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CD54/74HC365, CD54/74HCT365, CD54/74HC366 Data sheet acquired from Harris Semiconductor SCHS180A November 1997 - Revised May 2000 High Speed CMOS Logic Hex Buffer/Line Driver, Three-State Non-Inverting and Inverting bus capacitances. These circuits possess the low power dissipation of CMOS circuitry, yet have speeds comparable to low power Schottky TTL circuits. Both circuits are capable of driving up to 15 low power Schottky inputs. The 'HC365 and 'HCT365 are non-inverting buffers, whereas the 'HC366 is an inverting buffer. These devices have two three-state control inputs (OE1 and OE2) which are NORed together to control all six gates. The 'HCT365 logic families are speed, function and pin compatible with the standard LS logic family. Features * Buffered Inputs [ /Title (CD74 HC365 , CD74 HCT36 5, CD74 HC366 , CD74 HCT36 6) /Subject High peed * High Current Bus Driver Outputs * Typical Propagation Delay tPLH, tPHL = 8ns at VCC = 5V, CL = 15pF, TA = 25oC * Fanout (Over Temperature Range) - Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads - Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads * Wide Operating Temperature Range . . . -55oC to 125oC * Balanced Propagation Delay and Transition Times * Significant Power Reduction Compared to LSTTL Logic ICs * HC Types - 2V to 6V Operation - High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V * HCT Types - 4.5V to 5.5V Operation - Direct LSTTL Input Logic Compatibility, VIL= 0.8V (Max), VIH = 2V (Min) - CMOS Input Compatibility, Il 1A at VOL, VOH Ordering Information PART NUMBER CD54HC365F3A CD74HC365E CD74HC365M CD54HCT365F3A CD74HCT365E CD74HCT365M CD54HC366F3A CD74HC366E CD74HC366M NOTES: 1. When ordering, use the entire part number. Add the suffix 96 to obtain the variant in the tape and reel. 2. Wafer or die for this part number is available which meets all electrical specifications. Please contact your local TI sales office or customer service for ordering information. TEMP. RANGE (oC) -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 PACKAGE 16 Ld CERDIP 16 Ld PDIP 16 Ld SOIC 16 Ld CERDIP 16 Ld PDIP 16 Ld SOIC 16 Ld CERDIP 16 Ld PDIP 16 Ld SOIC Description The 'HC365, 'HCT365, and 'HC366 silicon gate CMOS threestate buffers are general purpose high-speed non-inverting and inverting buffers. They have high drive current outputs which enable high speed operation even when driving large Pinout CD54HC365, CD54HCT365, CD54HC366 (CERDIP) CD74HC365, CD74HCT365, CD74HC366 (PDIP, SOIC) TOP VIEW OE1 1 1A 2 (1Y) 1Y 3 2A 4 (2Y) 2Y 5 3A 6 (3Y) 3Y 7 GND 8 16 VCC 15 OE2 14 6A 13 6Y (6Y) 12 5A 11 5Y (5Y) 10 4A 9 4Y (4Y) CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright (c) 2000, Texas Instruments Incorporated 1 CD54/74HC365, CD54/74HCT365, CD54/74HC366 Functional Diagrams HC365, HCT365 1 HC366 OE1 1 16 VCC OE1 16 VCC 1A 2 3 15 14 OE2 6A 1A 2 3 15 14 OE2 6A 1Y 1Y 2A 4 13 6Y 2A 4 13 6Y 2Y 5 6 12 5A 2Y 5 6 12 5A 3A 7 11 10 5Y 3A 7 11 10 5Y 3Y 4A 9 3Y 4A 9 GND 8 4Y GND 8 4Y TRUTH TABLE OUTPUTS (Y) A L H X X HC/HCT365 L H Z Z HC366 H L Z INPUTS OE1 L L X H OE2 L L H X NOTE: H = High Voltage Level L = Low Voltage Level X = Don't Care Z = High Impedance (OFF) State 2 CD54/74HC365, CD54/74HCT365, CD54/74HC366 Logic Diagram VCC 16 ONE OF SIX IDENTICAL CIRCUITS 2 1A 3 1Y (NOTE) GND 8 1 OE1 4 15 OE2 6 3A 10 4A 12 5A 14 6A 7 3Y 9 4Y 11 5Y 2A 5 2Y 13 6Y NOTE: Inverter not included in HC/HCT365. FIGURE 1. LOGIC DIAGRAM FOR THE HC/HCT365 AND HC366 (OUTPUTS FOR HC/HCT365 ARE COMPLEMENTS OF THOSE SHOWN, i.e., 1Y, 2Y, ETC.) 3 CD54/74HC365, CD54/74HCT365, CD54/74HC366 Absolute Maximum Ratings DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V DC Input Diode Current, IIK For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .20mA DC Output Diode Current, IOK For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .20mA DC Drain Current, per Output, IO For -0.5V < VO < VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .35mA DC Output Source or Sink Current per Output Pin, IO For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .25mA DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .50mA Thermal Information Thermal Resistance (Typical, Note 3) JA (oC/W) PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115 Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) Operating Conditions Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC Input Rise and Fall Time 2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max) 4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max) 6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max) CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 3. JA is measured with the component mounted on an evaluation PC board in free air. DC Electrical Specifications TEST CONDITIONS PARAMETER HC TYPES High Level Input Voltage VIH 2 4.5 6 Low Level Input Voltage VIL 2 4.5 6 High Level Output Voltage CMOS Loads High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current II ICC VCC or GND VCC or GND VOL VIH or VIL VOH VIH or VIL -0.02 -0.02 -0.02 -6 -7.8 0.02 0.02 0.02 6 7.8 0 2 4.5 6 4.5 6 2 4.5 6 4.5 6 6 6 1.5 3.15 4.2 1.9 4.4 5.9 3.98 5.48 0.5 1.35 1.8 0.1 0.1 0.1 0.26 0.26 0.1 8 1.5 3.15 4.2 1.9 4.4 5.9 3.84 5.34 0.5 1.35 1.8 0.1 0.1 0.1 0.33 0.33 1 80 1.5 3.15 4.2 1.9 4.4 5.9 3.7 5.2 0.5 1.35 1.8 0.1 0.1 0.1 0.4 0.4 1 160 V V V V V V V V V V V V V V V V A A SYMBOL VI (V) IO (mA) VCC (V) MIN 25oC TYP MAX -40oC TO 85oC MIN MAX -55oC TO 125oC MIN MAX UNITS 4 CD54/74HC365, CD54/74HCT365, CD54/74HC366 DC Electrical Specifications (Continued) TEST CONDITIONS PARAMETER Three-State Leakage Current HCT TYPES High Level Input Voltage Low Level Input Voltage High Level Output Voltage CMOS Loads High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current Additional Quiescent Device Current Per Input Pin: 1 Unit Load (Note 4) Three-State Leakage Current NOTE: 4. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA. II ICC ICC VCC to GND VCC or GND VCC -2.1 VOL VIH or VIL VIH VIL VOH VIH or VIL -0.02 4.5 to 5.5 4.5 to 5.5 4.5 2 4.4 0.8 2 4.4 0.8 2 4.4 0.8 V V V SYMBOL IOZ VI (V) VIL or VIH IO (mA) VCC (V) VO = VCC or GND 6 MIN 25oC TYP MAX 0.5 -40oC TO 85oC MIN MAX 5.0 -55oC TO 125oC MIN MAX 10 UNITS A -4 4.5 3.98 - - 3.84 - 3.7 - V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 4 4.5 - - 0.26 - 0.33 - 0.4 V 0 0 - 5.5 5.5 4.5 to 5.5 - 100 0.1 8 360 - 1 80 450 - 1 160 490 A A A IOZ VIL or VIH VO = VCC or GND 5.5 - - 0.5 - 5.0 - 10 A HCT Input Loading Table INPUT OE1 All Others UNIT LOADS 0.6 0.55 NOTE: Unit Load is ICC limit specified in DC Electrical Specifications table, e.g., 360A max at 25oC. Switching Specifications - HC/HCT365 Input tr, tf = 6ns 25oC VCC (V) 2 4.5 6 TYP MAX -40oC TO 85oC MAX -55oC TO 125oC MAX UNITS PARAMETER HC TYPES Propagation Delay, Data to Outputs HC/HCT365 SYMBOL TEST CONDITIONS tPLH, tPHL CL = 50pF 8 105 21 18 - 130 26 22 - 160 32 27 - ns ns ns ns CL = 15pF 5 5 CD54/74HC365, CD54/74HCT365, CD54/74HC366 Switching Specifications - HC/HCT365 Input tr, tf = 6ns (Continued) 25oC VCC (V) 2 4.5 6 CL = 15pF Propagation Delay, Output Enable and Disable to Outputs tPLH, tPHL CL = 50pF 5 2 4.5 6 CL = 15pF Output Transition Time tTLH, tTHL CL = 50pF 5 2 4.5 6 Input Capacitance Three-State Output Capacitance Power Dissipation Capacitance (Notes 5, 6) HCT TYPES Propagation Delay, Data to Outputs HC/HCT365 Propagation Delay, Data to Outputs HC366 Propagation Delay, Output Enable and Disable to Outputs Output Transition Time Input Capacitance Three-State Capacitance Power Dissipation Capacitance (Notes 5, 6) NOTES: 5. CPD is used to determine the dynamic power consumption, per buffer. 6. PD = VCC2fi (CPD + CL) where fi = Input Frequency, CL = Output Load Capacitance, VCC = Supply Voltage. tPLH, tPHL CL = 50pF CL = 15pF tPLH, tPHL CL = 50pF CL = 15pF tPLH, tPHL CL = 50pF CL = 15pF tTLH, tTHL CIN CO CPD CL = 50pF 4.5 5 4.5 5 4.5 5 4.5 5 9 11 14 42 25 27 35 12 10 20 31 34 44 15 10 20 38 41 53 18 10 20 ns ns ns ns ns ns ns pF pF pF CI CO CPD 5 TYP 9 12 40 MAX 110 22 19 150 30 26 60 12 10 10 20 -40oC TO 85oC MAX 140 28 24 190 38 33 75 15 13 10 20 -55oC TO 125oC MAX 165 33 28 225 45 38 90 18 15 10 20 UNITS ns ns ns ns ns ns ns ns ns ns ns pF pF pF PARAMETER Propagation Delay, Data to Outputs HC366 SYMBOL tPLH, tPHL TEST CONDITIONS CL = 50pF 6 CD54/74HC365, CD54/74HCT365, CD54/74HC366 Test Circuits and Waveforms tr = 6ns INPUT 90% 50% 10% tTLH 90% 50% 10% tPHL tPLH tf = 6ns VCC INPUT GND tTHL tr = 6ns 2.7V 1.3V 0.3V tTLH 90% INVERTING OUTPUT tPHL tPLH 1.3V 10% tf = 6ns 3V GND tTHL INVERTING OUTPUT FIGURE 2. HC TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC 6ns OUTPUT DISABLE 90% 50% 10% tPZL 50% 10% tPHZ OUTPUT HIGH TO OFF OUTPUTS ENABLED 90% 50% OUTPUTS DISABLED OUTPUTS ENABLED tPZH 6ns VCC GND FIGURE 3. HCT TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC tr OUTPUT DISABLE 6ns tf 2.7 1.3 tPLZ OUTPUT LOW TO OFF tPHZ OUTPUT HIGH TO OFF OUTPUTS ENABLED 90% 6ns 3V 0.3 tPZL GND tPLZ OUTPUT LOW TO OFF 10% tPZH 1.3V 1.3V OUTPUTS DISABLED OUTPUTS ENABLED FIGURE 4. HC THREE-STATE PROPAGATION DELAY WAVEFORM FIGURE 5. HCT THREE-STATE PROPAGATION DELAY WAVEFORM OTHER INPUTS TIED HIGH OR LOW OUTPUT DISABLE IC WITH THREESTATE OUTPUT OUTPUT RL = 1k CL 50pF VCC FOR tPLZ AND tPZL GND FOR tPHZ AND tPZH NOTE: Open drain waveforms tPLZ and tPZL are the same as those for three-state shown on the left. The test circuit is Output RL = 1k to VCC, CL = 50pF. FIGURE 6. HC AND HCT THREE-STATE PROPAGATION DELAY TEST CIRCUIT 7 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. Customers are responsible for their applications using TI components. In order to minimize risks associated with the customer's applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI's publication of information regarding any third party's products or services does not constitute TI's approval, warranty or endorsement thereof. Copyright (c) 2000, Texas Instruments Incorporated |
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