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Semiconductor MS52C181A 131,072-Word X 8-Bit STATIC RAM + 1,048,576-Word X 8-Bit One Time PROM DESCRIPTION 1998.6 Preliminary The MS52C181A is a131,072-word by 8-bit electrically switchable 1Mb static RAM and 1,048,576-word by 8-bit electrically switchable 8Mb One Time PROM featuring 2.7V to 3.6V power supply operation and direct LVTTL input / output compatibility. Since the circuitry is completely static,external clocks are unnecessary,making this device very easy to use. The MS52C181A is packaged in 44-pin plastic TSOP and 48-pin FBGA (9mmx10mm) ,suited for use in handy terminal and other application which required small space. FEATURES * 131,072-word x 8-bit configuration SRAM and 1,048,576-word x 8-bit configuration OTP * Power supply voltage : 2.7 to 3.6V * Fully static operation * Operating temperature range : Ta= -20 to 70C * Access time : 100nS MAX (Vcc=2.7V) 80nS MAX (Vcc=3.0V) * Common address inputs and data inputs / outputs for SRAM and OTP * Input / Output LVTTL compatible * 3-state output * Data retention available at power supply voltage 1.5V for SRAM * Package options : 44-pin plastic TSOP (Type II) 48-pin plastic FBGA (TSOP44-P-400-0.8) (FBGA48-P-0910-0.8) (Product : MS52C181ATA) (Product : MS52C181ALA) 1 MS52C181A PIN CONFIGURATION (TOP VIEW) A17 A15 A14 A13 A12 A11 A10 A9 CEs 1 2 3 4 5 6 7 8 9 44 A18 43 CEo 42 A16 41 I/O7 40 NC 39 I/O6 38 NC 37 I/O5 36 NC 35 I/O4 34 GND 33 VCC 32 NC 31 I/O3 30 NC 29 I/O2 28 NC 27 I/O1 26 NC 25 I/O0 24 OE 23 A19 VPP 10 VCC 11 GND 12 WE 13 A8 14 A7 15 A6 16 A5 17 A4 18 A3 19 A2 20 A1 21 A0 22 44-pin TSOP (II) 2 MS52C181A PIN CONFIGURATION (TOP VIEW) A B C D E F G H 6 A1 A4 A7 GND VCC A9 A12 A15 5 A0 A3 A6 WE VPP A10 A13 A17 4 NC A2 A5 A8 CEs A11 A14 NC 3 NC I/O0 NC I/O3 NC I/O6 A16 NC 2 A19 NC I/O2 NC I/O4 NC I/O7 A18 1 OE I/O1 NC VCC GND I/O5 NC CEo 48-pin FBGA Pin Name A0 - A16 A17 - A19 CEs CEo WE OE I/O0 - I/O7 VCC VPP GND NC Function Common Address Inputs Address Inputs for OTP Chip Enable for SRAM Chip Enable for OTP Write Enable for SRAM Common Output Enable Common Data Inputs / Outputs Common Power Supply Program Power Supply for OTP Common Ground No Connection 3 MS52C181A BLOCK DIAGRAM VCC VPP GND A0 A1 A2 A3 Row Decoder Row Decoder Column Decoder A16 A17 A18 A19 Multiplexer Column Decoder . . . . . . . . . . . . . . . . Address Buffer SRAM Memory Array 128kw x 8b OTP Memory Array 1Mw x 8b Multiplexer CEs WE OE Control CEo Output Buffer I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 FUNCTION TABLE Operating Mode Standby SRAM Read SRAM Write OTP Read OTP Program OTP Program Inhibit OTP Program Verify CEo H H H H L L L H H CEs H L L L H H H H H WE * H H L * * * * * OE * H L * H L H H L VPP * * * * * * 9.75V VCC I/O0 to I/O7 High-Z High-Z DOUT DIN High-Z DOUT DIN High-Z DOUT 2.7V to 3.6V 4.0V Note : 1. * = Don't Care ("H" or "L") 2. It is forbidden to apply CEo="L" and CEs="L" simultaneously. 