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ACTS74MS
January 1996
Radiation Hardened Dual D Flip Flop with Set and Reset
Pinouts
14 PIN CERAMIC DUAL-IN-LINE MIL-STD-1835 DESIGNATOR CDIP2-T14, LEAD FINISH C TOP VIEW
R1 1 D1 2 CP1 3 S1 4 Q1 5 Q1 6 GND 7 14 VCC 13 R2 12 D2 11 CP2 10 S2 9 Q2 8 Q2
Features
* Devices QML Qualified in Accordance with MIL-PRFF-38535 * Detailed Electrical and Screening Requirements are Contained in SMD# 5962-96713 and Intersil's QM Plan * 1.25 Micron Radiation Hardened SOS CMOS * Total Dose . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >300K RAD (Si) * Single Event Upset (SEU) Immunity: <1 x 10-10 Errors/Bit/Day (Typ) * SEU LET Threshold . . . . . . . . . . . . . . . . . . . . . . . >100 MEV-cm2/mg * Dose Rate Upset . . . . . . . . . . . . . . . . >1011 RAD (Si)/s, 20ns Pulse * Dose Rate Survivability . . . . . . . . . . . >1012 RAD (Si)/s, 20ns Pulse * Latch-Up Free Under Any Conditions * Military Temperature Range . . . . . . . . . . . . . . . . . . -55oC to +125oC * Significant Power Reduction Compared to ALSTTL Logic * DC Operating Voltage Range . . . . . . . . . . . . . . . . . . . . 4.5V to 5.5V * Input Logic Levels - VIL = 0.8V Max - VIH = VCC/2 Min * Input Current 1A at VOL, VOH * Fast Propagation Delay . . . . . . . . . . . . . . . . 20ns (Max), 13ns (Typ)
14 PIN CERAMIC FLATPACK MIL-STD-1835 DESIGNATOR CDFP3-F14, LEAD FINISH C TOP VIEW
R1 D1 CP1 S1 Q1 1 2 3 4 5 6 7 14 13 12 11 10 9 8 VCC R2 D2 CP2 S2 Q2 Q2
Description
The Intersil ACTS74MS is a Radiation Hardened Dual D Flip Flop with Set(s) and Reset (R). The logic level at data input is transferred to the output during the positive transition of the clock. The Set and Reset are independent from the clock and accomplished by a low level on the appropriate input. The ACTS74MS utilizes advanced CMOS/SOS technology to achieve high-speed operation. This device is a member of a radiation hardened, high-speed, CMOS/SOS Logic Family. The ACTS74MS is supplied in a 14 lead Ceramic Flatpack (K suffix) or a 14 Lead Ceramic Dual-In-Line Package (D suffix).
Q1 GND
Ordering Information
PART NUMBER 5962F9671301VCC 5962F9671301VXC ACTS74D/Sample ACTS74K/Sample ACTS74HMSR TEMPERATURE RANGE -55oC -55oC to to +125oC +125oC SCREENING LEVEL MIL-PRF-38535 Class V MIL-PRF-38535 Class V Sample Sample Die PACKAGE 14 Lead SBDIP 14 Lead Ceramic Flatpack 14 Lead SBDIP 14 Lead Ceramic Flatpack Die
25oC 25oC 25oC
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. http://www.intersil.com or 407-727-9207 | Copyright (c) Intersil Corporation 1999
Spec Number File Number
1
518787 3382.1
ACTS74MS Functional Diagram
S 4(10) CL P N CL D 2(12) P N CL CL P N R 1(13) Cp 3(11) CL CL CL CL CL P N CL Q 6(8) Q 5(9)
TRUTH TABLE INPUTS SET L H L H H H RESET H L L H H H L CP X X X D X X X H L X OUTPUTS Q H L Q L H
H (Note 2) H (Note 2) H L Q0 L H Q0
H = High Level (Steady State) L = Low Level (Steady State) NOTES:
X = Don't Care = Transition from Low to High Level
1. Q0 = the level of Q before the indicated input conditions were established. 2. This configuration is nonstable, that is, it will not persist when set and reset inputs return to their inactive (high) level.
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
Spec Number 2
518787
ACTS74MS Die Characteristics
DIE DIMENSIONS: 88 mils x 88 mils 2240mm x 2240mm METALLIZATION: Type: AlSi Metal 1 Thickness: 7.125kA 1.125kA Metal 2 Thickness: 9kA 1kA GLASSIVATION: Type: SiO2 Thickness: 8kA 1kA WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 110m x 110m 4.3 mils x 4.3 mils
Metallization Mask Layout
ACTS74MS
D1 (2)
R1 (1)
VCC (14)
R2 (13)
CP1 (3)
(12) D2
S1 (4)
(11) CP2
Q1 (5)
(10) S2
NC NC
(6) Q1
(7) GND
(8) Q2
(9) Q2
Spec Number 3
518787

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