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| NZL5V6AXV3T1 Series Preferred Devices Zener Voltage Regulators SC - 89 Dual Common Anode Zeners for ESD Protection These dual monolithic silicon zener diodes are designed for applications requiring ESD protection capability. They are intended for use in voltage and ESD sensitive equipment such as computers, printers, business machines, communication systems, medical equipment and other applications. Their dual junction common anode design protects two separate lines using only one package. These devices are ideal for situations where board space is at a premium. Specification Features: http://onsemi.com PIN 1. CATHODE 2. CATHODE 3. ANODE 1 3 2 * SC-89 Package Allows Either Two Separate Unidirectional * Standard Zener Breakdown Voltage Ranges * ESD Rating of Class N (exceeding 16 kV) per the Human * Body Model and IEC61000-4-2 Low Leakage < 5.0 mA Configurations or a Single Bidirectional Configuration MARKING DIAGRAM 3 SC - 89 CASE 463C STYLE 4 xx D xx D 1 2 = Device Code = Date Code Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic Epoxy Meets UL94, VO LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any QUALIFIED MAX REFLOW TEMPERATURE: 260C ORDERING INFORMATION Device NZL5V6AXV3T1 NZL6V8AXV3T1 NZL7V5AXV3T1 Package SC - 89 SC - 89 SC - 89 Shipping 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel Device Meets MSL 1 Requirements Use the Device Number to order the 7 inch/3,000 unit reel. Preferred devices are recommended choices for future use and best overall value. DEVICE MARKING INFORMATION See specific marking information in the device marking column of the table on page 2 of this data sheet. (c) Semiconductor Components Industries, LLC, 2003 1 June, 2003 - Rev. 0 Publication Order Number: NZL5V6AXV3T1/D NZL5V6AXV3T1 Series MAXIMUM RATINGS Rating Total Power Dissipation on FR - 5 Board (Note 1) @ TA = 25C Derate above 25C Thermal Resistance Junction to Ambient Junction and Storage Temperature Range Lead Solder Temperature - Maximum (10 Second Duration) 1. FR - 5 board with minimum recommended mounting pad. *Other voltages may be available upon request Symbol PD RJA TJ, Tstg TL Value 240 1.9 525 - 55 to +150 260 Unit mW mW/C C/W C C ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or 2 and 3) Symbol VRWM IR VBR IT QVBR IF VF ZZT IZK ZZK Parameter Working Peak Reverse Voltage Maximum Reverse Leakage Current @ VRWM Breakdown Voltage @ IT Test Current Maximum Temperature Coefficient of VBR Forward Current Forward Voltage @ IF Maximum Zener Impedance @ IZT Reverse Current Maximum Zener Impedance @ IZK VC VBR VRWM IF I IR VF IT V IPP Uni - Directional TVS ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted, VF = 0.9 V Max @ IF = 10 mA for all types) UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or Pins 2 and 3) Breakdown Voltage Device Marking L0 L2 L3 VRWM Volts 3.0 4.5 5.0 IR @ VRWM mA 5.0 1.0 1.0 VBR (Note 2) (V) Min 5.32 6.46 7.12 Nom 5.6 6.8 7.5 Max 5.88 7.14 7.88 @ IzT mA 5.0 5.0 5.0 W 40 15 15 Zener Impedance ZZT @ IZT W 200 100 100 ZZK @ IZK mA 1.0 1.0 1.0 Device NZL5V6AXV3T1 NZL6V8AXV3T1 NZL7V5AXV3T1 2. VBR measured at pulse test current IT at an ambient temperature of 25C. 3. ZZT and ZZK are measured by dividing the AC voltage drop across the device by the AC current applied. The specified limits are for IZ(AC) = 0.1 IZ(DC), with the AC frequency = 1.0 kHz. http://onsemi.com 2 NZL5V6AXV3T1 Series TYPICAL CHARACTERISTICS BREAKDOWN VOLTAGE (VOLTS) (VBR @ IT) 8.0 7.5 NZL5V6AXV3T1 7.0 250 200 NZL5V6AXV3T1 6.5 6.0 5.5 NZL6V8AXV3T1 IR (nA) 150 100 NZL6V8AXV3T1 50 5.0 4.5 - 55 -5 + 95 + 45 TEMPERATURE (C) + 145 0 - 55 -5 + 45 + 95 TEMPERATURE (C) + 145 Figure 1. Typical Breakdown Voltage versus Temperature (Upper curve for each voltage is bidirectional mode, lower curve is unidirectional mode) Figure 2. Typical Leakage Current