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Surface Mount Relay
Low Profile, Miniature, Surface Mount Relay
Ultra low profile only 5.2mm. Can be soldered by VPS or IRS methods. Impulse withstand voltage meets FCC and CCITT rules. Low power consumption, 140mW. Available on tape for automatic insertion.
G6H-2F
Ordering Information
Classification Single-side stable DPDT Fully sealed G6H-2F Note: 1. When ordering, add the rated coil voltage to the model number. Example: G6H-2F 12 VDC Rated coil voltage 2. When ordering tape packing, add `TR' to the model number. Example: G6H-2F TR 12 VDC Tape packing 3. `TR'is not part of the relay model number, it is not marked on the relay case.
Model Number Legend: G6H-2F 2 1
1. Taped Version TR: Taped right TL: Taped left
2. Rated Coil Voltage 5, 12, 24 VDC
Specifications
Coil Ratings
Single-side Stable Types
Rated voltage Rated current Coil resistance Coil inductance (H) (ref. value) Armature OFF Armature ON 5 VDC 28.1 mA 178 0.065 0.058 75% max. of rated voltage 10% min. of rated voltage 200% of rated voltage at 23_C, 150% at 70_C Approx. 140 mW 170% of rated voltage at 23_C, 130% at 70_C Approx. 200 mW 12 VDC 11.7 mA 1,028 0.43 0.37 24 VDC 8.3 mA 2,880 1.2 1.0
Must operate voltage Must release voltage Max. voltage Power consumption Note:
1. The rated current and coil resistance are measured at a coil temperature of 23_C with a tolerance of 10%. 2. Operating characteristics are measured at a coil temperature of 23_C.
Contact Ratings
Load Rated load Contact material Rated carry current Max. switching voltage Max. switching current Max. switching capacity Min. permissible load Resistive load (cos = 1) 0.5 A at 125 VAC; 1 A at 30 VDC Ag (Au-clad) 1A 125 VAC, 110 VDC 1A 62.5 VA, 33 W 10 A at 10 mVDC
Note:
P level: 60 = 0.1 x 10-6/operation
Characteristics
Contact resistance Operate (set) time Release (reset) time Bounce time Max. operating frequency Insulation resistance Dielectric withstand voltage 60 m max. 3 ms max. (mean value: approx. 2 ms) 2 ms max. (mean value: approx. 1 ms) Operate: 0.5 ms max. Release: 0.5 ms max. Mechanical: 36,000 operations/hr Electrical: 1,800 operations/hr (under rated load) 1,000 M min. (at 500 VDC) 1,000 VAC, 50/60 Hz for 1 min between coil and contacts 1,000 VAC, 50/60 Hz for 1 min between contacts of different polarity 750 VAC, 50/60 Hz for 1 min between contacts of same polarity 1,500 V 10 x 160 s between contacts of same polarity (conforms to FCC Part 68) Destruction: 10 to 55 Hz, 5-mm double amplitude Malfunction: 10 to 55 Hz, 3-mm double amplitude Destruction: 1,000 m/s2 (approx. 100G) Malfunction: 500 m/s2 (approx. 50G) Mechanical: 100,000,000 operations min. (at 36,000 operations/hr) Electrical: 200,000 operations min. (0.1 A at 110 VAC inductive load) Operating: -40_C to 85_C (with no icing) Operating: 35% to 85%
Impulse withstand voltage Vibration resistance Shock resistance Life expectancy Ambient temperature Ambient humidity
Weight Approx. 1.5 g Note: The data shown above are initial values.
Approved by Standards
UL114, UL478 (File No. E41515)/CSA C22.2 No. 0, No. 14 (File No. LR24825)
Model G6H-2F DPDT Contac tform Contac tform 3 to 48 VDC Contact form 1A, 30 VDC 0.3A, 100 VDC 0.5A, 125 VDC
Engineering Data
Max. Switching Capacity
Life expectancy (x103 operations)
Life Expectancy
10,000 7,000 5,000 3,000 30-VDC resistive load 1,000 700 500 300 125-VAC resistive load 100
Switching current (A)
AC resistive load
DC resistive load
Switching voltage (V)
Switching current (A)
Dimensions
Note: Orientation marks are as follows:
2.94 14 9 Glue Pads 0.3 2.54 1
0.2
5.2 6.5 0.25 9.56 7.62 11.5 14 2
0.5 2.54
Precautions
Surface Temperature of PC Board VS. Recommended Soldering Time
1. VPS
Temperature (_ C)
215_C max.
2. IRS
Temperature (_ C)
220 to 240 180 to 200 Preheating 150 Soldering Air cooling
215 180 to 200
Soldering
Air cooling
Preheating 90 to 100
90 to 120 40 to 60
90 to 120 20 to 30
Time (s)
Time (s)
3. Other Considerations * Soldering iron heat
Temperature at tip: 280_C to 300_C Power: 30 W to 60 W Heating time: 3 s to 5 s
Glue pads
*
When soldering with a pulse heater, hot air, or laser, take into account such factors as heat stress, and test the process under actual conditions.
Mounting * Can be mounted in any orientation. * Not suitable for socket mounting. * Do not reverse the coil polarity. * The diagram below the minimum
spacing necessary when mounting more than one relay on a printed circuit board. Surface Mounting Terminals
Glue Pads
Glue pads are projections from the relay case where adhesive is applied to temporarily attach the relay to the printed circuit board before soldering. The soldering points are where solder is applied during soldering.
*
Glue pads are for use with epoxy or UV adhesives. Glue pads are located on the sides to allow UV illumination and adhesive curing. Two points are provided for stability.
2,54 mm min.
Orientation Marks
These marks are provided to properly position the relays when they are supplied to the printed circuit board automatically. Two types of orientation marks are provided.
Terminals
L Terminals (G6H-2F)
*
Mechanical: A U-shaped impression along the top edge is used for alignment.
* Optical: A dark mark on the top surface is used for alignment. Cleaning Methods
Characteristics
* *
Soldering methods
Brushing Dipping Spraying Vapor Hot water Ultrasonic
Fine as long as the detergent has no chemical or electrical affect on the relay.
IRS (Infrared radiation furnace) VPS (Vapor phase) Removal and replacement is simple.
Fine as long as the detergent has no chemical or electrical affect on the relay. The model number of the ultrasound cleaning-type relay ends in "-U".
Tape Packing * Taping method
Tape type: TE2416R (or L) Reel type: R53 There are 500 relays per reel. Relay orientation:
Direction
G6H-2F-TL
Direction
G6H-2F-TR 29.5
Dimensions
Cover tape 330
Carrier tape
emboss tape 1.55 dia. 0.38 0.05 0.3
1.75
4
2
11.5 24 (10.75) R0.3 max. 14.50.1
16 4
1.5 dia. min. 6.90.1
12.1
0.3

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