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PKF series
PKF series General information
* SMD and through hole versions with ultra-low component height 8.0 mm (0.315 in.) * Up to 87% efficiency at full load * Safety requirements in accordance with EN60950 * MTTF >10 million hours at +50C case temperature (+40C ambient) * Low EMI
Patents US: D357901 DE: M94022763
The MacroDensTM PKF family of true component level on-board DC/DC power modules are intended as distributed power sources in decentralized power systems. Utilization of thick film technology and a high degree of silicon integration has made it possible to achieve a MTTF of more than 10 million hours. The high reliability and the very low heights of these DC/DC power modules makes them particularly suited for Information Technology and Telecom (IT&T) applications, with board spacing down to 15 mm or 0.6 in. They are optimized for an operational ambient temperature range in compliance
with present and future application needs, including non temperature controlled environments. The mechanical design offers surface mount and throughhole versions, delivered in ready-to-use tubes, trays or tape & reel packages, and compatibility with semi and fully aqueous cleaning processes. The PKF series is manufactured in highly automated production lines using SMT, laser trimming, 100% burn-in and ATE final inspection. Ericsson Microelectronics AB has been an ISO 9001 certified supplier since 1991. For a complete product program please reference the back cover.
E
Environmental Characteristics
Characteristics Test procedure & conditions Frequency Amplitude Acceleration Number of cycles Frequency Acceleration density spectrum Duration Reproducability Peak acceleration Shock duration Temperature Humidity Duration Temperature Number of cycles Duration Temperature Temperature, solder Duration Temperature Duration Number of cycles 10...500 Hz 0.75 mm 10 g 10 in each axis 10...500 Hz 0.5 g2/Hz 10 min in 3 directions medium (IEC 62-36) 200 g 3 ms 85C 85% RH 1000 hours -40C...+125C 500 96 h 35C 260C 10...13 s 125C 1000hrs 2
Vibration (Sinusoidal)
JESD 22-B103 (IEC 68-2-6 Fc)
Random vibration
MIL-STD-883 Method 2026 (IEC 68-2-34 Ed) JESD 22-A104 (IEC 68-2-14 Na) JESD 22-A101 (IEC 68-2-3 Ca with bias) JESD 22-B104 (IEC 68-2-27 Ea) JESD 22-A-A107 (IEC 68-2-11 Ka) JESD 22-B106 (IEC 68-2-20 Tb 1A) JESD22-A10 JESD22-B105 JESD22-B102
Shock (Half sinus) Temperature change Accelerated damp heat Aggressive environment Resistance to soldering temp1) 2) High temp Storage life Lead Integrity Solderability
Operational life test
Temperature Maximum load Input voltage on Input voltage off Duration J-STD-020 Level 1
85C 9min 3min 1000hrs
Moisture reflow Senitive classification
1) 2)
Applies to through-hole versions For surfacemount versions please see soldering profile page 4.
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EN/LZT 146 57 R1A (c) Ericsson Microelectronics AB, March 2001
Mechanical Data
Through-hole version Surface-mount version
Foot print Component side
Foot print Component side
1
2
3
4
5
6
7
8
9 3.6[0.142]
5.0[0.197] 40.0[1.575]
Dimensions in mm (in)
Dimensions in mm (in)
Weight
Maximum 20 g (0.71 oz).
Case
The case consists of semiconductor grade epoxy with embedded pins. Coefficient of thermal expansion (CTE) is typ. 15 ppm/C.
Connection Pins
Base material is copper (Cu), first plating is nickel (Ni) and second (outer) plating is palladium (Pd).
