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MC14024B 7-Stage Ripple Counter
The MC14024B is a 7-stage ripple counter with short propagation delays and high maximum clock rates. The Reset input has standard noise immunity, however the Clock input has increased noise immunity due to Hysteresis. The output of each counter stage is buffered.
Features
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14 PDIP-14 P SUFFIX CASE 646 1 MC14024BCP AWLYYWWG
* * * * * *
Diode Protection on All Inputs Output Transitions Occur on the Falling Edge of the Clock Pulse Supply Voltage Range = 3.0 Vdc to 18 Vdc Capable of Driving Two Low-power TTL Loads or One Low-power Schottky TTL Load Over the Rated Temperature Range Pin-for-Pin Replacement for CD4024B Pb-Free Packages are Available
14
MAXIMUM RATINGS (Voltages Referenced to VSS)
Symbol VDD Vin, Vout Iin, Iout PD TA Tstg TL Parameter DC Supply Voltage Range Input or Output Voltage Range (DC or Transient) Input or Output Current (DC or Transient) per Pin Power Dissipation, per Package (Note 1) Ambient Temperature Range Storage Temperature Range Lead Temperature (8-Second Soldering) Value -0.5 to +18.0 -0.5 to VDD + 0.5 10 500 -55 to +125 -65 to +150 260 Unit V V mA mW C C C A WL, L YY, Y WW, W G
SOIC-14 D SUFFIX CASE 751A 1 14 SOEIAJ-14 F SUFFIX CASE 965 1
14024BG AWLYWW
MC14024B ALYWG
= Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Temperature Derating: Plastic "P and D/DW" Packages: - 7.0 mW/_C From 65_C To 125_C This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range VSS v (Vin or Vout) v VDD. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must be left open.
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet.
(c) Semiconductor Components Industries, LLC, 2006
October, 2006 - Rev. 7
1
Publication Order Number: MC14024B/D
MC14024B
TRUTH TABLE
Clock 0 0 1 1 Reset 0 1 0 1 0 1 0 1 State No Change All Outputs Low No Change All Outputs Low No Change All Outputs Low Advance One Count All Outputs Low
PIN ASSIGNMENT
CLOCK RESET Q7 Q6 Q5 Q4 VSS 1 2 3 4 5 6 7 14 13 12 11 10 9 8 VDD NC Q1 Q2 NC Q3 NC 2 RESET R CLOCK 1 C
LOGIC DIAGRAM
Q C Q C Q C Q
Q
R
Q
R
Q
R
Q
VDD = PIN 14 VSS = PIN 7 NC = NO CONNECTION
12 Q1
11 Q2 Q3 = PIN 9 Q4 = PIN 6 Q5 = PIN 5
4 Q6
3 Q7
ORDERING INFORMATION
Device MC14024BCP MC14024BCPG MC14024BD MC14024BDG MC14024BDR2 MC14024BDR2G MC14024BFEL MC14024BFELG Package PDIP-14 PDIP-14 (Pb-Free) SOIC-14 SOIC-14 (Pb-Free) SOIC-14 SOIC-14 (Pb-Free) SOEIAJ-14 SOEIAJ-14 (Pb-Free) 2000 / Tape & Reel 2500 / Tape & Reel 55 Units / Rail 25 Units / Rail Shipping
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
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II I II II I I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIII I I III II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II IIIIIIIIIIIIIIIIIII IIII I I I I IIII I II I I I I III II IIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II III I I I I I I I I I III I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II IIII I I IIII I IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I I I I I I III II IIII III I II II IIII I I IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIII III II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I III II IIII III I I I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I III I I I I I I I I I III II IIII III I II II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIII II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I IIII II IIII I III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I I I I I I III II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I III I I I I I I I III II IIII I II II IIII I I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I IIII IIIII I I II II II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II IIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
