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| Philips Semiconductors Package outline Plastic single-ended package (IPAK); 3 leads (in-line) SOT533 E E1 A1 A D1 mounting base D2 L1 Q L 1 2 3 e1 e b w M c 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 2.38 2.22 A1 0.89 0.71 b 0.89 0.71 c 0.56 0.46 D1 1.10 0.96 D2 6.23 5.97 E 6.73 6.47 E1 e e1 L 9.6 9.2 L1 (2) max 2.7 Q 1.1 1.0 w 0.3 2.285 5.21 4.57 5.00 BSC (1) BSC (1) Notes 1. Basic spacing between centers. 2. Terminal dimensions are uncontrolled within zone L1. OUTLINE VERSION SOT533 REFERENCES IEC JEDEC TO-251 JEITA EUROPEAN PROJECTION ISSUE DATE 04-09-22 05-02-11 SOT533 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved. 15 February 2005 1 of 1 |
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