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 LP3881 0.8A Fast-Response Ultra Low Dropout Linear Regulators
March 2003
LP3881 0.8A Fast-Response Ultra Low Dropout Linear Regulators
General Description
The LP3881 is a high current, fast response regulator which can maintain output voltage regulation with minimum input to output voltage drop. Fabricated on a CMOS process, the device operates from two input voltages: Vbias provides voltage to drive the gate of the N-MOS power transistor, while Vin is the input voltage which supplies power to the load. The use of an external bias rail allows the part to operate from ultra low Vin voltages. Unlike bipolar regulators, the CMOS architectutre consumes extremely low quiescent current at any output load current. The use of an N-MOS power transistor results in wide bandwidth, yet minimum external capacitance is required to maintain loop stability. The fast transient response of these devices makes them suitable for use in powering DSP, Microcontroller Core voltages and Switch Mode Power Supply post regulators. The parts are available in TO-220 and TO-263 packages. Dropout Voltage: 75 mV (typ) @ 0.8A load current. Ground Pin Current: 3 mA (typ) at full load. Shutdown Current: 60 nA (typ) when S/D pin is low. Precision Output Voltage: 1.5% room temperature accuracy.
Features
n n n n n n n n Ultra low dropout voltage (75 mV @ 0.8A typ) Low ground pin current Load regulation of 0.04%/A 60 nA typical quiescent current in shutdown 1.5% output accuracy (25C) TO-220, TO-263 packages Over temperature/over current protection -40C to +125C junction temperature range
Applications
n n n n n n n DSP Power Supplies Server Core and I/O Supplies PC Add-in-Cards Local Regulators in Set-Top Boxes Microcontroller Power Supplies High Efficiency Power Supplies SMPS Post-Regulators
Typical Application Circuit
20063001
At least 4.7 F of input and output capacitance is required for stability.
Connection Diagrams
20063002
20063003
TO-220, Top View
TO-263, Top View
(c) 2003 National Semiconductor Corporation
DS200630
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LP3881
Ordering Information
Order Number LP3881ES-1.2 LP3881ESX-1.2 LP3881ET-1.2 LP3881ES-1.5 LP3881ESX-1.5 LP3881ET-1.5 LP3881ES-1.8 LP3881ESX-1.8 LP3881ET-1.8 Package Type TO263-5 TO263-5 TO220-5 TO263-5 TO263-5 TO220-5 TO263-5 TO263-5 TO220-5 Package Drawing TS5B TS5B T05D TS5B TS5B T05D TS5B TS5B T05D Supplied As Rail Tape and Reel Rail Rail Tape and Reel Rail Rail Tape and Reel Rail
Block Diagram
20063024
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LP3881
Absolute Maximum Ratings
(Note 1)
IOUT (Survival) Output Voltage (Survival) Junction Temperature
Internally Limited -0.3V to +6V -40C to +150C
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Storage Temperature Range Lead Temp. (Soldering, 5 seconds) ESD Rating Human Body Model (Note 3) Machine Model (Note 10) Power Dissipation (Note 2) VIN Supply Voltage (Survival) VBIAS Supply Voltage (Survival) Shutdown Input Voltage (Survival) -65C to +150C 260C 2 kV 200V Internally Limited -0.3V to +6V -0.3V to +7V -0.3V to +7V
Operating Ratings
VIN Supply Voltage Shutdown Input Voltage IOUT Operating Junction Temperature Range VBIAS Supply Voltage (VOUT + VDO) to 5.5V 0 to +6V 0.8A -40C to +125C 4.5V to 6V
Electrical Characteristics Limits in standard typeface are for TJ = 25C, and limits in boldface type apply over the full operating temperature range. Unless otherwise specified: VIN = VO(NOM) + 1V, VBIAS = 4.5V, IL = 10 mA, CIN = COUT = 4.7 F, VS/D = VBIAS.
