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TPS715xx
Actual Size (2,15 mm x 2,3 mm)
www.ti.com
SLVS338K - MAY 2001 - REVISED SEPTEMBER 2005
50 mA, 24 V, 3.2 A Supply Current Low-Dropout Linear Regulator in SC70 Package
FEATURES
* * * * * * 24-V Maximum Input Voltage Low 3.2-A Quiescent Current at 50 mA Stable With Any Capacitor ( 0.47 F) 50-mA Low-Dropout Regulator Available in 1.8 V, 1.9 V, 2.3 V, 2.5 V, 3.0 V, 3.3 V, 3.45 V, 5.0 V, and Adjustable (1.2 V to 15 V) Designed to Support MSP430 Families: - 1.9 V version ensured to be higher than minimum VIN of 1.8 V - 2.3 V version ensured to meet 2.2 V minimum VIN for FLASH on MSP430F2xx - 3.45 V version ensured to be lower than maximum VIN of 3.6 V - Wide variety of fixed output voltage options to match VIN to the minimum required for desired MSP430 speed Minimum/Maximum Specified Current Limit 5-Pin SC70/SOT-323 (DCK) Package -40C to +125C Specified Junction Temperature Range For 80mA Rated Current and Higher Power Package, see TPS715Axx
APPLICATIONS
* * * Ultra Low Power Microcontrollers Cellular/Cordless Handsets Portable/Battery-Powered Equipment
DESCRIPTION
The TPS715xx low-dropout (LDO) voltage regulators offer the benefits of high input voltage, low-dropout voltage, low-power operation, and miniaturized packaging. The devices, which operate over an input range of 2.5 V to 24 V, are stable with any capacitor ( 0.47 F). The low dropout voltage and low quiescent current allow operations at extremely low power levels. Therefore, the devices are ideal for powering battery management ICs. Specifically, since the devices are enabled as soon as the applied voltage reaches the minimum input voltage, the output is quickly available to power continuously operating battery charging ICs. The usual PNP pass transistor has been replaced by a PMOS pass element. Because the PMOS pass element behaves as a low-value resistor, the low dropout voltage, typically 415 mV at 50 mA of load current, is directly proportional to the load current. The low quiescent current (3.2 A typically) is stable over the entire range of output load current (0 mA to 50 mA).
* * * *
DCK PACKAGE (TOP VIEW) FB/NC GND NC 1 2 3 4 IN 5 OUT
Solar Cell
IN
TPS715xx OUT GND
MSP430
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Copyright (c) 2001-2005, Texas Instruments Incorporated
TPS715xx
www.ti.com
SLVS338K - MAY 2001 - REVISED SEPTEMBER 2005
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION (1)
PRODUCT TPS715xxyyyz VOUT (2) XX is nominal output voltage (for example, 28 = 2.8V, 285 = 2.85V, 01 = Adjustable). YYY is package designator. Z is package quantity.
(1) (2)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Output voltages from 1.25V to 5.4V in 50mV increments are available through the use of innovative factory EEPROM programming; minimum order quantities may apply. Contact factory for details and availability.
ABSOLUTE MAXIMUM RATINGS
over operating temperature range (unless otherwise noted) (1) (2)
UNIT VIN range Peak output current ESD rating, HBM ESD rating, CDM Continuous total power dissipation Junction temperature range, TJ Storage temperature range, Tstg (1) (2) -0.3 V to 24 V Internally limited 2 kV 500 V See Dissipation Rating Table -40C to +150C -65C to +150C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to network ground terminal.
DISSIPATION RATING TABLE
BOARD Low-K (1) High-K (2) (1) (2) PACKAGE DCK DCK RJCC/W 165 165 RJAC/W 395 315 DERATING FACTOR ABOVE TA = 25C 2.52 mW/C 3.18 mW/C TA 25C POWER RATING 250 mW 320 mW TA = 70C POWER RATING 140 mW 175 mW TA = 85C POWER RATING 100 mW 130 mW
The JEDEC Low-K (1s) board design used to derive this data was a 3 inch x 3 inch, two-layer board with 2 ounce copper traces on top of the board. The JEDEC High-K (2s2p) board design used to derive this data was a 3 inch x 3 inch, multilayer board with 1 ounce internal power and ground planes and 2 ounce copper traces on top and bottom of the board.
2
TPS715xx
www.ti.com
SLVS338K - MAY 2001 - REVISED SEPTEMBER 2005
ELECTRICAL CHARACTERISTICS
over operating junction temperature range (TJ = -40C to 125C), VIN = VOUT(NOM) + 1 V, IOUT = 1 mA, COUT = 1 F unless otherwise noted. Typical values are at TJ = 25C.
