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Power Transistors
2SD2375
Silicon NPN triple diffusion planar type
Unit: mm
For power amplification with high forward current transfer ratio I Features
* High forward current transfer ratio hFE which has satisfactory linearity * Full-pack package which can be installed to the heat sink with one screw
9.90.3
3.00.5
4.60.2 2.90.2
13.70.2 4.20.2 Solder Dip
15.00.5
3.20.1
1.40.2 1.60.2 0.80.1
2.60.1
I Absolute Maximum Ratings TC = 25C
Parameter Collector to base voltage Collector to emitter voltage Emitter to base voltage Peak collector current Collector current Base current Collector power dissipation TC = 25C Ta = 25C Tj Tstg Symbol VCBO VCEO VEBO ICP IC IB PC Rating 80 60 6 6 3 1 25 2 150 -55 to +150 C C Unit V V V A A A W
0.550.15
2.540.30 5.080.50 1 2 3
1: Base 2: Collector 3: Emitter TO-220D Package
Junction temperature Storage temperature
I Electrical Characteristics TC = 25C
Parameter Collector cutoff current Symbol ICBO ICEO Emitter cutoff current Collector to emitter voltage Forward current transfer ratio * Collector to emitter saturation voltage Transition frequency Note) *: Rank classification Rank hFE Q P IEBO VCEO hFE VCE(sat) fT Conditions VCB = 80 V, IE = 0 VCE = 40 V, IB = 0 VEB = 6 V, IC = 0 IC = 25 mA, IB = 0 VCE = 4 V, IC = 0.5 A IC = 2 A, IB = 0.05 A VCE = 12 V, IC = 0.2 A, f = 10 MHz 50 60 500 1 500 1 V MHz Min Typ Max 100 100 100 Unit A A A V
500 to 1 000 800 to 1 500
Ordering can be made by the common rank (PQ rank hFE = 500 to 1 500) in the rank classification.
1
2SD2375
PC T a
40 1.0 (1) TC=Ta (2) Without heat sink (PC=2W) IB=1.0mA TC=25C 0.9mA 0.8 4
Power Transistors
IC VCE
5 VCE=5V TC=25C
IC VBE
Collector power dissipation PC (W)
36 32 28 (1) 24 20 16 12 8 4 (2) 0 0 20 40 60
Collector current IC (A)
0.7mA 0.6 0.6mA 0.5mA 0.4 0.4mA 0.3mA 0.2 0.2mA 0.1mA 0
Collector current IC (A)
0.8mA
3
2
1
0 0 2 4 6 8 10 12 0 0.2 0.4 0.6 0.8 1.0 1.2
80 100 120 140 160
Ambient temperature Ta (C)
Collector to emitter voltage VCE (V)
Base to emitter voltage VBE (V)
VCE(sat) IC
Collector to emitter saturation voltage VCE(sat) (V)
100 30 10 3 1 0.3 0.1 0.03 0.01 0.01 0.03 IC/IB=40 TC=25C 10000
hFE IC
1000 VCE=4V TC=25C 300 100 30 10 3 1 0.3 0.1 0.01 0.03
fT I C
VCE=12V f=10MHz TC=25C
Forward current transfer ratio hFE
1000 300 100 30 10 3 1 0.01 0.03
0.1
0.3
1
3
10
0.1
0.3
1
3
10
Transition frequency fT (MHz)
3000
0.1
0.3
1
3
10
Collector current IC (A)
Collector current IC (A)
Collector current IC (A)
Area of safe operation (ASO)
100 30 103 Non repetitive pulse TC=25C
Rth(t) t
(1) Without heat sink (2) With a 100 x 80 x 2mm Al heat sink
Thermal resistance Rth(t) (C/W)
Collector current IC (A)
102 (1) (2)
10 I CP t=1ms 3 1 DC 0.3 0.1 0.03 0.01 1 3 10 30 100 300 1000 10ms IC
10
1
10-1
10-2 10-4
10-3
10-2
10-1
1
10
102
103
104
Collector to emitter voltage VCE (V)
Time t (s)
2
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(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuit examples of the products. It does not constitute the warranting of industrial property, the granting of relative rights, or the granting of any license. (3) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (4) The products and product specifications described in this material are subject to change without notice for reasons of modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, redundant design is recommended, so that such equipment may not violate relevant laws or regulations because of the function of our products. (6) When using products for which dry packing is required, observe the conditions (including shelf life and after-unpacking standby time) agreed upon when specification sheets are individually exchanged. (7) No part of this material may be reprinted or reproduced by any means without written permission from our company.
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2001 MAR

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