Total Supply Current (Notes 3 & 4) (Dynamic plus Quiescent, Per Package) (CL = 50 pF on all outputs, all buffers switching) Quiescent Current (Per Package) Input Capacitance (Vin = 0) Input Current Output Drive Current (VOH = 2.5 Vdc) (VOH = 4.6 Vdc) (VOH = 9.5 Vdc) (VOH = 13.5 Vdc) Input Voltage "0" Level (VO = 4.5 or 0.5 Vdc) (VO = 9.0 or 1.0 Vdc) (VO = 13.5 or 1.5 Vdc) Output Voltage Vin = VDD or 0 (VOL = 0.4 Vdc) (VOL = 0.5 Vdc) (VOL = 1.5 Vdc) (VO = 0.5 or 4.5 Vdc) "1" Level (VO = 1.0 or 9.0 Vdc) (VO = 1.5 or 13.5 Vdc) Vin = 0 or VDD Characteristic "0" Level "1" Level Source Sink Symbol VOH VOL IOH VIH IDD IOL Cin VIL Iin IT VDD Vdc 5.0 10 15 5.0 10 15 5.0 10 15 5.0 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 15 - - 3.0 - 0.64 - 1.6 - 4.2 4.95 9.95 14.95 0.64 1.6 4.2 Min 3.5 7.0 11 - - - - - - - - - - -
2. Data labelled "Typ" is not to be used for design purposes but is intended as an indication of the IC's potential performance. 3. The formulas given are for the typical characteristics only at 25_C. 4. To calculate total supply current at loads other than 50 pF: IT(CL) = IT(50 pF) + (CL - 50) Vfk
where: IT is in mA (per package), CL in pF, V = (VDD - VSS) in volts, f in kHz is input frequency, and k = 0.001.
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MC14024B
- 55_C
3 0.1 0.05 0.05 0.05 Max 5.0 10 20 1.5 3.0 4.0 - - - - - - - - - - - - - - - 2.4 - 0.51 - 1.3 - 3.4 4.95 9.95 14.95 0.51 1.3 3.4 Min IT = (0.31 mA/kHz) f + IDD IT = (0.60 mA/kHz) f + IDD IT = (1.89 mA/kHz) f + IDD 3.5 7.0 11 - - - - - - - - - - - 0.00001 Typ (Note 2) - 4.2 - 0.88 - 2.25 - 8.8 25_C 0.005 0.010 0.015 0.88 2.25 8.8 2.75 5.50 8.25 2.25 4.50 6.75 5.0 5.0 10 15 0 0 0 5.0 10 20 7.5 1.5 3.0 4.0 - - - - - - - - - - - - - 0.1 0.05 0.05 0.05 Max - 1.7 - 0.36 - 0.9 - 2.4 4.95 9.95 14.95 0.36 0.9 2.4 Min 3.5 7.0 11 - - - - - - - - - - - 125_C 1.0 0.05 0.05 0.05 Max 150 300 600 1.5 3.0 4.0 - - - - - - - - - - - - - - mAdc mAdc mAdc mAdc mAdc Unit Vdc Vdc Vdc Vdc pF
II IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I I IIIII I IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II IIIIIIIIIIIIIIIIIII I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIII IIIII II I IIIII I IIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I III I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I I IIIII I I IIIII I IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I II I I I I I IIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I I III I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I III I III IIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I III I II I IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIII I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIII
5. The formulas given are for the typical characteristics only at 25_C. 6. Data labelled "Typ" is not to be used for design purposes but is intended as an indication of the IC's potential performance.
SWITCHING CHARACTERISTICS (Note 5) (CL = 50 pF, TA = 25_C)
Input Pulse Frequency
Clock Input Rise and Fall Time
Reset Removal Time
Reset Pulse Width
Clock Pulse Width
Propagation Delay Time Clock to Q1 tPLH, tPHL = (1.7 ns/pF) CL + 295 ns tPLH, tPHL = (0.66 ns/pF) CL + 117 ns tPLH, tPHL = (0.5 ns/pF) CL + 85 ns Clock to Q7 tPLH, tPHL = (1.7 ns/pF) CL + 915 ns tPLH, tPHL = (0.66 ns/pF) CL + 367 ns tPLH, tPHL = (0.5 ns/pF) CL + 275 ns Reset to Qn tPLH, tPHL = (1.7 ns/pF) CL + 415 ns tPLH, tPHL = (0.66 ns/pF) CL + 217 ns tPLH, tPHL = (0.5 ns/pF) CL + 155 ns
Output Rise and Fall Time tTLH, tTHL = (1.5 ns/pF) CL + 25 ns tTLH, tTHL = (0.75 ns/pF) CL + 12.5 ns tTLH, tTHL = (0.55 ns/pF) CL + 9.5 ns
Characteristic
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tTLH, tTHL Symbol
MC14024B
tPLH, tPHL
tTLH, tTHL
trem
tWH
tWH
fcl
4 VDD 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 Min 625 190 145 600 350 260 500 165 125 - - - - - - - - - - - - - - - - - - Typ (Note 6) 1000 400 300 250 75 50 375 200 150 200 60 40 500 250 180 380 150 110 100 50 40 2.5 8.0 12 - - - 2000 750 565 Max 1.0 8.0 200 800 400 300 600 230 175 200 100 80 - - - - - - - - - 1.0 3.0 4.0 MHz Unit s ms ms ns ns ns ns ns
MC14024B
VDD VDD VOL = Vout VDD VOH = Vout
C Qn R VSS IOH EXTERNAL POWER SUPPLY
C Qn R VSS IOL EXTERNAL POWER SUPPLY
COUNT Qn TO A LOGIC 1" LEVEL.