4 MS52C181A ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings Parameter Power Supply Voltage Input Voltage Output Voltage Power Dissipation Operating Temperature Storage Temperature Symbol VCC VPP VI VO PD Topr Tstg Condition Rating -0.5 to 5.0 -0.5 to 11.5 -0.5* to Vcc+0.5 -0.5* to Vcc+0.5 0.7 -20 to 70 -55 to 125 Unit V V V V W C C Respect to GND Ta=25C * -1.2VMin. for pulse width less than 30nS. Recommended Operating Conditions Parameter Power Supply Voltage SRAM Data Retention Voltage Input High Voltage Input Low Voltage Symbol VCC VPP GND VCCH VIH VIL Vcc=2.7 to 3.6 Condition Min. 2.7 -0.5 0 1.5 2.2 -0.5* Typ. (Ta= -20 to 70C) Max. 3.6 Vcc+0.5 0 3.6 Vcc+0.5 0.4 Unit V V V V V V 0 * -1.2VMin. for pulse width less than 30nS. Capacitance Parameter Symbol Input Capacitance CIN Input/Output Capacitance CI/O Condition V I=0V VO=0V (Vcc=3.3V , Ta=25C , f=1MHz) Min. Typ. Max. 10 10 Unit pF pF Note : This parameter is periodically sampled and not 100% tested. 5 MS52C181A DC Characteristics (1) Parameter Input Leakage Current Symbol Condition VIN=0 to VCC CEo=VIH , CEs=VIH or OE=VIH or WE=VIL VOUT=0 to VCC IOH=-500A IOL=2.1mA CEoVCC-0.2V CEsVCC-0.2V VIN=0 to VCC CEo=VIH CEs=VIH VIN=VIH or VIL CEo=VIH CEs=VIL OE=VIH VIN=VIH/VIL TCYC=100nS (Vcc=3.0V0.3V,Ta=-20 to 70C) Min. -1.0 Typ. Max. 1.0 Unit A ILI Output Leakage Current ILO -1.0 1.0 A Output High Voltage Output Low Voltage VOH VOL Vcc-0.5 0.4 10 V V A ICCS Standby Power Supply Current ICCS1 0.3 mA 35 mA ICCA (SRAM) CEoVCC-0.2V Operating Power Supply Current CEs0.2V OEVCC-0.2V VIHVCC-0.2V VIL0.2V TCYC=1S CEo=VIL CEs=VIH OE=VIH VIN=VIH/VIL TCYC=100nS CEo0.2V CEsVCC-0.2V OEVCC-0.2V VIHVCC-0.2V VIL0.2V TCYC=1S VPP=VCC 10 mA 35 mA ICCA* (OTP) 20 mA VPP Power Supply Current * Read Current IPP 10 A 6 MS52C181A DC Characteristics (2) Parameter Input Leakage Current Symbol Condition VIN=0 to VCC CEo=VIH , CEs=VIH or OE=VIH or WE=VIL VOUT=0 to VCC IOH=-500A IOL=2.1mA CEoVCC-0.2V CEsVCC-0.2V VIN=0 to VCC CEo=VIH CEs=VIH VIN=VIH or VIL CEo=VIH CEs=VIL OE=VIH VIN=VIH/VIL TCYC=80nS (Vcc=3.3V0.3V,Ta=-20 to 70C) Min. -1.0 Typ. Max. 1.0 Unit A ILI Output Leakage Current ILO -1.0 1.0 A Output High Voltage Output Low Voltage VOH VOL Vcc-0.5 0.4 10 V V A ICCS Standby Power Supply Current ICCS1 0.3 mA 40 mA ICCA (SRAM) CEoVCC-0.2V Operating Power Supply Current CEs0.2V OEVCC-0.2V VIHVCC-0.2V VIL0.2V TCYC=1S CEo=VIL CEs=VIH OE=VIH VIN=VIH/VIL TCYC=80nS CEo0.2V CEsVCC-0.2V OEVCC-0.2V VIHVCC-0.2V VIL0.2V TCYC=1S VPP=VCC 15 mA 40 mA ICCA* (OTP) 25 mA VPP Power Supply Current * Read Current IPP 10 A 7 MS52C181A SRAM AC Characteristics SRAM Read Cycle (1) Parameter Read Cycle Time Address Access Time CEs Access Time OE Access Time CEs to Output in Low-Z OE to Output in Low-Z Output Hold from Address Change