 10 120 120 50 120 2 3
VTHAB
IIL IIH IOH IHLA IHHB IOLA IOLB IHHA IHLB VOLA VOLB VHHA VHLB tPHL tPLH
4
MB3761
EQUIVALENT CIRCUIT
8 V CC
HYS-A
2
OUT-A
4 V REF 1.2 V
7
HYS-B
5
GND
3 IN-A
1 IN-B
6 OUT-B
OPERATIONAL DEFINITIONS
VO(A) VIN R4 R1 1 R5 2 R3 3 4 R2 6 VO(B) 5 VO(A) OUT-A GND VIN VIL(B) VIH(B) VO(B) VIN 7 8 V H(B) HYS-B OUT-B VH(B) R6 RL RL VIL(A) VIH(A) VIN VCC
Note:
VIH(A) = (1 + R1 )VR R2 VIL(A) = (1 + R1 )VR - R1 VCC R3 R2 // R3 R4 VIH(B) = (1 + ) VR R5 // R6 VIL(B) = (1 + R4 ) VR R5 . VR . . VTH (= 1.20 V) = . R2 // R3 = R2 R3 R2 + R3 R5 R6 R5 + R6
R5 // R6 =
5
MB3761
TYPICAL PERFORMANCE CHARACTERISTICS
Power Supply Current vs. Power Supply Voltage
500 Ta=+70C Ta=+25C Ta=-20C VIH = 1.5 V 300 Ta=+70C
Hysteresis (A) Current vs. Power Supply Voltage
150
Hysteresis (A) Current IHHA (A)
Ta=+70C 120 Ta=+25C Ta=-20C 90 VIH = 1.5 V 60
Power Supply Current ICC (A)
400
200
Ta=-20C VIL = 1.0 V Ta=+25C
100
30
00
10
20
30
40
00
10
20
30
40
Power Supply Voltage VCC (V)
Power Supply Voltage VCC (V)
Output Saturation (A) Voltage vs. Output Sink (A) Current
Output Saturation (A) Voltage VOLA (V) Output Saturation (B) Voltage VOLB (V)
1.0 Ta= 0.8 VCC = 5 V VIH = 1.5 V 0.6 Ta= +70C 1.0 Ta= +25C
Output Saturation (B) Voltage vs. Output Sink (B) Current
Ta= 0.8 VCC = 5 V VIH = 1.5 V 0.6
-20C
-20C
Ta= Ta= +25C +70C
0.4
0.4
0.2
0.2
0
0
5
10
15
20
25
0
0
5
10
15
20
25
Output Sink (A) Current IOL(A) (mA)
Output Sink (B) Current IOL(B) (mA)
Threshold Voltage vs. Power Supply Voltage
1.22 1.22
Threshold Voltage vs. Operating Ambient Temperature
Threshold Voltage VTH (V)
1.21
Threshold Voltage VTH (V)
1.21
1.20 Ta = +25C
1.20
1.19
1.19 V CC = 5 V 1.18
1.18
1.17 0
10
20
30
40
1.17-20
0
+20
+40
+60
+80
Power Supply Voltage VCC (V)
Operating Ambient Temperature Ta (C)
6
MB3761
APPLICATION EXAMPLES
1. Addition of Hysteresis
VO(A) VCC (VIN) R1 1 R2 2 3 4 R3 8 RL 7 6 VO(A) 5 R1 + R2 . VIH(A) = (1 + )V R . R3 GND .. VIL(A) = (1 + R2 )V R R3 VIL(A) VIH(A) VIN (VCC)
VCC R1 1 R2 2 3 R3 4 8 7 6 5 C1 RL
VH(B)
VIH VH(B) VO(B) VIH GND VIL(B) VIH(B) VO(B)
Note : All calculations occur with the output voltage at 0. The hysteresis values are adjusted for load condition and saturation voltage.
VIH(B) . . (1 + R1 )V R = R2 R1 . (1 + VIL(B) = )V R . R2 + R3
2. Voltage Detection for Alarm
VO VCC R3 RL R1 1 2 3 4 R2 R4 GND 8 7 6 5 VCCH = (1 + R1 )VR R2 VCCL = (1 + R3 )VR R4 VO VCCL VCCH VCC
For hysteresis, a positive feedback from pin 2 or 7 is required.
VCCL 2.5 V
7
MB3761
3. Voltage Detection for Alarm
VO
VCC R3 R1 R4 1 2 3 4 R2 GND VCCH = (1 + R3 )VR R4 8 7 6 5 VO VCCL VCCH VCC RL
VCCL = (1 + R1 )VR R2
VCCL 2.5 V
4. Programmable Zener
V CC R1 VZ R2 + R3 1 2 3 4 8 7 6 5 V Z = (1 + R2 ) VR R3
VZ V CC - V Z 6 mA R1 R2 + R3
GND
Note : Channel B can be used independently.