PARAMETER Input voltage (1) VOUT voltage range (TPS71501) VOUT accuracy (1) Over VIN, IOUT, and T VIN + 1.0 V VIN 24 V 100 A IOUT 50 mA 0 IOUT 50 mA, TJ = -40C to +85C Ground pin current Load regulation Output voltage line regulation (1) VOUT/IOUT VOUT/VIN Vn ICL PSRR VDO IGND 0 mA IOUT 50 mA 0 mA IOUT 50 mA, VIN = 24 V IOUT = 100 A to 50 mA VOUT + 1 V < VIN 24 V BW = 200 Hz to 100 kHz, COUT = 10 F, IOUT = 50 mA VO = 0 V f = 100 kHz, COUT = 10 F IOUT = 50 mA 125 60 415 750 22 20 575 750 60 VIN TEST CONDITIONS IO = 10 mA IO = 50 mA MIN 2.5 3 1.2 -4.0 3.2 3.2 TYP MAX 24 24 15 +4.0 4.2 4.8 5.8 mV mV Vrms mA dB mV A UNIT V V %
Output noise voltage Output current limit Power-supply ripple rejection Dropout voltage VIN = VOUT(NOM) - 1 V (1)
Minimum VIN = VOUT + VDO or the value shown for Input voltage in this table, whichever is greater.
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TPS715xx
www.ti.com
SLVS338K - MAY 2001 - REVISED SEPTEMBER 2005
FUNCTIONAL BLOCK DIAGRAM--ADJUSTABLE VERSION
V(IN) Current Sense ILIM _ GND + FB R2 R1 V(OUT)
Vref = 1.205 V Bandgap Reference
FUNCTIONAL BLOCK DIAGRAM--FIXED VERSION
V(IN) Current Sense ILIM _ GND + R1 V(OUT)
Vref = 1.205 V Bandgap Reference R2 = 840 k
R2
Table 1. Terminal Functions
TERMINAL NAME FB NC GND NC IN OUT 1 2 3 4 5 2 3 4 5 NO. FIXED ADJ. 1 Adjustable version. This terminal is used to set the output voltage. No connection Ground No connection Input supply. Output of the regulator, any output capacitor 0.47 F can be used for stability. DESCRIPTION
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TPS715xx
www.ti.com
SLVS338K - MAY 2001 - REVISED SEPTEMBER 2005
TYPICAL CHARACTERISTICS
OUTPUT VOLTAGE vs OUTPUT CURRENT
3.320 3.315 VOUT - Output Voltage - V VIN = 4.3 V COUT = 1 F TJ = 25C VOUT - Output Voltage - V 3.32 3.31 3.30 3.29 3.28 3.27 3.26 VIN = 4.3 V COUT = 1 F IOUT = 50 mA IOUT = 1 mA IGND - Ground Current - A
OUTPUT VOLTAGE vs JUNCTION TEMPERATURE
4.5
QUIESCENT CURRENT vs JUNCTION TEMPERATURE
VIN = 4.3 V VOUT = 3.3 V IOUT = 1 F
4
3.310 3.305
3.5
3
3.300 3.295 3.290 0 10 20 30 40 50 IO - Output Current - mA
2.5
3.25 -40 -25 -10 5 20 35 50 65 80 95 110 125 TJ - Junction Temperature - C
2 -40 -25 -10 5 20 35 50 65 80 95 110 125 TJ - Junction Temperature - C
Figure 1. OUTPUT SPECTRAL NOISE DENSITY vs FREQUENCY
Hz 8 7 6 Output Spectral Noise Density - 5 4 3 2 1 IOUT = 50 mA IOUT = 1 mA VIN = 4.3 V VOUT = 3.3 V COUT = 1 F
Figure 2. OUTPUT IMPEDANCE vs FREQUENCY
18 16 Zo - Output Impedance - 14 12 10 8 6 4 2 0 IOUT = 50 mA 10 100 1k 10k 100k 1M 10 M 0 0 IOUT = 1 mA VIN = 4.3 V VOUT = 3.3 V COUT = 1 F TJ = 25C 600 VIN = 3.2 V COUT = 1 F
Figure 3. DROPOUT VOLTAGE vs OUTPUT CURRENT
V/
V DO - Dropout Voltage - mV
500
TJ = 125C 400 TJ = 25C 300
200 TJ = -40C 100
0 100 1k 10 k f - Frequency - Hz 100 k
f - Frequency - Hz
10 20 30 40 IOUT - Output Current - mA
50
Figure 4. TPS71501 DROPOUT VOLTAGE vs INPUT VOLTAGE
1 IOUT = 50 mA 0.9 0.8 V DO - Dropout Voltage - V 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 3 6 9 12 15 VIN - Input Voltage - V TJ = -40C TJ = 25C V DO - Dropout Voltage - mV 500 TJ = 125C 600 VIN = 3.2 V
Figure 5. DROPOUT VOLTAGE vs JUNCTION TEMPERATURE
PSRR - Power Supply Ripple Rejection - dB 100 90 80 70 60 50 40 30 20 10 0 10 100 1k VIN = 4.3 V VOUT = 3.3 V COUT = 10 F TJ = 25C
Figure 6. POWER-SUPPLY RIPPLE REJECTION vs FREQUENCY
IOUT = 50 mA 400
IOUT = 1 mA
300 200 IOUT = 10 mA 100 0 -40 -25 -10 5 20 35 50 65 80 95 110 125 TJ - Junction Temperature - C
IOUT = 50 mA
10k
100k
1M
10 M
f - Frequency - Hz
Figure 7.