CEs to Output in High-Z OE to Output in High-Z Symbol Condition (Vcc=3.0V0.3V,Ta=-20 to 70C) tRC tAA tCO tOE tCLZ tOLZ tOH tCHZ tOHZ Min. 100 Max. 100 100 50 10 5 10 35 35 Unit nS nS nS nS nS nS nS nS nS SRAM Write Cycle (1) Parameter Write Cycle Time Address Setup Time Write Pulse Width Write Recovery Time Data Setup Time Data Hold Time WE to Output in High-Z CEs to End of Write Address Valid to End of Write Output Active from End of Write Symbol Condition tWC tAS tWP tWR tDS tDH tWHZ tCW tAW tWLZ (Vcc=3.0V0.3V,Ta=-20 to 70C) Min. Max. Unit 100 nS 0 nS 75 nS 0 nS 40 nS 0 nS 35 nS 90 nS 90 nS 5 nS Test Condition Input Pulse Levels ------------------------- 0.4V/2.4V Input Timing Reference Levels --------- 0.8V/2.0V Output Load --------------------------------- 50pF Output Timing Reference Levels ------- 0.8V/2.0V Input Rise and Fall Time ----------------- 5nS 1.85V 690 Dout 50pF (Including scope and jig capacitance) 8 MS52C181A SRAM Read Cycle (2) Parameter Read Cycle Time Address Access Time CEs Access Time OE Access Time CEs to Output in Low-Z OE to Output in Low-Z Output Hold from Address Change CEs to Output in High-Z OE to Output in High-Z Symbol Condition (Vcc=3.3V0.3V,Ta=-20 to 70C) tRC tAA tCO tOE tCLZ tOLZ tOH tCHZ tOHZ Min. 80 Max. 80 80 40 10 5 10 30 30 Unit nS nS nS nS nS nS nS nS nS SRAM Write Cycle (2) Parameter Write Cycle Time Address Setup Time Write Pulse Width Write Recovery Time Data Setup Time Data Hold Time WE to Output in High-Z CEs to End of Write Address Valid to End of Write Output Active from End of Write Symbol Condition tWC tAS tWP tWR tDS tDH tWHZ tCW tAW tWLZ (Vcc=3.3V0.3V,Ta=-20 to 70C) Min. Max. Unit 80 nS 0 nS 60 nS 0 nS 35 nS 0 nS 30 nS 70 nS 70 nS 5 nS Test Condition Input Pulse Levels ------------------------- 0.4V/2.4V Input Timing Reference Levels --------- 0.8V/2.0V Output Load --------------------------------- 50pF Output Timing Reference Levels ------- 0.8V/2.0V Input Rise and Fall Time ----------------- 5nS 1.85V 690 Dout 50pF (Including scope and jig capacitance) 9 MS52C181A SRAM Timing Diagrams SRAM Read Cycle tRC A0 - A16 tAA tCO CEs tCHZ tCLZ OE tOHZ tOE I/O0 - I/O7 tOH Valid Data-Out tOLZ Notes : 1. A read cycle of SRAM occurs during the overlap of CEo="H", CEs="L", OE="L" and WE="H". 2. tOHZ , tCHZ are specified by the time when DATA is floating , not defined by the output level. SRAM Write Cycle tWC A0 - A16 tCW CEs tAW WE tAS tWP tDS tWR tDH Din Data-In tWHZ Dout tWLZ 10 MS52C181A Notes : 1. A write cycle of SRAM occurs during the overlap of CEo="H" , CEs="L" and WE="L". 2. OE may be either of "H" or "L" in the write cycle of SRAM. 3. tAS is specified from CEs="L" or WE="L" , whichever occurs last. 4. tWP is an overlap time of CEs="L" and WE="L". 5. tWR , tDS , tDH are specified from CEs="H" or WE="H" , whichever occurs first. 