Symbol VO Parameter Output Voltage Tolerance Conditions 10 mA < IL < 0.8A VO(NOM) + 1V VIN 5.5V 4.5V VBIAS 6V Typical (Note 4) 1.216 1.186 1.478 1.5 1.455 1.773 1.8 1.746 VO/VIN VO/IL VDO IQ(VIN) Output Voltage Line Regulation (Note 7) Output Voltage Load Regulation (Note 8) Dropout Voltage (Note 9) Quiescent Current Drawn from VIN Supply VO(NOM) + 1V VIN 5.5V 10 mA < IL < 0.8A IL = 0.8A 10 mA < IL < 0.8A V IQ(VBIAS) Quiescent Current Drawn from VBIAS Supply
S/D
MIN (Note 5) 1.198
MAX (Note 5) 1.234 1.246 1.522
Units
V 1.545 1.827 1.854 %/V %/A 120 160 7 8 1 30 2 3 1 30 mV mA A mA A A 1.3 0.3
0.01 0.04 0.06 75 3 0.03 1 0.03 1.8 0.7 0.7 20 15 1 -1
0.3V
10 mA < IL < 0.8A V
S/D
0.3V
ISC VSDT Td (OFF) Td (ON) IS/D
Short-Circuit Current Output Turn-off Threshold Turn-OFF Delay Turn-ON Delay S/D Input Current
VOUT = 0V Output = ON Output = OFF RLOAD X COUT << Td (OFF) RLOAD X COUT << Td (ON) V S/D =1.3V V
S/D
Shutdown Input V s A
0.3V
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LP3881
Electrical Characteristics Limits in standard typeface are for TJ = 25C, and limits in boldface type apply over the full operating temperature range. Unless otherwise specified: VIN = VO(NOM) + 1V, VBIAS = 4.5V, IL = 10 mA, CIN = COUT = 4.7 F, VS/D = VBIAS. (Continued)
Symbol AC Parameters PSRR (VIN) Ripple Rejection for VIN Input Voltage Ripple Rejection for VBIAS Voltage Output Noise Density en Output Noise Voltage VOUT = 1.8V VIN = VOUT +1V, f = 120 Hz VIN = VOUT + 1V, f = 1 kHz PSRR (VBIAS) VBIAS = VOUT + 3V, f = 120 Hz VBIAS = VOUT + 3V, f = 1 kHz f = 120 Hz BW = 10 Hz - 100 kHz BW = 300 Hz - 300 kHz 80 65 70 65 1 150 90 V/root-Hz V (rms) dB Parameter Conditions Typical (Note 4) MIN (Note 5) MAX (Note 5) Units
Note 1: Absolute maximum ratings indicate limits beyond which damage to the component may occur. Operating ratings indicate conditions for which the device is intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications, see Electrical Characteristics. Specifications do not apply when operating the device outside of its rated operating conditions. Note 2: At elevated temperatures, device power dissipation must be derated based on package thermal resistance and heatsink thermal values. J-A for TO-220 devices is 65C/W if no heatsink is used. If the TO-220 device is attached to a heatsink, a J-S value of 4C/W can be assumed. J-A for TO-263 devices is approximately 40C/W if soldered down to a copper plane which is at least 1.5 square inches in area. If power dissipation causes the junction temperature to exceed specified limits, the device will go into thermal shutdown. Note 3: The human body model is a 100 pF capacitor discharged through a 1.5k resistor into each pin. Note 4: Typical numbers represent the most likely parametric norm for 25C operation. Note 5: Limits are guaranteed through testing, statistical correlation, or design. Note 6: If used in a dual-supply system where the regulator load is returned to a negative supply, the output pin must be diode clamped to ground. Note 7: Output voltage line regulation is defined as the change in output voltage from nominal value resulting from a change in input voltage. Note 8: Output voltage load regulation is defined as the change in output voltage from nominal value as the load current increases from no load to full load. Note 9: Dropout voltage is defined as the minimum input to output differential required to maintain the output with 2% of nominal value. Note 10: The machine model is a 220 pF capacitor discharged directly into each pin. The machine model ESD rating of pin 5 is 100V.
