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Preliminary W24256 32K x 8 CMOS STATIC RAM
GENERAL DESCRIPTION
The W24256 is a normal speed, low power CMOS static RAM organized as 32768 x 8 bits that operates on a single 5-volt power supply. This device is manufactured using Winbond's high performance CMOS technology.
FEATURES
* * * *
High speed access time: 35 nS (max.) Low power consumption: - Active: 550 mW (max.) Single +5V power supply Fully static operation
* * *
All inputs and outputs directly TTL compatible Three-state outputs Available packages: 28-pin 300 mil SOJ, 330mil SOP, and standard type one TSOP (8 mm x 13.4 mm)
PIN CONFIGURATIONS
BLOCK DIAGRAM
VDD V SS A0 .
A14 A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O1 I/O2 I/O3 VSS
1 2 3 4 5 6 7 8 9 10 11 12 13 14
28-pin SOJ/SOP
28 27 26 25 24 23 22 21 20 19 18 17 16 15
VDD WE A13 A8 A9 A11 OE A10 CS I/O8 I/O7 I/O6 I/O5 I/O4
. A14
DECODE R
CORE ARRAY
CS OE WE CONTROL DATA I/O I/O1 . . I/O8
OE A11 A9 A8 A13 WE VDD A14 A12 A7 A6 A5 A4 A3
1 2 3 4 5 6 7 8 9 10 11 12 13 14
28-pin TSOP
28 27 26 25 24 23 22 21 20 19 18 17 16 15
A10 CS I/O8 I/O7 I/O6 I/O5 I/O4 VSS I/O3 I/O2 I/O1 A0 A1 A2
PIN DESCRIPTION
SYMBOL A0-A14 I/O1-I/O8 CS WE OE VDD VSS DESCRIPTION Address Inputs Data Inputs/Outputs Chip Select Input Write Enable Input Output Enable Input Power Supply Ground
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Publication Release Date: May 2000 Revision A1
Preliminary W24256
DC CHARACTERISTICS
Absolute Maximum Ratings
PARAMETER Supply Voltage to VSS Potential Input/Output to VSS Potential Allowable Power Dissipation Storage Temperature Operating Temperature RATING -0.5 to +7.0 -0.5 to VDD +0.5 1.0 -65 to +150 0 to +70 UNIT V V W C C
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the device.
TRUTH TABLE
CS H L L L OE X H L X WE X H H L MODE Not Selected Output Disable Read Write I/O1-I/O8 High Z High Z Data Out Data In VDD CURRENT ISB, ISB1 IDD IDD IDD
OPERATING CHARACTERISTICS
(VDD = 5V 10%, VSS = 0V, TA = 0 to 70 C)
PARAMETER Input Low Voltage Input High Voltage Input Leakage Current Output Leakage Current Output Low Voltage Output High Voltage Operating Power Supply Current Standby Power Supply Current
SYM. VIL VIH ILI ILO VOL VOH IDD ISB ISB1
TEST CONDITIONS VIN = VSS to VDD VI/O = VSS to VDD, CS = VIH or OE = VIH or WE = VIL IOL = +2.1 mA IOH = -1 mA CS = VIL, I/O = 0 mA Cycle = min , Duty = 100% CS = VIH Cycle = MIN., Duty = 100%
CS VDD -0.2V
MIN. -0.5 +2.2 -5 -5 2.4 -
TYP. -
MAX. +0.8 VDD +0.5 +5 +5 0.4 110 25 1
UNIT V V A A V V mA mA mA
Note: Typical characteristics are at VDD = 5V, TA = 25 C.
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Preliminary W24256
CAPACITANCE
(VDD = 5V, TA = 25 C, f = 1 MHz)
PARAMETER Input Capacitance Input/Output Capacitance
SYM. CIN CI/O
CONDITIONS VIN = 0V VOUT = 0V
MAX. 8 10
UNIT pF pF
Note: These parameters are sampled but not 100% tested.
