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NT Features Applications Compact design to save board space 1206 footprint Small size results in very fast time to react to fault events Symmetrical design Low profile RoHS compliant* Agency recognition: T V Rheinland USB port protection - On the Go and 2.0 PC motherboards - Plug and Play protection Mobile phones - Battery and port protection PDAs / Digital Cameras Game console port protection *R oH S CO M PL IA MF-NSMF Series - PTC Resettable Fuses Electrical Characteristics Tripped Power Dissipation Ihold Model V max. Volts I max. Amps Itrip Resistance Ohms at 23 C RMin. R1Max. Max. Time To Trip Amperes at 23 C Seconds at 23 C Amperes at 23 C Hold Trip Watts at 23 C Typ. MF-NSMF012 MF-NSMF020 MF-NSMF035 MF-NSMF050 MF-NSMF075 MF-NSMF110 MF-NSMF150 MF-NSMF200 30.0 24.0 6.0 13.2 6.0 6.0 6.0 6.0 10 10 100 100 100 100 100 100 0.12 0.20 0.35 0.50 0.75 1.10 1.50 2.00 0.29 0.46 0.75 1.00 1.50 2.20 3.00 4.00 1.35 0.60 0.30 0.15 0.10 0.06 0.03 0.02 8.50 2.60 1.20 0.70 0.40 0.20 0.13 0.085 1.0 1.0 8.0 8.0 8.0 8.0 8.0 8.0 0.20 0.60 0.10 0.10 0.10 0.10 0.30 1.00 0.4 0.6 0.6 0.4 0.4 0.6 0.6 0.7 Environmental Characteristics Operating Temperature ......................................-40 C to +85 C Maximum Device Surface Temperature in Tripped State ................................................125 C Passive Aging......................................................+85 C, 1000 hours ....................................5 % typical resistance change Humidity Aging....................................................+85 C, 85 % R.H. 1000 hours ..................5 % typical resistance change Thermal Shock ....................................................+85 C to -40 C, 20 times ........................10 % typical resistance change Solvent Resistance ............................................MIL-STD-202, Method 215 ........................No change Vibration ..............................................................MIL-STD-883C, Method 2007.1, ................No change Condition A Test Procedures And Requirements For Model MF-NSMF Series Test Test Conditions Accept/Reject Criteria Visual/Mech.....................................Verify dimensions and materials ....................................Per MF physical description Resistance ......................................In still air @ 23 C............................................................Rmin R R1max Time to Trip ....................................At specified current, Vmax, 23 C ..................................T max. time to trip (seconds) Hold Current ..................................30 min. at Ihold ..............................................................No trip Trip Cycle Life ................................Vmax, Imax, 100 cycles ..................................................No arcing or burning Trip Endurance ................................Vmax, 48 hours ..............................................................No arcing or burning Solderability ....................................ANSI/J-STD-002 ............................................................95 % min. coverage UL File Number ..................................E174545 http://www.ul.com/ Follow link to Certifications, then UL File No., enter E174545 CSA File Number ..............................CA110338 http://directories.csa-international.org/ Under "Certification Record" and "File Number" enter 110338-0-000 TUV Certificate Number ....................R 02057213 http://www.tuvdotcom.com/ Follow link to "other certificates", enter File No. 2057213 Thermal Derating Chart - Ihold (Amps) Ambient Operating Temperature Model MF-NSMF012 MF-NSMF020 MF-NSMF035 MF-NSMF050 MF-NSMF075 MF-NSMF110 MF-NSMF150 MF-NSMF200 -40 C 0.19 0.30 0.51 0.76 1.11 1.64 2.20 2.88 -20 C 0.17 0.27 0.46 0.68 1.00 1.46 1.99 2.61 0 C 0.15 0.24 0.40 0.59 0.85 1.30 1.77 2.28 23 C 0.12 0.20 0.35 0.50 0.75 1.10 1.50 2.00 40 C 0.11 0.18 0.30 0.44 0.67 0.92 1.34 1.80 50 C 0.10 0.16 0.27 0.40 0.61 0.83 1.23 1.66 60 C 0.09 0.14 0.24 0.35 0.52 0.80 1.10 1.51 70 C 0.08 0.12 0.22 0.32 0.50 0.65 1.01 1.39 85 C 0.07 0.11 0.18 0.26 0.42 0.52 0.84 1.19 *RoHS Directive 2002/95/EC Jan 27 2003 including Annex Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Additional Features Additional Applications Patents pending Automotive electronic control modules MF-NSMF Series - PTC Resettable Fuses Product Dimensions Model MF-NSMF012 MF-NSMF020 MF-NSMF035 MF-NSMF050 MF-NSMF075 MF-NSMF110 MF-NSMF150 MF-NSMF200 A Min. 