8
MB3761
5. Recovery Reset Circuit
V CC = 5 V R1 15 k
R2 3.3 k
R4 330 k 1 2 3 8 7 6 5 R5 6.8 k OUT
6.8 k R3 0.1 F C1
4
OUT
GND
9
MB3761
TYPICAL CHARACTERISTICS
DC Characteristics
6 V CC (V) 5 V CC (L)
Response Characteristics
V CC V CC (H)
V O (V)
4
0 4.4 t RST 30 ms VO
V O (V) 0 1 2 3 V CC (V) 4 5 6
VCCH = VCCL + R1 (R2 + R3 ) VTH R3 R4 = -C1 R4 * In (1 + )
2
0
0
*
Voltage Threshold Levels (VCCL and VCCH) and Hysteresis Width can be changed by the resistors (R1 through R4). R1 + R2 + R3 VCCL = VTH R3
*
Power-On Reset Time is provided by the following approximate equation: tRST
* * *
The recommended value of hFE of the external transistor is from 50 to 200. In the case of an instant power fail, the remaining charge in C1 effects tRST. If necessary, the reversed output is provided on HYS terminal
10
{
{ 1 - VCC
VTH
R1 R2 + R3
MB3761
NOTES ON USE
* Take account of common impedance when designing the earth line on a printed wiring board. * Take measures against static electricity. - For semiconductors, use antistatic or conductive containers. - When storing or carrying a printed circuit board after chip mounting, put it in a conductive bag or container. - The work table, tools and measuring instruments must be grounded. - The worker must put on a grounding device containing 250 k to 1 M resistors in series. * Do not apply a negative voltage - Applying a negative voltage of -0.3 V or less to an LSI may generate a parasitic transistor, resulting in malfunction.
ORDERING INFORMATION
Part number MB3761PF- MB3761PF-E1 Package 8-pin plastic SOP (FPT-8P-M01) 8-pin plastic SOP (FPT-8P-M01) Remarks Conventional version Lead Free version
RoHS Compliance Information of Lead (Pb) Free version
The LSI products of Fujitsu with "E1" are compliant with RoHS Directive , and has observed the standard of lead, cadmium, mercury, Hexavalent chromium, polybrominated biphenyls (PBB) , and polybrominated diphenyl ethers (PBDE) . The product that conforms to this standard is added "E1" at the end of the part number.
MARKING FORMAT (Lead Free version)
Lead Free version
3761
E1XXXX XXX
INDEX
11
MB3761
LABELING SAMPLE (Lead free version)
Lead free mark JEITA logo JEDEC logo
MB123456P - 789 - GE1
(3N) 1MB123456P-789-GE1 1000
G
Pb
(3N)2 1561190005 107210
QC PASS
PCS 1,000 MB123456P - 789 - GE1
2006/03/01
ASSEMBLED IN JAPAN
1/1
MB123456P - 789 - GE1
0605 - Z01A 1000
1561190005
Lead Free version
12
MB3761
MB3761PF-E1 RECOMMENDED CONDITIONS OF MOISTURE SENSITIVITY LEVEL
Item Mounting Method Mounting times Before opening Storage period From opening to the 2nd reflow When the storage period after opening was exceeded Storage conditions Condition IR (infrared reflow) , Manual soldering (partial heating method) 2 times Please use it within two years after Manufacture. Less than 8 days Please processes within 8 days after baking (125 C, 24H)
5 C to 30 C, 70%RH or less (the lowest possible humidity)
[Temperature Profile for FJ Standard IR Reflow] (1) IR (infrared reflow) H rank : 260 C Max
260 C 255 C
170 C ~ 190 C
RT
(b)
(c)
(d)
(e)
(a)
(d')
(a) Temperature Increase gradient (b) Preliminary heating (c) Temperature Increase gradient (d) Actual heating (d')
(e) Cooling
: Average 1 C/s to 4 C/s : Temperature 170 C to 190 C, 60s to 180s : Average 1 C/s to 4 C/s : Temperature 260 C Max; 255 C or more, 10s or less : Temperature 230 C or more, 40s or less or Temperature 225 C or more, 60s or less or Temperature 220 C or more, 80s or less : Natural cooling or forced cooling
Note : Temperature : the top of the package body (2) Manual soldering (partial heating method) Conditions : Temperature 400 C Max Times : 5 s max/pin 13
MB3761
PACKAGE DIMENSION
8-pin plastic SOP Lead pitch Package width x package length Lead shape Sealing method Mounting height Weight 1.27 mm 5.3 x 6.35 mm Gullwing Plastic mold 2.25 mm MAX 0.10 g P-SOP8-5.3x6.35-1.27
(FPT-8P-M01)
Code (Reference)
8-pin plastic SOP (FPT-8P-M01)
*1 6.35 -0.20 .250 -.008
8
+0.25 +.010
Note 1) *1 : These dimensions include resin protrusion. Note 2) *2 : These dimensions do not include resin protrusion. Note 3) Pins width and pins thickness include plating thickness. Note 4) Pins width do not include tie bar cutting remainder.
0.17 -0.04 .007 -.002
+0.03 +.001
5
INDEX
*2 5.300.30 7.800.40 (.209.012) (.307.016)
Details of "A" part 2.00 -0.15
+0.25 +.010
.079 -.006
1 4
(Mounting height)
"A" 0.13(.005)
0.25(.010) 0~8
1.27(.050)
0.470.08 (.019.003)
M
0.500.20 (.020.008) 0.600.15 (.024.006)
0.10 -0.05
+0.10 +.004
.004 -.002 (Stand off)
0.10(.004)
C
2002 FUJITSU LIMITED F08002S-c-6-7
Dimensions in mm (inches). Note: The values in parentheses are reference values.
14
MB3761
FUJITSU LIMITED
All Rights Reserved. The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose of reference to show examples of operations and uses of Fujitsu semiconductor device; Fujitsu does not warrant proper operation of the device with respect to use based on such information. When you develop equipment incorporating the device based on such information, you must assume any responsibility arising out of such use of the information. Fujitsu assumes no liability for any damages whatsoever arising out of the use of the information. Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right of Fujitsu or any third party or does Fujitsu warrant non-infringement of any third-party's intellectual property right or other right by using such information. Fujitsu assumes no liability for any infringement of the intellectual property rights or other rights of third parties which would result from the use of information contained herein. The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite). Please note that Fujitsu will not be liable against you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the prior authorization by Japanese government will be required for export of those products from Japan. Edited Business Promotion Dept.
F0605

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