 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| FDS6375 September 2001 FDS6375 P-Channel 2.5V Specified PowerTrench(R) MOSFET General Description This P -Channel 2.5V specified MOSFET is a rugged gate version of Fairchild Semiconductor's advanced PowerTrench process. It has been optimized for power management applications with a wide range of gate drive voltage (2.5V - 8V). Features * -8 A, -20 V. RDS(ON) = 24 m @ V GS = -4.5 V RDS(ON) = 32 m @ V GS = -2.5 V * Low gate charge (26 nC typical) * High performance trench technology for extremely low RDS(ON) * High current and power handling capability Applications * Power management * Load switch * Battery protection D D SO-8 DD DD D D 5 6 7 4 3 2 1 Pin 1 SO-8 G SG S S SS S TA=25oC unless otherwise noted 8 Absolute Maximum Ratings Symbol V DSS V GSS ID PD Drain-Source Voltage Gate-Source Voltage Drain Current - Continuous - Pulsed Parameter Ratings -20 8 (Note 1a) Units V V A W -8 -50 2.5 1.2 1.0 -55 to +175 Power Dissipation for Single Operation (Note 1a) (Note 1b) (Note 1c) TJ , TSTG Operating and Storage Junction Temperature Range C Thermal Characteristics RJA RJA RJ C Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Case (Note 1a) (Note 1c) (Note 1) 50 125 25 C/W C/W C/W Package Marking and Ordering Information Device Marking FDS6375 Device FDS6375 Reel Size 13'' Tape width 12mm Quantity 2500 units (c)2001 Fairchild Semiconductor Corporation FDS6375 Rev E(W) FDS6375 Electrical Characteristics Symbol BV DSS BVDSS TJ IDSS IGSSF IGSSR TA = 25C unless otherwise noted Parameter Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate-Body Leakage, Forward Gate-Body Leakage, Reverse (Note 2) Test Conditions V GS = 0 V, ID = -250 A ID = -250 A, Referenced to 25C V DS = -16 V, V GS = 0 V V GS = 8 V, V GS = -8 V, V DS = 0 V V DS = 0 V Min -20 Typ Max Units V Off Characteristics -13 -1 100 -100 mV/C A nA nA On Characteristics V GS(th) VGS(th) TJ RDS(on) Gate Threshold Voltage Gate Threshold Voltage Temperature Coefficient Static Drain-Source On-Resistance On-State Drain Current Forward Transconductance V DS = V GS , ID = -250 A ID = -250 A, Referenced to 25C V GS = -4.5 V, ID = -8 A V GS = -2.5 V, ID = -7 A V GS = -4.5 V, ID =-8A, TJ =125C V GS = -4.5 V, V DS = -5 V, V DS = -5 V ID = -8 A -0.4 -0.7 3 14 19 18 -1.5 V mV/C 24 32 39 m ID(on) gFS -50 35 A S Dynamic Characteristics Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance (Note 2) V DS = -10 V, f = 1.0 MHz V GS = 0 V, 2694 480 229 pF pF pF Switching Characteristics td(on) tr td(off) tf Qg Qgs Qgd Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge V DD = -10V, V GS = -4.5 V, ID = -1 A, RGEN = 6 12 9 124 57 22 17 197 92 36 ns ns ns ns nC nC nC V DS = -10 V, V GS = -4.5 V ID = -8 A, 26 5 6 Drain-Source Diode Characteristics and Maximum Ratings IS V SD Notes: 1. RJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RJC is guaranteed by design while RCA is determined by the user's board design. Maximum Continuous Drain-Source Diode Forward Current Drain-Source Diode Forward V GS = 0 V, IS = -2.1 A Voltage -2.1 (Note 2) A V -0.7 -1.2 a) 50 C/W when mounted on a 1in2 pad of 2 oz copper b) 105 C/W when mounted on a .04 in2 pad of 2 oz copper c) 125 C/W when mounted on a minimum pad. Scale 1 : 1 on letter size paper 2. Pulse Test: Pulse Width < 300s, Duty Cycle < 2.0% FDS6375 Rev E(W) FDS6375 Typical Characteristics 50 VGS = -4.5V -3.0V 40 -I D, DRAIN CURRENT (A) -2.0V 30 RDS(ON) , NORMALIZED DRAIN-SOURCE ON-RESISTANCE -2.5V 2.2 2 1.8 1.6 1.4 1.2 1 0.8 0 0.5 1 1.5 2 2.5 -V DS , DRAIN TO SOURCE VOLTAGE (V) 3 3.5 0 10 20 30 -ID , DRAIN CURRENT (A) 40 50 VGS = - 2.0V 20 -1.5V 10 -2.5V -3.0V -3.5V -4.5V 0 Figure 1. On-Region Characteristics. Figure 2. On-Resistance Variation with Drain Current and Gate Voltage. 