versus Temperature 50 PD, POWER DISSIPATION (mW) 45 40 CAPACITANCE (pF) 35 30 25 20 15 10 5 0 0 0.4 0.8 1.2 1.6 2.0 6.8 V 5.6 V 300 250 200 150 100 FR - 5 BOARD 50 0 0 25 50 75 100 125 TEMPERATURE (C) 150 175 TEMPERATURE (C) Figure 3. Typical Capacitance versus Bias Voltage Figure 4. Steady State Power Derating Curve http://onsemi.com 3 NZL5V6AXV3T1 Series TYPICAL COMMON ANODE APPLICATIONS A dual junction common anode design in an SC-89 package protects two separate lines using only one package. This adds flexibility and creativity to PCB design especially when board space is at a premium. Two simplified examples of TVS applications are illustrated below. Computer Interface Protection A KEYBOARD TERMINAL PRINTER ETC. B I/O C D FUNCTIONAL DECODER GND NZLxxxAXV3T1 Microprocessor Protection VDD VGG ADDRESS BUS RAM ROM DATA BUS I/O CPU NZLxxxAXV3T1 CLOCK CONTROL BUS GND NZLxxxAXV3T1 http://onsemi.com 4 NZL5V6AXV3T1 Series INFORMATION FOR USING THE SC - 89 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection 0.53 interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. 0.53 1.10 Dimensions in Millimeters 0.50 SC - 89 SC - 89 POWER DISSIPATION The power dissipation of the SC-89 is a function of the drain pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RJA, the thermal resistance from the device junction to ambient, and the operating temperature, TA. Using the values provided on the data sheet for the SC-89 package, PD can be calculated as follows: PD = TJ(max) - TA RJA SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. * Always preheat the device. * The delta temperature between the preheat and soldering should be 100C or less.* * When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10C. * The soldering temperature and time shall not exceed 260C for more than 10 seconds. * When shifting from preheating to soldering, the maximum temperature gradient shall be 5C or less. * After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling. * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature TA of 25C, one can calculate the power dissipation of the device which in this case is 240 milliwatts. PD = 150C - 25C = 240 milliwatts 525 C/W The 525 C/W for the SC-89 package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of TBD milliwatts. There are other alternatives to achieving higher power dissipation from the SC-89 package. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad(R). Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint. http://onsemi.com 5 NZL5V6AXV3T1 Series SC - 89, 3 - LEAD CASE 463C - 02 ISSUE B A -X- 3 1 2 B -Y- S K G 2 PL NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. 463C - 01 OBSOLETE, NEW STANDARD 463C - 02. MILLIMETERS MIN NOM MIN 1.50 1.60 1.70 0.75 0.85 0.95 0.60 0.70 0.80 0.23 0.28 0.33 0.50 BSC 0.53 REF 0.10 0.15 0.20 0.30 0.40 0.50 1.10 REF --- --- 10 _ --- --- 10 _ 1.50 1.60 1.70 INCHES NOM 0.063 0.034 0.028 0.011 0.020 BSC 0.021 REF 0.006 0.016 0.043 REF --- --- 0.063 D 0.08 (0.003) M 3 PL XY M C N J -TSEATING PLANE DIM A B C D G H J K L M N S MIN 0.059 0.030 0.024 0.009 0.004 0.012 --- --- 0.059 MAX 0.067 0.040 0.031 0.013 0.008 0.020 10 _ 10 _ 0.067 STYLE 4: PIN 1. CATHODE 2. CATHODE 3. ANODE Thermal Clad is a registered trademark of the Bergquist Company. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. PUBLICATION ORDERING INFORMATION Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303 - 675- 2175 or 800 - 344- 3860 Toll Free USA/Canada Fax: 303 - 675- 2176 or 800 - 344- 3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800 - 282- 9855 Toll Free USA/Canada JAPAN: ON Semiconductor, Japan Customer Focus Center 2- 9- 1 Kamimeguro, Meguro - ku, Tokyo, Japan 153 - 0051 Phone: 81 - 3- 5773- 3850 ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative. http://onsemi.com 6 NZL5V6AXV3T1/D |
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