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LP3881
Typical Performance Characteristics
Unless otherwise specified: TA = 25C, COUT = 4.7F, Cin = 4.7F, S/D pin is tied to VBIAS, VIN = 2.2V, VOUT = 1.8V Dropout vs IL IGND vs VSD
20063005 20063004
VOUT vs Temperature
DC Load Regulation
20063006
20063007
Line Regulation vs VIN
Line Regulation vs VBIAS
20063008
20063009
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LP3881
Typical Performance Characteristics Unless otherwise specified: TA = 25C, COUT = 4.7F, Cin = 4.7F, S/D pin is tied to VBIAS, VIN = 2.2V, VOUT = 1.8V (Continued)
IBIAS vs IL IGND vs VSD
20063012
20063010
Noise Measurement
VOUTStartup Waveform
20063015
20063014
Line Regulation vs VBIAS
Line Regulation vs VBIAS
20063018 20063019
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LP3881
Typical Performance Characteristics Unless otherwise specified: TA = 25C, COUT = 4.7F, Cin = 4.7F, S/D pin is tied to VBIAS, VIN = 2.2V, VOUT = 1.8V (Continued)
VIN PSRR VIN PSRR
20063020
20063023
VBIAS PSRR
20063022
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LP3881
Application Hints
EXTERNAL CAPACITORS To assure regulator stability, input and output capacitors are required as shown in the Typical Application Circuit. OUTPUT CAPACITOR At least 4.7F of output capacitance is required for stability (the amount of capacitance can be increased without limit). The output capacitor must be located less than 1 cm from the output pin of the IC and returned to a clean analog ground. The ESR (equivalent series resistance) of the output capacitor must be within the "stable" range as shown in the graph below over the full operating temperature range for stable operation.
The reason for this is that PNP or P-FET regulators have a higher output impedance (compared to an NPN regulator), which results in a pole-zero pair being formed by every different capacitor connected to the output. The zero frequency is approximately: Fz = 1 / (2 X X ESR X C) Where ESR is the equivalent series resistance of the capacitor, and C is the value of capacitance. The pole frequency is: Fp = 1 / (2 X X RL X C) Where RL is the load resistance connected to the regulator output. To understand why a small capacitor can reduce phase margin: assume a typical LDO with a bandwidth of 1MHz, which is delivering 0.5A of current from a 2.5V output (which means RL is 5 Ohms). We then place a .047 F capacitor on the output. This creates a pole whose frequency is: Fp = 1 / (2 X X 5 X .047 X 10E-6) = 677 kHz This pole would add close to 60 degrees of phase lag at the crossover (unity gain) frequency of 1 MHz, which would almost certainly make this regulator oscillate. Depending on the load current, output voltage, and bandwidth, there are usually values of small capacitors which can seriously reduce phase margin. If the capacitors are ceramic, they tend to oscillate more easily because they have very little internal inductance to damp it out. If bypass capacitors are used, it is best to place them near the load and use trace inductance to "decouple" them from the regulator output. INPUT CAPACITOR The input capacitor must be at least 4.7 F, but can be increased without limit. It's purpose is to provide a low source impedance for the regulator input. Ceramic capacitors work best for this, but Tantalums are also very good. There is no ESR limitation on the input capacitor (the lower, the better). Aluminum electrolytics can be used, but their ESR increase very quickly at cold temperatures. They are not recommended for any application where temperatures go below about 10C. BIAS CAPACITOR The 0.1F capacitor on the bias line can be any good quality capacitor (ceramic is recommended). BIAS VOLTAGE The bias voltage is an external voltage rail required to get gate drive for the N-FET pass transistor. Bias voltage must be in the range of 4.5 - 6V to assure proper operation of the part. UNDER VOLTAGE LOCKOUT The bias voltage is monitored by a circuit which prevents the regulator output from turning on if the bias voltage is below approximately 4V. SHUTDOWN OPERATION Pulling down the shutdown (S/D) pin will turn-off the regulator. Pin S/D must be actively terminated through a pull-up resistor (10 k to 100 k) for a proper operation. If this pin is driven from a source that actively pulls high and low (such as a CMOS rail to rail comparator), the pull-up resistor is not required. This pin must be tied to Vin if not used.
20063031
Minimum ESR vs Output Load Current Tantalum capacitors are recommended for the output as their ESR is ideally suited to the part's requirements and the ESR is very stable over temperature. Aluminum electrolytics are not recommended because their ESR increases very rapidly at temperatures below 10C. Aluminum caps can only be used in applications where lower temperature operation is not required. A second problem with Al caps is that many have ESR's which are only specified at low frequencies. The typical loop bandwidth of a linear regulator is a few hundred kHz to several MHz. If an Al cap is used for the output cap, it must be one whose ESR is specified at a frequency of 100 kHz or more. Because the ESR of ceramic capacitors is only a few milli Ohms, they are not suitable for use as output capacitors on LP388X devices. The regulator output can tolerate ceramic capacitance totaling up to 15% of the amount of Tantalum capacitance connected from the output to ground. OUTPUT "BYPASS" CAPACITORS Many designers place small value "bypass" capacitors at various circuit points to reduce noise. Ceramic capacitors in the value range of about 1000pF to 0.1F placed directly on the output of a PNP or P-FET LDO regulator can cause a loss of phase margin which can result in oscillations, even when a Tantalum output capacitor is in parallel with it. This is not unique to National Semiconductor LDO regulators, it is true of any P-type LDO regulator.