6. tWHZ is specified by the time when DATA output is floating , not defined by the output level. 7. When I/O pins are in the output mode , don't apply the inverted input signal to the output pins. SRAM Data Retention Characteristics Parameter Data Retention Power Supply Voltage (Ta=-20 to 70C) Min. 1.5 Typ. Max. Unit V Symbol VCCH Condition CEoVCC-0.2V CEsVCC-0.2V VIN=0 to VCC VCC=1.5V CEoVCC-0.2V CEsVCC-0.2V VIN=0 to VCC Data Retention Power Supply Current ICCH 3 A Chip Deselect to Data Retention Time Operation Recovery Time tCDR tR 0 nS 5 mS tCDR VCC 2.7V VIH VCCH CEs 0V Data Retention Mode tR CEsVCC-0.2V 11 MS52C181A OTP AC Characteristics (1) OTP Read Cycle (1) Parameter Read Cycle Time Address Access Time CEo Access Time OE Access Time CEo to Output in High-Z OE to Output in High-Z Output Hold from Address Change Symbol Condition CEo=OE=VIL OE=VIL CEo=VIL OE=VIL CEo=VIL CEo=OE=VIL (Vcc=3.0V0.3V,Ta=-20 to 70C) tRC tAA tCO tOE tCHZ tOHZ tOH Min. 100 Max. 100 100 50 40 35 0 0 0 Unit nS nS nS nS nS nS nS OTP Read Cycle (2) Parameter Read Cycle Time Address Access Time CEo Access Time OE Access Time CEo to Output in High-Z OE to Output in High-Z Output Hold from Address Change Symbol Condition CEo=OE=VIL OE=VIL CEo=VIL OE=VIL CEo=VIL CEo=OE=VIL (Vcc=3.3V0.3V,Ta=-20 to 70C) tRC tAA tCO tOE tCHZ tOHZ tOH Min. 80 Max. 80 80 50 40 35 0 0 0 Unit nS nS nS nS nS nS nS Test Condition Input Pulse Levels ------------------------- 0.4V/2.4V Input Timing Reference Levels --------- 0.8V/2.0V Output Load --------------------------------- 50pF Output Timing Reference Levels ------- 0.8V/2.0V Input Rise and Fall Time ----------------- 5nS 1.85V 690 Dout 50pF (Including scope and jig capacitance) 12 MS52C181A OTP Timing Diagrams OTP Read Cycle tRC A0 - A19 tAA tCO CEo tCHZ tOHZ OE tOE I/O0 - I/O7 tOH Valid Data-Out Notes : 1. A read cycle of OTP occurs during the overlap of CEo="L", CEs="H" and OE="L". 2. tOHZ , tCHZ are specified by the time when DATA is floating , not defined by the output level. OTP DC Characteristics OTP Programming Operation Parameter Input Leakage Current Program Power Supply Current Power Supply Current Input High Voltage Input Low Voltage Output High Voltage Output Low Voltage Program Voltage VCC Voltage Symbol (Ta=25C5C) ILI IPP2 ICC VIH VIH VOH VOL VPP VCC Condition VI=VCC+0.5V CEo=VIL Min. Typ. Max. 10 50 50 VCC+0.5 0.8 0.45 10.0 4.1 Unit A mA mA V V V V V V IOH=-500A IOL=2.1mA 3.0 -0.5 2.4 9.5 3.9 9.75 4.0 13 MS52C1161A OTP AC Characteristics (2) OTP Programming Operation Parameter Address Setup Time OE Setup Time Data Setup Time Address Hold Time Data Hold Time OE to Output in High-Z VPP Power Setup Time Program Pulse Width Data Valid from OE Symbol (Vcc=4.0V0.1V,VPP=9.75V0.25V,Ta=25C5C) Condition tAS tOES tDS tAH tDH tDFP tVS tPW tOE Min. 2 2 2 0 2 0 2 9 Typ. Max. 130 10 11 150 Unit S S S S S nS S S nS OTP Programming Waveform A0 - A19 tAS CEo tPW tAH tOES OE tDFP tDS I/O0 - I/O7 DIN tDH tCE DOUT tVS Vpp Program Program Verify Note : When OTP is programming mode , CEs should be "H" level. 