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 White Electronic Designs
25X32MM Daisy-Chain PBGA
FEATURES REPRESENTATIVE OF WEDC PBGAS:
25 x 32mm, 25 x 25mm, 25 x 21mm, 21 x 21mm Package material and assembly process Ball pads diameter and ball attach process Substrate dimensions, materal, process and thickness (no vias) Die dimensions and thickness (dummy die, no wirebonds) 3 - State Outputs
WEDPDC3225-B
DESCRIPTION
This is a mechaincal daisy-chain test vehicle designed to be representative of the 25 x 32mm, 25 x 25mm, 25 x 21mm, and 21 x 21mm packages. Use is for second level interconnection assembly test such tempature cycling, and continuity verification of the PBGA to the test board when it is overflowed.
This product is subject to change without notice.
PACKAGE DIMENSION: 219 PLASTIC BALL GRID ARRAY (PBGA)
All linear dimensions are in millimeters and parenthetically in inches.
February 2002 Rev. 1
1
White Electronic Designs Corporation * (602) 437-1520 * www.wedc.com
White Electronic Designs
FIGURE 1 - DAISY-CHAIN INTERCONNECTION
WEDPDC3225-B
February 2002 Rev. 1
2
White Electronic Designs Corporation * (602) 437-1520 * www.wedc.com
White Electronic Designs
ORDERING INFORMATION
WEDPDC3225-B
WEP P DC 3225 B
PACKAGE: B = 219 PBGA PACKAGE DIMENSIONS: 3225 = 32mm x 25mm TYPE: DC = DAISY CHAIN PLASTIC WHITE ELECTRONIC DESIGNS CORP.
February 2002 Rev. 1
3
White Electronic Designs Corporation * (602) 437-1520 * www.wedc.com


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