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LP3881
Application Hints
(Continued)
POWER DISSIPATION/HEATSINKING A heatsink may be required depending on the maximum power dissipation and maximum ambient temperature of the application. Under all possible conditions, the junction temperature must be within the range specified under operating conditions. The total power dissipation of the device is given by: PD = (VIN-VOUT)IOUT+ (VIN)IGND where IGND is the operating ground current of the device. The maximum allowable temperature rise (TRmax) depends on the maximum ambient temperature (TAmax) of the application, and the maximum allowable junction temperature (TJmax): TRmax = TJmax- TAmax The maximum allowable value for junction to ambient Thermal Resistance, JA, can be calculated using the formula: JA = TRmax / PD These parts are available in TO-220 and TO-263 packages. The thermal resistance depends on amount of copper area or heat sink, and on air flow. If the maximum allowable value of JA calculated above is 60 C/W for TO-220 package and 60 C/W for TO-263 package no heatsink is needed since the package can dissipate enough heat to satisfy these requirements. If the value for allowable JA falls below these limits, a heat sink is required. HEATSINKING TO-220 PACKAGE The thermal resistance of a TO220 package can be reduced by attaching it to a heat sink or a copper plane on a PC board. If a copper plane is to be used, the values of JA will be same as shown in next section for TO263 package. The heatsink to be used in the application should have a heatsink to ambient thermal resistance, HA JA - CH - JC.
In this equation, CH is the thermal resistance from the case to the surface of the heat sink and JC is the thermal resistance from the junction to the surface of the case. JC is about 3C/W for a TO220 package. The value for CH depends on method of attachment, insulator, etc. CH varies between 1.5C/W to 2.5C/W. If the exact value is unknown, 2C/W can be assumed. HEATSINKING TO-263 PACKAGE The TO-263 package uses the copper plane on the PCB as a heatsink. The tab of these packages are soldered to the copper plane for heat sinking. The graph below shows a curve for the JA of TO-263 package for different copper area sizes, using a typical PCB with 1 ounce copper and no solder mask over the copper area for heat sinking.
20063025
FIGURE 1. JA vs Copper (1 Ounce) Area for TO-263 package
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LP3881
Application Hints
(Continued)
As shown in the graph below, increasing the copper area beyond 1 square inch produces very little improvement. The minimum value for JA for the TO-263 package mounted to a PCB is 32C/W. Figure 2 shows the maximum allowable power dissipation for TO-263 packages for different ambient temperatures, assuming JA is 35C/W and the maximum junction temperature is 125C.
20063026
FIGURE 2. Maximum power dissipation vs ambient temperature for TO-263 package
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LP3881
Physical Dimensions
inches (millimeters) unless otherwise noted
TO220 5-lead, Molded, Stagger Bend Package (TO220-5) NS Package Number T05D
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LP3881 0.8A Fast-Response Ultra Low Dropout Linear Regulators
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
TO263 5-Lead, Molded, Surface Mount Package (TO263-5) NS Package Number TS5B
LIFE SUPPORT POLICY NATIONAL'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user.
National Semiconductor Americas Customer Support Center Email: new.feedback@nsc.com Tel: 1-800-272-9959 www.national.com National Semiconductor Europe Customer Support Center Fax: +49 (0) 180-530 85 86 Email: europe.support@nsc.com Deutsch Tel: +49 (0) 69 9508 6208 English Tel: +44 (0) 870 24 0 2171 Francais Tel: +33 (0) 1 41 91 8790
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
National Semiconductor Asia Pacific Customer Support Center Fax: +65-6250 4466 Email: ap.support@nsc.com Tel: +65-6254 4466
National Semiconductor Japan Customer Support Center Fax: 81-3-5639-7507 Email: jpn.feedback@nsc.com Tel: 81-3-5639-7560
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.


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