24.0[0.945] 29.6[ 1.165]
18 17 16 15 14 13 12 11 10
2.8[0.110]
Dimensions in mm (in)
EN/LZT 146 57 R1A (c) Ericsson Microelectronics AB, March 2001
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Thermal Data
Two-parameter model
This model provides a more precise description of the thermal characteristics to be used for thermal calculations. Thermally the power module can be considered as a component and the case temperature can be used to characterize the properties. The thermal data for a power module with the substrate in contact with the case can be described with two thermal resistances. One from case to ambient air and one from case to PB (Printed circuit Board). The thermal characteristics temperature can be calculated from the following formula: TPB = (TC-TA)x(Rth C-PB+Rth C-A)/Rth C-A-PdxRth C-PB+TA dissipated power, calculated as PO x(l/h-1) max average case temperature ambient air temperature at the lower side of the power module temperature in the PB between the PKF connection pins TPB: Rth C-PB: thermal resistance from case to PB under the power module Rth C-A: thermal resistance from case to ambient air v: velocity of ambient air Rth C-PB is constant and Rth C-A is dependent on the air velocity. Free convection is equal to an air velocity of aprox. 0.2 - 0.3 m/s. See figure below. Where: Pd : T C: TA:
Reflow Soldering Information
The PKF series of DC/DC power modules are manufactured in surface mount technology. Extra precautions must therefore be taken when reflow soldering the surface mount version. Neglecting the soldering information given below may result in permanent damage or significant degradation of power module performance. The PKF series can be reflow soldered using IR, Natural Convection, Forced Convection or Combined IR/Convection Technologies. The high thermal mass of the component and its effect on DT (C) requires that particular attention be paid to other temperature sensitive components. IR Reflow technology may require the overall profile time to be extended to approximately 8-10 minutes to ensure an acceptable DT. Higher activity flux may be more suitable to overcome the increase in oxidation and to avoid flux burn-up. The general profile parameters detailed in the diagram, with this extended time to reach peak temperatures, would then be suitable. Note! These are maximum parameters. Depending on process variations, an appropriate margin must be added.
Figure 4
11
Palladium plating is used on the terminal pins. A pin temperature (Tp) in excess of the solder fusing temperature (+183C for Sn/Pb 63/37) for more than 25 seconds and a peak temperature above 195C, is required to guarantee a reliable solder joint. Both pin 1 and pin 11 must be monitored. No responsibility is assumed if these recommendations are not strictly followed.
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EN/LZT 146 57 R1A (c) Ericsson Microelectronics AB, March 2001
Delivery Package Information
Tubes
The PKF-series is delivered in tubes (designated by /A) with a length of 500 mm (19.69 in), see fig. 2.
Capacity: Stacking pitch: Weight: Min. order quantity:
15 power modules/tray 10.16 mm Typ. 130 g 150 pcs (one box contains 10 full trays)
Tape & Reel
SMD versions, SI, can be delivered in standard tape & reel package (designated by /C) on request, see fig. 4. For more information, please contact your local Ericsson sales office.
24 (0.95)
9.5 (0.37)
11 (0.43) 14.5 (0.57)
15 (0.59) 35 (1.38) All dimensions in mm (in)
1.1 (0.04)
Figure 2
Specification
Material: Antistatic coated PVC Max surface resistance: 10 11W/ Color: Transparent Capacity: 10 power modules/tube Weight: Typ. 60 g End stops: Pins
Trays
SMD versions, SI, can be delivered in standard JEDEC trays (designated by /B) on request, see fig. 3. For more information, please contact your local Ericsson sales office.
Figure 4
Specification
Tape material: Tape width: Tape pitch: Max surface resistance: Tape color: Cover tape color: Reel diameter: Reel hub diameter: Reel capacity: Full reel weight: Min. order quantity:
Conductive polystyrene (PS) 72 mm 36 mm 105W/ Black Transparent 13" 4" 150 power modules/reel Typ. 3.7 kg 300 pcs (one box contains two reels)
Figure 3
Specification
Material: Max temperature: Max surface resistance: Color:
Polypropylene (PP) 125C 105W/ Black
EN/LZT 146 57 R1A (c) Ericsson Microelectronics AB, March 2001
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Quality
Reliability
Meantime to fail (MTTF) is calculated to >10 million hours at full output power and a case temperature of +50C (TA = +40C), using the Ericsson failure rate data system. The Ericsson failure rate data system is based on field failure rates and is continuously updated. The data corresponds to actual failure rates of components used in Information Technology and Telecom equipment in temperature controlled environments (TA = -5... +65C). The data is considered to have a confidence level of 90%. For more information see Design Note 002. Quality Statement The products are designed and manufactured in an industrial environment where quality systems and methods like ISO 9000, 6s and SPC, are intensively in use to boost the continuous improvements strategy. Infant mortality or early failures in the products are screened out by a burn-in procedure and an ATEbased final test. Conservative design rules, design reviews and product qualifications, plus the high competence of an engaged work force, contribute to the high quality of our products. Warranty Ericsson Microelectronics warrants to the original purchaser or end user that the products conform to this Data Sheet and are free from material and workmanship defects for a period of five (5) years from the date of manufacture, if the product is used within specified conditions and not opened. In case the product is discontinued, claims will be accepted up to three (3) years from the date of the discontinuation. For additional details on this limited warranty please refer to Ericsson Microelectronics AB's "General Terms and Conditions of Sales", or individual contract documents. Limitation of liability Ericsson Microelectronics does not make any other warranties, expressed or implied including any warranty of merchantability or fitness for a particular purpose (including, but not limited to, use in life support applications, where malfunctions of product can cause injury to a person's health or life).
Information given in this data sheet is believed to be accurate and reliable. No responsibility is assumed for the consequences of its use nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Ericsson Microelectronics. These products are sold only according to Ericsson Microelectronics' general conditions of sale, unless otherwise confirmed in writing. Specifications subject to change without notice.
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EN/LZT 146 57 R1A (c) Ericsson Microelectronics AB, March 2001
EN/LZT 146 57 R1A (c) Ericsson Microelectronics AB, March 2001
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Product Program
VO/IO max VI O/P 1 3.3 V/2.0A 5V/1.2A 5V/ 2.0A 12V/1.0A 1.8V/5A 2.1V /1.5A 2.5V/4.4A 3.3V/1.5A 3.3V/2.0A 3.3V/3.0A 3.3V/4.0A 5V /1.2A 5V/2.0A 5V/3.0A 12V/0.6A 3.3 V/2.1A +5V/1.0A +5V/1.0A +12V/0.5A +12V/0.84A 3.3V/1.5A 5V/1.2A 7V/ 0.86A 12V/0.67A O/P 2 PO max 6.6W 6W 10W 12W 9W 3W 11W 5W 6.6W 9.9W 13.2W 6W 10W 15W 7W 9.4W 6W 6W 6W 10W 5W 6W 6W 8W Through Hole PKF PKF PKF PKF 2610A PI 2611 PI 2111A PI 2113A PI PKF PKF PKF PKF PKF PKF PKF PKF PKF PKF PKF PKF PKF PKF PKF PKF PKF PKF PKF PKF PKF PKF PKF PKF Part No. SMD 2610A SI 2611 SI 2111A SI 2113A SI 4918B SI 4310 SI 4919B SI 4510 SI 4610A SI 4910A SI 4110B SI 4611 SI 4111A SI 4211A SI 4713 SI 4928A SI 4622 SI 4628 SI 4621 SI 4121A SI 5510 5611 5617 5713 SI SI SI SI
18-36 Vdc
PKF 4310 PI PKF 4510 PI PKF 4610A PI PKF 4910A PI *) PKF PKF PKF PKF 4611 PI 4111A PI **) 4211A PI 4713 PI
36-75 Vdc
+5V/ 0.5A -5V/ 1.0A +3.3V/ 1.0A -12V / 0.5A -12V / 0.84A
PKF 4622 PI PKF 4628 PI PKF 4621 PI
18-75 Vdc
PKF PKF PKF PKF
5510 5611 5617 5713
PI PI PI PI
*) PKF 4910A PI NS **) PKF 4111A PI NS
NS = versions without synchronization function
Ericsson Microelectronics SE-164 81 KISTA, Sweden Phone: +46 8 757 5000 www.ericsson.com/microelectronics For local sales contacts, please refer to our website or call: Int. +46 8 757 4700, Fax: +46 8 757 4776
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Data Sheet
EN/LZT 146 57 R1A (c) Ericsson Microelectronics AB, March 2001

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