AC TEST CONDITIONS
PARAMETER Input Pulse Levels Input Rise and Fall Times Input and Output Timing Reference Level Output Load 0V to 3V 5 nS 1.5V CL = 30 pF + 1 TTL, IOH/IOL = -1 mA/2.1 mA CONDITIONS
AC TEST LOADS AND WAVEFORM
5V OUTPUT 30 pF Including Jig and Scope
5V OUTPUT 5 pF Including Jig and Scope (For TCLZ , TOLZ , TCHZ , TOHZ , TWHZ , TOW )
3.0V
90% 10% 5 nS
90% 10% 5 nS
0V
-3-
Publication Release Date: May 2000 Revision A1
Preliminary W24256
AC CHARACTERISTICS
(VDD = 5V 10%, VSS = 0V, TA = 0 to 70 C)
Read Cycle
PARAMETER SYM. W24256-35 MIN. Read Cycle Time Address Access Time Chip Select Access Time Output Enable to Output Valid Chip Selection to Output in Low Z Output Enable to Output in Low Z Chip Deselection to Output in High Z Output Disable to Output in High Z Output Hold from Address Change These parameters are sampled but not 100% tested. TRC TAA TACS TAOE TCLZ TOLZ TCHZ TOHZ TOH 35 3 0 3 MAX. 35 35 12 7 7 nS nS nS nS nS nS nS nS nS UNIT
Write Cycle
PARAMETER SYM. W24256-35 MIN. Write Cycle Time Chip Selection to End of Write Address Valid to End of Write Address Setup Time Write Pulse Width Write Recovery Time Data Valid to End of Write Data Hold from End of Write Write to Output in High Z Output Disable to Output in High Z Output Active from End of Write These parameters are sampled but not 100% tested.
CS , WE
UNIT
MAX. 5 5 nS nS nS nS nS nS nS nS nS nS nS
TWC TCW TAW TAS TWP TWR TDW TDH TWHZ TOHZ TOW
35 20 20 0 15 1.5 10 0 3
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Preliminary W24256
TIMING WAVEFORMS
Read Cycle 1
(Address Controlled)
TRC Address TOH DOUT TAA TOH
Read Cycle 2
(Chip Select Controlled)
CS TACS DOUT TCLZ TCHZ
Read Cycle 3
(Output Enable Controlled)
T RC Address TAA OE TAOE TOLZ CS TACS DOUT TCLZ T CHZ TOHZ TOH
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Publication Release Date: May 2000 Revision A1
Preliminary W24256
Timing Waveforms, continued
Write Cycle 1
(OE Clock)
TWC Address T WR OE
TCW CS TAW WE TAS TOHZ D OUT T DW D IN TDH (1, 4) TWP
Write Cycle 2
(OE = VIL Fixed)
TWC Address TCW CS TAW WE TAS TWP TWHZ (1, 4) TOH (2) TOW (3) TWR
DOUT
TDW DIN
TDH
Notes: 1. During this period, I/O pins are in the output state, so input signals of opposite phase to the outputs should not be applied. 2. The data output from DOUT are the same as the data written to DIN during the write cycle. 3. DOUT provides the read data for the next address. 4. Transition is measured 500 mV from steady state with CL = 5 pF. This parameter is guaranteed but not 100% tested.
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Preliminary W24256
ORDERING INFORMATION
PART NO. ACCESS TIME (nS) 35 35 35 OPERATING CURRENT MAX. (mA) 110 110 110 STANDBY CURRENT MAX. (mA) 1 1 1 PACKAGE
W24256J-35 W24256S-35 W24256Q-35
Notes:
300 mil SOJ 330 mil SOP Standard type one TSOP
1. Winbond reserves the right to make changes to its products without prior notice. 2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in applications where personal injury might occur as a consequence of product failure.
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Publication Release Date: May 2000 Revision A1
Preliminary W24256
PACKAGE DIMENSIONS
28-pin Small Outline J Band
Dimension in Inches
Dimension in mm
Symbol
Min. Nom. Max. Min. Nom. Max.