Figure 1. Typical Output Source Characteristics Test Circuit
Figure 2. Typical Output Sink Characteristics Test Circuit
VDD 500 mF ID 0.01 mF CERAMIC
PULSE GENERATOR
f
C Q1 Q2 Q3 Q4 Q5 Q6 R Q7 VSS CL
CL CL CL CL CL CL
Figure 3. Power Dissipation Test Circuit
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t WL t WH 1 t rem 50% 2 4 8 16 32 64 128 255
VDD VSS VDD 50% VSS t R1 VOH t PHL2 90% 50% t PHL3 50% t TLH t PLH4 t PHL4 50% t TLH t PLH5 t PHL5 50% t TLH t PHL6 t PLH6 50% t TLH t PLH7 t PHL7 t THL 90% 10% t THL t R7 t R6 VOL VOH VOL VOH VOL t TLH t THL t THL t R5 VOL VOH t THL t R4 VOL VOH t THL t R3 VOL VOH 10% t TLH t PLH3 t THL t R2 VOL VOH
CLOCK (1)
RESET (2)
t PLH1 t PHL1 90% 50% 10% t TLH t PLH2
Q1 (12)
Q2 (11)
MC14024B
Figure 4. Functional Waveforms
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Input t TLH and t THL = 20 ns
Q3 (9)
6
Q4 (6)
Q5 (5)
Q6 (4)
Q7 (3)
MC14024B
PACKAGE DIMENSIONS
PDIP-14 CASE 646-06 ISSUE P
14
8
B
1 7
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. INCHES MIN MAX 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 BSC 0.052 0.095 0.008 0.015 0.115 0.135 0.290 0.310 --- 10 _ 0.015 0.039 MILLIMETERS MIN MAX 18.16 19.56 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 BSC 1.32 2.41 0.20 0.38 2.92 3.43 7.37 7.87 --- 10 _ 0.38 1.01
A F N -T-
SEATING PLANE
L C
H
G
D 14 PL
K
M
J M
DIM A B C D F G H J K L M N
0.13 (0.005)
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MC14024B
PACKAGE DIMENSIONS
SOIC-14 CASE 751A-03 ISSUE H
-A-
14 8
-B-
P 7 PL 0.25 (0.010)
M
B
M
1
7
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
G C -T-
SEATING PLANE
R X 45 _
F
D 14 PL 0.25 (0.010)
K
M
M
S
J
TB
A
S
DIM A B C D F G J K M P R
MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50
INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.228 0.244 0.010 0.019
SOLDERING FOOTPRINT*
7X
7.04 1 0.58
14X
14X
1.52
1.27 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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MC14024B
PACKAGE DIMENSIONS
SOEIAJ-14 CASE 965-01 ISSUE A
14
8
LE Q1 E HE M_ L DETAIL P
1
7
Z D e A VIEW P
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). DIM A A1 b c D E e HE 0.50 LE M Q1 Z MILLIMETERS MIN MAX --- 2.05 0.05 0.20 0.35 0.50 0.10 0.20 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --- 1.42 INCHES MIN MAX --- 0.081 0.002 0.008 0.014 0.020 0.004 0.008 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --- 0.056
c
b 0.13 (0.005)
M
A1 0.10 (0.004)
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PUBLICATION ORDERING INFORMATION
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MC14024B/D

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