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) 3.00 (0.118) Max. 3.40 (0.134) 3.40 (0.134) 3.40 (0.134) 3.40 (0.134) 3.40 (0.134) 3.40 (0.134) 3.40 (0.134) 3.50 (0.138) Min. 1.40 (0.055) 1.40 (0.055) 1.40 (0.055) 1.40 (0.055) 1.40 (0.055) 1.40 (0.055) 1.40 (0.055) 1.40 (0.055) B Max. 1.80 (0.071) 1.80 (0.071) 1.80 (0.071) 1.80 (0.071) 1.80 (0.071) 1.80 (0.071) 1.80 (0.071) 1.80 (0.071) Min. 0.70 (0.028) 0.48 (0.019) 0.48 (0.019) 0.48 (0.019) 0.40 (0.016) 0.40 (0.016) 0.40 (0.016) 0.70 (0.028) C Max. 1.10 (0.043) 0.85 (0.033) 0.85 (0.033) 0.85 (0.033) 0.70 (0.028) 0.70 (0.028) 0.70 (0.028) 1.60 (0.063) D Min. 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) UNIT = MM (INCHES) Packaging: 3000 pcs. per reel. Top and Bottom View A Side View C Recommended Pad Layout 1.0 0.05 (.039 .002) 1.0 0.05 (.039 .002) 1.6 0.1 (.063 .004) 2.0 0.1 (.079 .004) Terminal material: Electroless Ni under immersion Au Termination pad solderability: Standard Au finish: Meets ANSI/J-STD-002 Category 2. Recommended Storage: 40 C max./70 % RH max. B D Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. MF-NSMF Series - PTC Resettable Fuses Typical Time to Trip at 23 C 10 How to Order MF - NSMF 075 - 2 MF-NSMF050 MF-NSMF075 MF-NSMF110 MF-NSMF012 MF-NSMF150 Multifuse(R) Product Designator Series NSMF = 1206 Surface Mount Component Hold Current, Ihold 012-200 (0.12 Amps - 2.00 Amps) Packaging Packaged per EIA 481-1 -2 = Tape and Reel 1 MF-NSMF020 MF-NSMF200 Time to Trip (Seconds) MF-NSMF035 Typical Part Marking 0.1 Represents total content. Layout may vary. PART IDENTIFICATION: MF-NSMF012 = 0 MF-NSMF020 = 2 MF-NSMF035 = 3 MF-NSMF050 = 4 MF-NSMF075 = 5 MF-NSMF110 = 6 MF-NSMF150 = 8 MF-NSMF200 = A 0 0.01 BIWEEKLY DATE CODE WILL APPEAR ON THE PACKAGING LABEL: WEEK 1 AND 2 = A WEEK 51 AND 52 = Z 0.001 0.1 1 10 100 Fault Current (Amps) The Time to Trip curves represent typical performance of a device in a simulated application environment. Actual performance in specific customer applications may differ from these values due to the influence of other variables. Solder Reflow Recommendations Preheating Soldering Cooling Notes: * MF-NSMF models cannot be wave soldered. Please contact Bourns for hand soldering recommendations. * If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. * Compatible with Pb and Pb-free solder reflow profiles. 300 250 Temperature (C) 200 150 100 50 0 Circuit Protection Division Asia-Pacific: Tel: +886-2 2562-4117 * Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 * Fax: +41-41 768 5510 The Americas: Tel: +1-951 781-5500 * Fax: +1-951 781-5700 www.bourns.com Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. 160-220 10-20 Time (seconds) 120 MF-NSMF SERIES, REV. I, 06/06 MF-NSMF Series Tape and Reel Specifications MF-NSMF012 & MF-NSMF200 per EIA 481-1 8.0 0.30 (0.315 0.012) 4.0 0.10 (0.157 0.004) 4.0 0.10 (0.157 0.004) 2.0 0.05 (0.079 0.002) 1.90 0.10 (0.075 0.004) 3.50 0.10 (0.138 0.004) 4.35 (0.171) 1.50 + 0.1/-0.0 (0.059 + 0.004/-0) 3.5 0.05 (0.138 0.002) 1.75 0.10 (0.069 0.004) 6.25 (0.246) 0.6 (0.024) 0.1 (0.004) 1.35 0.10 (0.053 0.004) 390 (15.35) 160 (6.30) Tape Dimensions W P0 P1 P2 A0 B0 B1 max. D0 F E1 E2 min. T max. T1 max. K0 Leader min. Trailer min. Reel Dimensions A max. N min. W1 W2 max. MF-NSMF020 ~ MF-NSMF050 per EIA 481-1 8.0 0.30 (0.315 0.012) 4.0 0.10 (0.157 0.004) 4.0 0.10 (0.157 0.004) 2.0 0.05 (0.079 0.002) 1.90 0.10 (0.075 0.004) 3.45 0.10 (0.136 0.004) 4.35 (0.171) 1.50 + 0.1/-0.0 (0.059 + 0.004/-0) 3.5 0.05 (0.138 0.002) 1.75 0.10 (0.069 0.004) 6.25 (0.246) 0.6 (0.024) 0.1 (0.004) 1.04 0.10 (0.041 0.004) 390 (15.35) 160 (6.30) MF-NSMF075 ~ MF-NSMF150 per EIA 481-1 8.0 0.30 (0.315 0.012) 4.0 0.10 (0.157 0.004) 4.0 0.10 (0.157 0.004) 2.0 0.05 (0.079 0.002) 1.90 0.10 (0.075 0.004) 3.45 0.10 (0.136 0.004) 4.35 (0.171) 1.50 + 0.1/-0.0 (0.059 + 0.004/-0) 3.5 0.05 (0.138 0.002) 1.75 0.10 (0.069 0.004) 6.25 (0.246) 0.6 (0.024) 0.1 (0.004) 0.85 0.10 (0.033 0.004) 390 (15.35) 160 (6.30) 185 (7.28) 50 (1.97) 8.4 + 1.5/-0.0 (0.331 + 0.059/-0.0) 14.4 (0.567) 185 (7.28) 50 (1.97) 8.4 + 1.5/-0.0 (0.331 + 0.059/-0.0) 14.4 (0.567) 185 (7.28) 50 (1.97) 8.4 + 1.5/-0.0 (0.331 + 0.059/-0.0) 14.4 (0.567) P0 T D0 P2 E1 UNIT = MM (INCHES) W2(MEASURED AT HUB) COVER TAPE F B1 B0 K0 T1 P1 A0 W1(MEASURED AT HUB) E2 W A N(HUB DIA.) Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. |
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