Figure 8.
Figure 9.
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TPS715xx
www.ti.com
SLVS338K - MAY 2001 - REVISED SEPTEMBER 2005
TYPICAL CHARACTERISTICS (continued)
POWER UP / POWER DOWN
DVOUT - Change in Output Voltage - mV 8 7 6 VIN - Input Voltage - V 5 4 3 VIN 2 1 0 0 2 4 6 8 10 12 14 t - Time - ms 16 18 20 VOUT VOUT = 3.3 V RL = 66 COUT = 10 F
LINE TRANSIENT RESPONSE
D VOUT - Change In Output Voltage - mV IOUT - Output Current - mV
LOAD TRANSIENT RESPONSE
400 200 0 -200 60 40 20 0 0 100 200 300 400 500 600 700 800 900 1000 t - Time - s VIN = 4.3 V VOUT = 3.3 V COUT = 10 F
100 50 0 -50
VOUT = 3.3 V IOUT = 50 mA COUT = 10 F
VOUT - Output Voltage - V
VIN - Input Voltage - V
5.3
4.3 0 50 100 150 200 250 300 350 400 450 500 t - Time - s
Figure 10.
Figure 11.
Figure 12.
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TPS715xx
www.ti.com
SLVS338K - MAY 2001 - REVISED SEPTEMBER 2005
APPLICATION INFORMATION
The TPS715xx family of LDO regulators has been optimized for ultra-low power applications such as the MSP430 microcontroller. Its ultra-low supply current maximizes efficiency at light loads, and its high input voltage range makes it suitable for supplies such as unconditioned solar panels.
VIN C1 0.1 F IN TPS71533 OUT GND VOUT 0.47 F
Figure 13. Typical Application Circuit (Fixed Voltage Version)
External Capacitor Requirements
Although not required, a 0.047-F or larger input bypass capacitor, connected between IN and GND and located close to the device, is recommended to improve transient response and noise rejection of the power supply as a whole. A higher-value input capacitor may be necessary if large, fast-rise-time load transients are anticipated and the device is located several inches from the power source. The TPS715xx requires an output capacitor connected between OUT and GND to stabilize the internal control loop. Any capacitor (including ceramic and tantalum) 0.47 F properly stabilizes this loop. X7R type capacitors are recommended but X5R and others may be used.
Power Dissipation and Junction Temperature
To ensure reliable operation, worst-case junction temperature should not exceed 125C. This restriction limits the power dissipation the regulator can handle in any given application. To ensure the junction temperature is within acceptable limits, calculate the maximum allowable dissipation, PD(max), and the actual dissipation, PD, which must be less than or equal to PD(max). The maximum-power-dissipation limit is determined using the following equation: T max * T A P +J D(max) R qJA where: * TJmax is the maximum allowable junction temperature. * RJA is the thermal resistance junction-to-ambient for the package (see the Dissipation Ratings table). * TA is the ambient temperature. The regulator dissipation is calculated using: P D + VIN*V OUT I OUT For a higher power package version of the TPS715xx, see the TPS715Axx.
(2)
(1)
Regulator Protection
The TPS715xx PMOS-pass transistor has a built-in back diode that conducts reverse current when the input voltage drops below the output voltage (e.g., during power down). Current is conducted from the output to the input and is not internally limited. If extended reverse voltage operation is anticipated, external limiting might be appropriate. The TPS715xx features internal current limiting. During normal operation, the TPS715xx limits output current to approximately 500 mA. When current limiting engages, the output voltage scales back linearly until the overcurrent condition ends. Take care not to exceed the power dissipation ratings of the package.
