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| (R) EMIF06-10006F1 IPADTM 6 LINES EMI FILTER AND ESD PROTECTION MAIN PRODUCT CHARACTERISTICS Where EMI filtering in ESD sensitive equipment is required: Mobile phones Computers and printers Communication systems MCU Boards (R) DESCRIPTION The EMIF06-10006F1 is a highly integrated devices designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. The EMIF06 flip-chip packaging means the package size is equal to the die size. This filter includes an ESD protection circuitry which prevents the device from destruction when subjected to ESD surges up 15kV. This device includes 6 EMIF filters. BENEFITS EMI symmetrical (I/O) low-pass filter High efficiency in EMI filtering Very low PCB space consuming: 2.92mm x 1.29mm Very thin package: 0.65 mm High efficiency in ESD suppression (IEC61000-4-2 level 4) High reliability offered by monolithic integration High reducing of parasitic elements through integration and wafer level packaging. Flip-Chip package PIN CONFIGURATION (ball side) 9 8 7 6 5 4 3 2 1 I6 Gnd O6 I5 I4 Gnd O4 I3 I2 Gnd I1 A B COMPLIES WITH THE FOLLOWING STANDARDS : IEC 61000-4-2 level 4: 15kV (air discharge) 8 kV (contact discharge) MIL STD 883E - Method 3015-6 Class 3: 30kV BASIC CELL CONFIGURATION 100 O5 O3 O2 O1 C 100 Input 1 30pF 30pF Output 1 Input 4 30pF 30pF Output 4 100 100 Input 2 30pF 30pF Output 2 Input 5 30pF 30pF Output 5 100 100 Input 3 30pF 30pF Output 3 Input 6 30pF 30pF Output 6 TM : IPAD is a trademark of STMicroelectronics. March 2004 - Ed: 2 1/6 EMIF06-10006F1 ABSOLUTE RATINGS (limiting values) Symbol PR PT Tj Top Tstg Parameter and test conditions DC power per resistance Total DC power per package Maximum junction temperature Operating temperature range Storage temperature range Value 0.1 0.6 125 -40 to + 85 125 Unit W W C C C ELECTRICAL CHARACTERISTICS (Tamb = 25 C) Symbol VBR IRM VRM VCL Rd IPP RI/O Cline Parameter Breakdown voltage Leakage current @ VRM Stand-off voltage VCL VBR VRM VF IRM IR V I IF Clamping voltage Dynamic impedance Peak pulse current Series resistance between Input and Output Capacitance per line IPP Symbol VBR IRM RI/O Cline IR = 1 mA Test conditions Min. 5.5 Typ. 7 Max. 9 500 Unit V nA pF VRM = 3.3 V per line I = 10 mA VR = 2.5 V, F = 1 MHz, 30 mV (on filter cells) 80 50 100 60 120 70 2/6 EMIF06-10006F1 Fig. 1: S21 (dB) attenuation measurements and Aplac simulation. 0.00 dB -12.50 Fig. 2: Analog crosstalk measurements. Aplac 7.62 User: ST Microelectronics 00 dB -25 i3_o2.s2p -25.00 -50 -37.50 -75 Measurement Simulation f/Hz -50.00 100.0k -100 1.0M 10.0M 100.0M 1.0G f/Hz 100k 1M 10M 100M 1G Fig. 3: Digital crosstalk measurements. Fig. 4: ESD response to IEC61000-4-2 (+15kV air discharge) on one input V(in) and one output V(out). Fig. 5: ESD response to IEC61000-4-2 (-15kV air discharge) on one input V(in) and one output V(out). Fig. 6: Line capacitance versus applied voltage for filter. C(pF) 100 90 80 70 60 50 40 30 20 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 F=1MHz Vosc=30mVRMS Tj=25C VR(V) 3/6 EMIF06-10006F1 Aplac model Rbump Ii* Lbump Rs=100 Lbump Rbump Oi* sub Rsub Cz=41pF@0V Cbump Rsub Cz=41pF@0V Rsub Lbump Oi * = Output of each cell Ii* = Input of each cell sub Cbump Rbump Cgnd Lgnd Rgnd EMIF06-10006F1 model Ground return for each GND bump Aplac parameters aplacvar Rs aplacvar Cz aplacvar Lbump aplacvar Rbump aplacvar Cbump aplacvar Rsub aplacvar Rgnd aplacvar Lgnd aplacvar Cgnd 100 41 pF 50 pH 20 m 1.2 pF 100 m 100 m 100 pH 0.15 pF 4/6 EMIF06-10006F1 ORDER CODE EMIF EMI Filter Number of lines yy - xxx zz F 1 Pitch = 500m Bump = 315m FLIP CHIP x: resistance value () z: capacitance value / 10 (pF) or application (3 letters) and version (2 digits) PACKAGE MECHANICAL DATA 315m 50 500m 50 250m 50 435m 50 650m 65 50 1 m 5 2.92mm 50m FOOT PRINT RECOMMENDATIONS MARKING 1.29mm 50m 0 Copper pad Diameter : 250m recommended , 300m max Dot, ST logo xxx = marking yww = datecode (y = year ww = week) 545 400 545 Solder stencil opening : 330m Solder mask opening recommendation : 340m min for 300m copper pad diameter xxx yww 100 230 All dimensions in m 5/6 EMIF06-10006F1 FLIP-CHIP TAPE AND REEL SPECIFICATION Dot identifying Pin A1 location 4 +/- 0.1 O 1.5 +/- 0.1 1.75 +/- 0.1 3.5 +/- 0.1 0.73 +/- 0.05 All dimensions in mm 8 +/- 0.3 ST ST ST xxx yww User direction of unreeling xxx yww xxx yww 4 +/- 0.1 OTHER INFORMATION Ordering code EMIF06-10006F1 Marking FTT Package Flip-Chip Weight 5.4 mg Base qty 5000 Delivery mode Tape & reel Note: More packing informations are available in the application note AN1235: ''Flip-Chip: Package description and recommandations for use'' Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2004 STMicroelectronics - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain Sweden - Switzerland - United Kingdom - United States www.st.com 6/6 This datasheet has been downloaded from: www..com Datasheets for electronic components. |
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