0.140 0.027 0.095 0.026 0.016 0.008 0.100 0.028 0.018 0.010 0.710 0.295 0.044 0.245 0.327 0.077 0.300 0.050 0.265 0.337 0.087 0.105 0.032 0.022 0.014 0.730 0.305 0.056 0.285 0.347 0.097 0.045 0.004 0 10 0 7.49 1.12 6.22 8.31 1.96 0.69 2.41 0.66 0.41 0.20 2.54 0.71 0.46 0.25 18.03 7.62 1.27 6.73 8.56 2.21 2.67 0.81 0.56 0.36 18.54 7.75 1.42 7.24 8.81 2.46 1.14 0.10 10 3.56
28
15
E
HE
1
14
D c A2 A L c e A1 y e1
A A1 A2 b1 b c D E e e1 HE L S y
Notes:
s Seating Plane
b b1
1. Dimensions D Max. & S include mold flash or tie bar burrs. 2. Dimension b does not include dambar protrusion/intrusion. 3. Dimensions D & E include mold mismatch and are determined at the mold parting line. 4. Controlling dimension: Inches. 5. General appearance spec. should be based on final visual inspection spec.
28-pin SO Wide Body
Symbol
Dimension in Inches
0.112 0.004 0.093 0.014 0.008 0.098 0.016 0.010 0.713 0.326 0.044 0.453 0.028 0.059 0.331 0.050 0.465 0.036 0.067 0.103 0.020 0.014 0.733 0.336 0.056 0.477 0.044 0.075 0.047 0.004 0 10
Dimension in mm
2.85 0.10 2.36 0.36 0.20 2.49 0.41 0.25 18.11 8.28 1.12 11.51 0.71 1.50 8.41 1.27 11.81 0.91 1.70 2.62 0.51 0.36 18.62 8.53 1.42 12.12 1.12 1.91 1.19 0.10 0 10
Min. Nom. Max. Min. Nom. Max.
28
15
e1
E
HE
L
Detail F
1 b 14
A A1 A2 b c D E e HE L LE S y Notes:
D
e1 c
2 AA
S
e
y
A
1
LE
See Detail F Seating Plane
1. Dimensions D Max. & S include mold flash or tie bar burrs. 2. Dimension b does not include dambar protrusion/intrusion. 3. Dimensions D & E include mold mismatch and are determined .at the mold parting line. 4. Controlling dimension: Inches. 5. General appearance spec should be based on final visual inspection spec.
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Preliminary W24256
Package Dimensions, continued
28-pin Standard Type One TSOP
HD
Symbol
Dimension in Inches Min. Nom. Max.
0.047 0.002 0.035 0.007 0.004 0.461 0.311 0.520 0.040 0.008 0.006 0.465 0.315 0.528 0.022 0.020 0.024 0.010 0.000 0 3 0.004 5 0.028 0.006 0.041 0.011 0.008 0.469 0.319 0.536
Dimension in mm Min. Nom. Max.
1.20 0.05 0.95 0.17 0.10 11.70 7.90 13.20 1.00 0.20 0.15 11.80 8.00 13.40 0.55 0.50 0.60 0.25 0.00 0 3 0.10 5 0.70 0.15 1.05 0.27 0.21 11.90 8.10 13.60
D c A A1 A2 b c D E HD e L L1 Y
e E
b
L L1
A1 A2 A
Y
Note: Controlling dimension: Millimeters
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Publication Release Date: May 2000 Revision A1
Preliminary W24256
VERSION HISTORY
VERSION A1 DATE May 2000 PAGE Initial Issued DESCRIPTION
Headquarters
Winbond Electronics (H.K.) Ltd.
Unit 9-15, 22F, Millennium City, No. 4, Creation Rd. III, No. 378 Kwun Tong Rd; Science-Based Industrial Park, Kowloon, Hong Kong Hsinchu, Taiwan TEL: 852-27513100 TEL: 886-3-5770066 FAX: 852-27552064 FAX: 886-3-5796096 http://www.winbond.com.tw/ Voice & Fax-on-demand: 886 -2-27197006
Winbond Electronics North America Corp. Winbond Memory Lab. Winbond Microelectronics Corp. Winbond Systems Lab.
2727 N. First Street, San Jose, CA 95134, U.S.A. TEL: 408-9436666 FAX: 408-5441798
Taipei Office
11F, No. 115, Sec. 3, Min -Sheng East Rd., Taipei, Taiwan TEL: 886-2-27190505 FAX: 886-2-27197502
Note: All data and specifications are subject to change withou t notice.
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