7
TPS715xx
www.ti.com
SLVS338K - MAY 2001 - REVISED SEPTEMBER 2005
APPLICATION INFORMATION (continued) Programming the TPS71501 Adjustable LDO Regulator
The output voltage of the TPS71501 adjustable regulator is programmed using an external resistor divider as shown in Figure 14. The output voltage operating range is 1.2 V to 15 V, and is calculated using:
V OUT + VREF 1 ) R1 R2
(3)
where: * VREF = 1.205 V typ (the internal reference voltage) Resistors R1 and R2 should be chosen for approximately 1.5-A divider current. Lower value resistors can be used for improved noise performance, but the solution consumes more power. Higher resistor values should be avoided as leakage current into/out of FB across R1/R2 creates an offset voltage that artificially increases/decreases the feedback voltage and thus erroneously decreases/increases VOUT. The recommended design procedure is to choose R2 = 1 M to set the divider current at 1.5 A, and then calculate R1 using: V OUT R1 + *1 R2 V REF
OUTPUT VOLTAGE PROGRAMMING GUIDE
VIN 0.1F GND FB R2 R1 R2 IN OUT TPS71501 R1 CFB VOUT 0.47F
(4)
OUTPUT VOLTAGE 1.8 V 2.8 V 5.0 V
R1 0.499 M 1.33 M 3.16 M
R2 1 M 1 M 1 M
VOUT + VREF
1)
Figure 14. TPS71501 Adjustable LDO Regulator Programming
Power the MSP430 Microcontroller
Several versions of the TPS715xx are ideal for powering the MSP430 microcontroller. Table 2 shows potential applications of some voltage versions. Table 2. Typical MSP430 Applications
DEVICE TPS71519 TPS71523 TPS71530 TPS715345 VOUT (TYP) 1.9V 2.3V 3.0V 2.45V APPLICATION VOUT, MIN > 1.800V required by many MSP430s. Allows lowest power consumption operation. VOUT, MIN > 2.200V required by some MSP430s FLASH operation. VOUT, MIN > 2.700V required by some MSP430s FLASH operation. VOUT, MIN < 3.600V required by some MSP430s. Allows highest speed operation.
The TPS715xx family offers many output voltage versions to allow designers to minimize the supply voltage for the processing speed required of the MSP430. This minimizes the supply current consumed by the MSP430.
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PACKAGE OPTION ADDENDUM
www.ti.com
24-Aug-2005
PACKAGING INFORMATION
Orderable Device BQ71525DCKR BQ71533DCKR BQ71533DCKRG4 TPS71501DCKR TPS71501DCKRG4 TPS71518DCKR TPS71519DCKR TPS71523DCKR TPS71525DCKR TPS71525DCKRG4 TPS71530DCKR TPS71530DCKRG4 TPS71530QDCKRQ1 TPS71533DCKR TPS71533DCKRG4 TPS715345DCKR TPS71550DCKR TPS71550DCKRG4
(1)
Status (1) ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE PREVIEW PREVIEW PREVIEW ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE PREVIEW ACTIVE ACTIVE
Package Type SC70 SC70 SC70 SC70 SC70 SC70 SC70 SC70 SC70 SC70 SC70 SC70 SC70 SC70 SC70 SC70 SC70 SC70
Package Drawing DCK DCK DCK DCK DCK DCK DCK DCK DCK DCK DCK DCK DCK DCK DCK DCK DCK DCK
Pins Package Eco Plan (2) Qty 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 3000 3000 3000 TBD TBD TBD
Lead/Ball Finish CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU Call TI Call TI Call TI CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU Call TI CU NIPDAU CU NIPDAU
MSL Peak Temp (3) Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Call TI Call TI Call TI Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Call TI Level-1-260C-UNLIM Level-1-260C-UNLIM
3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 3000 TBD 3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br) 3000 TBD 3000 Green (RoHS & no Sb/Br) 3000 Green (RoHS & no Sb/Br)
The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
24-Aug-2005
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MPDS025C - FEBRUARY 1997 - REVISED FEBRUARY 2002
DCK (R-PDSO-G5)
PLASTIC SMALL-OUTLINE PACKAGE
0,65 5 4
0,30 0,15
0,10 M
1,40 1,10
2,40 1,80
0,13 NOM
1 2,15 1,85
3
Gage Plane
0,15 0-8 0,46 0,26
Seating Plane 1,10 0,80 0,10 0,00 0,10
4093553-2/D 01/02 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. Falls within JEDEC MO-203
POST OFFICE BOX 655303
* DALLAS, TEXAS 75265
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