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| ICs for Mobile Communication AN6105FHN Quadrature demodulation IC for CDMA system mobile telephone Overview The AN6105FHN is a quadrature demodulation IC for a CDMA system mobile telephone, incorporating a reception IF for IS-95 and GCA plus quadrature demodulator. 13 (0.42) 3C 4.200.10 (4.00) 12 9 Unit: mm 0. 50 16 1 (0.55) 4 5 Features * Current consumption: 11 mA typ. * Gain control range: +85 dB to -5 dB * High linearity control characteristic: 3 dB * Temperature dependency: 3 dB 0.10 3.000.10 (1.35) 4 1 2.000.10 Seating plane (0 (0.33) (0.85) 0.200.10 R0.30 .1 5) 16 5 Applications * Cellular telephone (IS-95) 13 12 0.50 9 8 0.600.10 (0.58) 0.10 M 0.200.06 QFN016-P-0304A (Lead-free package) Block Diagram B.B GND 2nd local Sleep I out 12 11 10 Gain control 13 9 GCA control 8 IX out GCA VCC 14 GCA 15 1/2 /2 7 B.B VCC IF in 6 Q out IF in X 16 Offset adjustment 5 QX out 1 2 3 VREF (I, Q) adjustment GCA GND Q-QX adjustment I-IX adjustment 4 0.80 max. 3.200.10 (3.00) 8 Publication date: October 2002 SDM00005BEB 1 AN6105FHN Pin Descriptions Pin No. 1 2 3 4 5 6 7 8 GND (GCA) I, Q output operating point adjustment Q operating point offset adjustment I operating point offset adjustment Q output Q output Supply voltage (base band) I output Description Pin No. 9 10 11 12 13 14 15 16 I output GND (base band) Local signal input Sleep Gain adjustment Supply voltage (GCA) Signal input (+) Signal input (-) Description Absolute Maximum Ratings Parameter Supply voltage Supply current Power dissipation *2 *1 Symbol VCC ICC PD Topr Tstg Rating 4.2 24 100 -30 to +85 -55 to +125 Unit V mA mW C C Operating ambient temperature Storage temperature *1 Note) *1: Except for the operating ambient temperature and storage temperature, all ratings are for Ta = 25C. *2: PD is the value at Ta = 85C without a heatsink. Use this device within the range of allowable power dissipation referring to " Technical Data * PD Ta curves of QFN016-P-0304". Recommended Operating Range Parameter Supply voltage Symbol VCC Range 2.55 to 4.00 Unit V Electrical Characteristics at Ta = 25C Unless otherwise specified, VCC = 2.8 V, VSLP = 2.8 V, VGC = 2.5 V, VLO = -10 dBm: f = 223.7 MHz, VIN: f = 112.35 MHz, VI , VIX , VQ , VQX: f = 500 kHz, a measurement in high impedance be made for VI , VIX , VQ and VQX . Parameter Current consumption Current consumption (sleep) Conversion gain 1 Conversion gain 2 IQ maximum output Noise figure Symbol ITOT ISLP GC(1) GC(2) VIQ NF Conditions VIN , VLO: No input VIN , VLO: No input, V12 = 0 V Conversion gain between VIN and VI VGC = 2.5 V, VIN = 5 dBV Conversion gain between VIN and VI VGC = 0.1 V, VIN = 85 dBV Output level of VI , VIX , VQ and VQX VGC = 2.5 V, VIN = 40 dBV VGC = 2.5 V Min 6 80 -18 1 Typ 11 0 85 -12 1.8 7 Max 15 10 90 -9 8.5 Unit mA A dB dB V[p-p] dB 2 SDM00005BEB AN6105FHN Electrical Characteristics at Ta = 25C (continued) Unless otherwise specified, VCC = 2.8 V, VSLP = 2.8 V, VGC = 2.5 V, VLO = -10 dBm: f = 223.7 MHz, VIN: f = 112.35 MHz, VI , VIX , VQ , VQX: f = 500 kHz, a measurement for high impedance be made for VI , VIX , VQ and VQX . Parameter Input IP3 Gain adjustment sensitivity Quadrature demodulation error Local signal input level Sleep control (low) Sleep control (high) Gain adjustment voltage IQ operating point voltage Symbol IIP3 GCA IQERR VLO VSLP(1) VSLP(2) VGC VIQ DC operating point voltage at no adjustment for IQ output (pin 5, pin 6, pin 8 and pin 9) DC operating point voltage difference between VI-VIX and VQ-VQX (at no adjustment) Voltage to get ITOT of 10 A and less Voltage for an operating mode Conditions Input IP3 value at 60 dB 1 dB of conversion gain Gain variation at VGC = 0.5 V to 2.5 V VGC = 1.5 V, VIN = 47 dBV Min 65 42 -20 2.3 0.1 1.2 Typ 69 45 -25 -10 1.5 Max 48 -20.5 -7 0.2 2.6 1.7 Unit dBV dB/V dB dBm V V V V IQ operating point deviation VIQ -250 0 250 mV * Design reference data Note) The characteristics listed below are theoretical values based on the IC design and are not guaranteed. Parameter IQ output deviation Symbol VIQ Conditions Level ratio between IQ signals (differential), VGC = 1.5 V, VIN = 47 dBV Phase difference between IQ signals (differential), VGC = 1.5 V, VIN = 47 dBV Min - 0.8 Typ 0 Max 0.8 Unit dB IQ output phase difference IQ 85 90 95 deg Terminal Equivalent Circuits Pin No. 1 2, 3, 4 Equivalent circuit Description GND (GCA): Ground pin of GCA system. DC voltage (V) 1.9 VCC 20 k Pin 2, 3, 4 150 k 40 k 40 k 20 k Pin 2: I, Q output operating point adjustment: Pin to adjust an operating point voltage of IQ output (pin 5, pin 6, pin 8 and pin 9).; Pin3: Q operating point offset adjustment: Pin to adjust an offset voltage between Q, Q output (pin 5, pin 6).; Pin 4: I operating point offset adjustment: Pin to adjust an offset voltage between I, I output (pin 8, pin 9). SDM00005BEB 3 AN6105FHN Terminal Equivalent Circuits (continued) Pin No. 5, 6 Equivalent circuit Description DC voltage (V) 1.5 VCC Pin 5: Q output: Pin to output the Q signal.; Pin 6: Q output: Pin to output the Q signal. Pin 5, 6 7 8, 9 VCC Supply voltage (base band): Supply voltage pin of base band system. Pin 8: I output: Pin to output the I signal.; Pin 9: I output: Pin to output the I signal. 2.8 1.5 Pin 8, 9 10 11 VCC 2 k 11 GND (base band): Ground pin of base band system. Local signal input: Input pin of local signal for IQ demodulation. 2.7 12 Sleep: Operating mode: Connect this pin to supply 150 k 12 voltage pin. Sleep mode: Connect to GND. 4 SDM00005BEB AN6105FHN Terminal Equivalent Circuits (continued) Pin No. 13 13 64 k 56 k 14 15, 16 15 16 1.2 V VCC 2 k 2 k Supply voltage (GCA): Supply voltage pin of GCA system. Pin 15: Signal input (+): Pin to input IF signal. Impedance matching is required.; Pin 16: Signal input (-): AC grounding with a capacitor. 1.2 Equivalent circuit VCC Description Gain adjustment: Adjusts gain. Possible to apply voltage from 0 to a supply voltage. DC voltage (V) 0 Usage Note There are two systems of a supply voltage pin for this device. (Pin 7, pin 14) Apply the same voltage simultaneously to these two pins on use. (Keep either of them from being off.) Technical Data * PD Ta curves of QFN016-P-0304A PD Ta 0.600 0.584 0.500 Power dissipation PD (W) 0.400 Mounted on standard board (glass epoxy: 50 mm x 50 mm x t0.8 mm) Rth(j-a) = 171.2C/W 0.300 0.251 0.200 Independent IC without a heat shink Rth(j-a) = 397.4C/W 0.100 0.000 0 25 50 75 100 125 Ambient temperature Ta (C) SDM00005BEB 5 AN6105FHN Application Circuit Example B.B GND 2nd local Sleep 12 11 10 Gain control 13 9 I out GCA control 8 IX out GCA VCC 14 GCA 15 1/2 /2 7 B.B VCC IF in 6 Q out IF in X 16 Offset adjustment 5 QX out 1 2 3 VREF (I, Q) adjustment GCA GND Q-QX adjustment 6 SDM00005BEB I-IX adjustment 4 Request for your special attention and precautions in using the technical information and semiconductors described in this material (1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the product or technologies as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. 2002 JUL |
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