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| PD - 94408 IRGC5B60KB Die in Wafer Form Features * * * * * * * * * GEN5 Non Punch Through (NPT) Technology Low VCE(on) 10s Short Circuit Capability Square RBSOA Positive VCE(on) Temperature Coefficient Benchmark Efficiency for Motor Control Applications Rugged Transient Performance Excellent Current Sharing in Parallel Operation Qualified for Industrial Market C Benefits G E 600V IC(nom)= 5A VCE(on) typ.=1.8V @ IC(nom) @ 25C Motor Control IGBT Short Circuit Rated 150mm Wafer Reference Standard IR Package Part: IRGS5B60KD Electrical Characteristics (Wafer Form) Parameter VCE (on) V(BR)CES VGE(th) ICES IGES Description Collector-to-Emitter Saturation Voltage Colletor-to-Emitter Breakdown Voltage Gate Threshold Voltage Zero Gate Voltage Collector Current Gate-to-Emitter Leakage Current Guaranteed (min, max) 1.0V min, 1.25V max 600V min 3.5V min, 5.5V max 10A max 1.1A max Test Conditions IC = 1A, TJ = 25C, VGE = 15V TJ = 25C, I CES = 1mA, VGE = 0V VGE = VCE , TJ =25C, IC = 250A TJ = 25C, VCE = 600V TJ = 25C, VGE = +/-20V Mechanical Data Nominal Backmetal Composition, (Thickness) Nominal Front Metal Composition, (Thickness) Dimensions Wafer Diameter Wafer Thickness, Tolerance Relevant Die Mechanical Dwg. Number Minimum Street Width Reject Ink Dot Size Ink Dot Location Recommended Storage Environment Recommended Die Attach Conditions Al - Ti - Ni/V - Ag, (1kA - 1kA - 4kA - 6kA) 99% Al/1% Si, (4m) 0.090" x 0.115" 150mm, with std. < 100 > flat 85m, +/- 7m 01-5513 100m 0.25mm diameter minimum Consistent throughout same wafer lot Store in original container, in dessicated nitrogen, with no contamination For optimum electrical results, die attach temperature should not exceed 300C Die Outline 2.29 [.090] 1.30 [.051] NOT ES : 1. ALL DIMENS IONS ARE S HOWN IN MILLIMET ERS [INCHES ]. 2. CONT ROLLING DIMENS ION: [INCH]. 3. LETT ER DES IGNAT ION: S = S OURCE G = GAT E S K = S OURCE KELVIN IS = CURRENT S ENS E < 0.635 T OLERANCE = + /- 0.013 < [.0250] T OLERANCE = + /- [.0005] > 0.635 T OLERANCE = + /- 0.025 > [.0250] T OLERANCE = + /- [.0010] < 1.270 T OLERANCE = + /- 0.102 < [.050] TOLERANCE = + /- [.004] > 1.270 T OLERANCE = + /- 0.203 > [.050] TOLERANCE = + /- [.008] E = EMIT T ER 4. DIMENS IONAL T OLERANCES : BONDING PADS : EMITT ER 1.88 2.92 [.074] [.115] WIDT H & LENGT H 0.64 [.025] GAT E OVERALL DIE: WIDT H & 0.66 [.026] LENGT H www.irf.com 04/19/02 |
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