0.055 1.6 RDS(ON) NORMALIZED , DRAIN-SOURCE ON-RESISTANCE ID = -8A VGS = - 4.5V 1.4 ID = -4A RDS(ON) , ON-RESISTANCE (OHM) 0.045 1.2 0.035 TA = 125o C 0.025 T A = 25o C 0.015 1 0.8 0.6 -50 0.005 -25 0 25 50 75 100 125 TJ , JUNCTION TEMPERATURE (oC) 150 175 1 2 3 4 -VGS , GATE TO SOURCE VOLTAGE (V) 5 Figure 3. On-Resistance Variation with Temperature. 50 -I S, REVERSE DRAIN CURRENT (A) V DS = -5V 40 -ID, DRAIN CURRENT (A) 125o C 30 TA = -55o C 25o C Figure 4. On-Resistance Variation with Gate-to-Source Voltage. 10 V GS = 0V 1 TA = 125o C 0.1 25o C 0.01 -55 oC 0.001 20 10 0 0.5 1 1.5 2 2.5 3 -V GS, GATE TO SOURCE VOLTAGE (V) 0.0001 0 0.2 0.4 0.6 0.8 1 -V SD , BODY DIODE FORWARD VOLTAGE (V) Figure 5. Transfer Characteristics. Figure 6. Body Diode Forward Voltage Variation with Source Current and Temperature. FDS6375 Rev E(W) FDS6375 Typical Characteristics 5 -V GS, GATE-SOURCE VOLTAGE (V) ID = -8A 4 CAPACITANCE (pF) -15V 3 V DS = -5V -10V 3200 C ISS 2400 4000 f = 1 MHz VGS = 0 V 2 1600 COSS 800 CRSS 1 0 0 6 12 18 Qg, GATE CHARGE (nC) 24 30 0 0 5 10 15 -V DS , DRAIN TO SOURCE VOLTAGE (V) 20 Figure 7. Gate Charge Characteristics. 100 P(pk), PEAK TRANSIENT POWER (W) R DS(ON) LIMIT 1ms -I D, DRAIN CURRENT (A) 10 10ms 100ms 1s 1 10s DC V GS = -4.5V SINGLE PULSE RJA = 125o C/W TA = 25 oC 0.01 0.1 1 10 100 -V DS , DRAIN-SOURCE VOLTAGE (V) 100 50 Figure 8. Capacitance Characteristics. 40 SINGLE PULSE RJA = 125C/W TA = 25C 30 20 0.1 10 0 0.001 0.01 0.1 1 t1 , TIME (sec) 10 100 1000 Figure 9. Maximum Safe Operating Area. Figure 10. Single Pulse Maximum Power Dissipation. 1 r(t), NORMALIZED EFFECTIVE TRANSIENT THERMAL RESISTANCE D = 0.5 RJA(t) = r(t) + RJA 0.2 RJA = 125 C/W P(pk) t1 t2 TJ - TA = P * RJA(t) Duty Cycle, D = t1 / t2 o 0.1 0.1 0.05 0.02 0.01 0.01 SINGLE PULSE 0.001 0.0001 0.001 0.01 0.1 t1, TIME (sec) 1 10 100 1000 Figure 11. Transient Thermal Response Curve. Thermal characterization performed using the conditions described in Note 1c. Transient thermal response will change depending on the circuit board design. FDS6375 Rev E(W) TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM BottomlessTM CoolFETTM CROSSVOLTTM DenseTrenchTM DOMETM EcoSPARKTM E2CMOSTM EnSignaTM FACTTM FACT Quiet SeriesTM DISCLAIMER FAST (R) FASTrTM FRFETTM GlobalOptoisolatorTM GTOTM HiSeCTM ISOPLANARTM LittleFETTM MicroFETTM MicroPakTM MICROWIRETM OPTOLOGICTM OPTOPLANARTM PACMANTM POPTM Power247TM PowerTrench (R) QFETTM QSTM QT OptoelectronicsTM Quiet SeriesTM SILENT SWITCHER (R) SMART STARTTM STAR*POWERTM StealthTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogicTM TruTranslationTM UHCTM UltraFET (R) VCXTM STAR*POWER is used under license FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life systems which, (a) are intended for surgical implant into support device or system whose failure to perform can the body, or (b) support or sustain life, or (c) whose be reasonably expected to cause the failure of the life failure to perform when properly used in accordance support device or system, or to affect its safety or with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Preliminary First Production No Identification Needed Full Production Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. H4 |
Price & Availability of FDS637501
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |