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 DICE SPECIFICATION RH1009 2.5V Reference
2
DIE CROSS REFERENCE
3
LTC Finished Part Number RH1009 RH1009
Order DICE CANDIDATE Part Number Below RH1009 DICE RH1009 DWF
PAD FUNCTION
1. V + 2. ADJ 3. V - NOTE: CONNECT SUBSTRATE TO V -
1
50 x 54 mils
DICE ELECTRICAL TEST LI ITS
SYMBOL VZ
V
PARAMETER Reverse Breakdown Voltage Reverse Breakdown Voltage Change with Current
IR
Z
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
W
TJ = 25C. Preirradiation
CONDITIONS IR = 1mA 400A IR 10mA MIN 2.495 MAX 2.505 6 UNITS V mV
1
DICE SPECIFICATION RH1009
Wafer level testing is performed per the indicated specifications for dice. Considerable differences in performance can often be observed for dice versus packaged units due to the influences of packaging and assembly on certain devices and/or parameters. Please consult factory for more information on dice performance and lot qualifications via lot sampling test procedures. Dice data sheet subject to change. Please consult factory for current revision in production.
I.D.No. 66-13-1009
2
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 FAX: (408) 434-0507
LT/LT 0203 PRINTED IN USA
www.linear.com
(c) LINEAR TECHNOLOGY CORPORATION 2003


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