14 MS52C181A Pin Check Function Pin Check Function is to check contact between each device-pin and each socket-lead with EPROM programmer. Setting up address as the following condition call the preprogrammed codes on device outputs. (Vcc=3.3V0.3V,CEo=VIL,Ta=25C5C) A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A17 A18 A19 DATA 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 VH* VH* 0 1 1 0 0 1 1 0 0 1 1 0 0 1 0 1 1 0 00 FF * :VH=8V 15 MS52C181A OTP Programming / Verify Flow Chart Programming Verify Start Start NO Pin Check Bad Insertion NO Pin Check OK Address = First location VCC=3.0V VPP=3.0V NG OK Address = First location Bad Insertion VCC=4.0V VPP=9.75V Verify (One Byte) PASS VCC=3.6V VPP=3.6V Program 10s Increment Address NO Last Address ? YES Address = First location Verify (One Byte) PASS Device Passed X=0 Device Failed NG NG Verify (One Byte) PASS NO Increment Address Last Address ? YES VCC=3.0V VPP=3.0V YES X=5? NO Program 10s X=X+1 NG Verify (One Byte) PASS Device Passed Device Failed 16 Semiconductor NOTICE The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-todate. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. Neither indemnity against nor license of a third party's industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party's right which may result from the use thereof. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system orapplication that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. No part of the contents cotained herein may be reprinted or reproduced without our prior permission. All brand, company and product names are the trademarks or registered trademarks of their respective owners. Copyright 1998 Oki Electric Industry Co., Ltd. ADDRESSES & SEMICONDUCTOR WEB SITES Ltd., OKI Electric Industry Co., Ltd. Device Business Group, 10-3, Shibaura, 4-chome, Minato-ku, Tokyo 108, Japan, Tel.: +81-(0)3-5445-6327, Fax.: +81-(0)3-5445-6328, http://www.oki.co.jp/OKI/DBG/english/index.htm (NOTE: URL is case sensitive) Group, OKI Semiconductor Group 785 North Mary Avenue, Sunnyvale, CA 94086, U.S.A., Tel.: +1-408-720-1900, Fax.: +1-408-720-1918, http://www.okisemi.com/ GmbH, OKI Electric Europe GmbH Head Office Europe, Hellersbergstrasse 2, D-41460 Neuss, Germany, Tel: +49-2131-15960, Fax: +49-2131-103539, http://www.oki-europe.de/ Ltd., OKI Electronics (Hong Kong) Ltd. Suite 1901-1&19, Tower 3, China Hong Kong City, 33 Canton Road, Tsimshatsui, Kowloon, Hong Kong, Tel.: +852-2-736-2336, Fax.: +852-2-736-2395 Ltd., OKI Semiconductor (Asia) Pte. Ltd. 78 Shenton Way 09-01, Singapore 0207, Tel.: +65-221-3722, Fax.: +65-323-5376 Ltd., OKI Semiconductor (Asia) Pte. Ltd. Taipei Branch, 7th Fl. 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