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ACST6-7S
OVER VOLTAGE PROTECTED AC POWER SWITCH
ASDTM AC Switch Family
MAIN APPLICATIONS AC static switching in appliance & industrial control systems Induction motor drive actuator for: - Refrigerator / Freezer compressor - Dishwasher spray pump - Clothes drier tumble Actuator for the thermostat of a refrigerator or freezer
s s s
OUT
G OUT COM
G OUT COM
FEATURES VDRM / VRRM = +/- 700V Avalanche controlled device IT(RMS)=1.5 A with no heat sink and Tamb = 40C IT(RMS) = 6A with TCASE = 105 C High noise immunity: static dV/dt > 200 V/s Gate triggering current : IGT < 10 mA Snubberless turn off commutation: (dI/dt)c > 3.5A/ms D2PAK, I2PAK, TO-220FPAB or TO-220 package
s s s s s s s s
TO-220AB ACST6-7ST
TO-220FPAB ACST6-7SFP
OUT
OUT
G COM
G OUT COM
BENEFITS Enables equipment to meet IEC61000-4-5 standards High off-state reliability with planar technology Needs no external overvoltage protection Direct interface with the microcontroller Reduces the power component count
s s s s s
D2PAK ACST6-7SG
I2PAK ACST6-7SR
FUNCTIONAL DIAGRAM:
OUT
DESCRIPTION The ACST6-7Sx belongs to the AC power switch family built around the ASD technology. This high performance device is adapted to home appliances or industrial systems and drives an induction motor up to 6A. This ACST switch embeds a triac structure with a high voltage clamping device to absorb the inductive turn-off energy and withstand line transients such as those described in the IEC61000-4-5 standards.
G COM
January 2002 - Ed: 7F
1/9
ACST6-7S
ABSOLUTE RATINGS (limiting values)
Symbol VDRM / VRRM IT(RMS) Repetitive peak off-state voltage RMS on-state current full cycle sine wave 50 to 60 Hz, no heat sink RMS on-state current full cycle sine wave 50 to 60 Hz, TO-220AB package ITSM I2t dI/dt VPP Tstg Tj Tl Non repetitive surge peak on-state current Tj initial = 25C, full cycle sine wave Thermal constraint for fuse selection Non repetitive on-state current critical rate of rise IG = 10mA (tR < 100ns) Non repetitive line peak pulse voltage Storage temperature range Operating junction temperature range Maximum lead soldering temperature during 10s Parameter Tj = 125 C Tamb = 40 C Tcase= 105 C tp = 20ms tp = 16.7ms tp = 10ms Rate period > 1mn note 1 Value 700 1.5 6 45 50 11 100 2 - 40 to + 150 - 30 to + 125 260 Unit V A A A A A2s A/s kV C C C
Note 1: according to test described by IEC61000-4-5 standard & Figure A.
GATE CHARACTERISTICS (maximum values)
Symbol PG (AV) PGM IGM Parameter Average gate power dissipation Peak gate power dissipation (tp = 20s) Peak gate current (tp = 20s) Value 0.1 10 1 Unit W W A
THERMAL RESISTANCE
Symbol Rth (j-a) Rth (j-a) Rth (j-a) Rth (j-c) Rth (j-c) Junction to ambient I2PAK Junction to ambient D2PAK soldered on 1cm2 copper pad Junction to case for full cycle sine wave conduction (TO-220AB) Junction to case for full cycle sine wave conduction (TO-220FPAB) Parameter Junction to ambient TO-220AB / TO-220FPAB Value 60 65 45 2.5 3.5 Unit C/W C/W C/W C/W C/W
2/9
ACST6-7S
PARAMETER DESCRIPTION
Parameter Symbol IGT VGT VGD IH IL VTM VTO RD IDRM / IRRM dV/dt (dI/dt)c VCL Parameter description Gate triggering current Gate triggering voltage Non triggering voltage Holding current Latching current On state voltage On state characteristic threshold voltage On state characteristic dynamic resistance Forward or reverse leakage current Static pin OUT voltage rise Turn off current rate of decay Avalanche voltage at turn off
ELECTRICAL CHARACTERISTICS PER SWITCH For either positive or negative polary of pin OUT voltage in respect to pin COM voltage
Symbol IGT VGT VGD IH IL VTM VTM Vto RD IDRM IRRM dV/dt (dI/dt)c (dI/dt)c VCL VOUT = VDRM VOUT = VRRM VOUT = 600V gate open Vout = 12V (DC) Vout = 12V (DC) VOUT = VDRM Test conditions RL = 33 RL = 33 RL = 3.3k Tj = 25C Tj = 25C Tj =125C Tj = 25C Tj = 25C tp = 380s tp = 380s Tj = 25C Tj = 25C Tj = 125C Tj = 125C Tj = 25C Tj = 125C Tj = 125C Tj = 125C Tj = 125C Tj = 25C MAX. MAX. MIN. MAX. MAX. MAX. MAX. MAX. MAX. MAX. MAX. MIN. MIN. MIN. TYP. Values 10 1.5 0.2 25 50 1.4 1.7 0.9 80 20 500 200 3 3.5 1100 Unit mA V V mA mA V V V m A A V/s A/ms A/ms V
IOUT = 100mA Gate open IG = 20mA IOUT = 2.1A IOUT = 8.5A
(dV/dt)c = 15V/s (dV/dt)c = 15V/s Iout < 0 Rgk = 150 ICL = 1mA tp = 1ms
3/9
ACST6-7S
AC LINE SWITCH BASIC APPLICATION The ACST6-7S device is especially designed to drive medium power induction motors in refrigerators, dish washers, and tumble dryers. Pin COM : Common drive reference, to be connected to the power line neutral Pin G : Switch Gate input to be connected to the controller Pin OUT : Switch Output to be connected to the load When driven from a low voltage controller, the ACST switch is triggered with a negative gate current flowing out of the gate pin G. It can be directly driven by the controller through a resistor as shown on the typical application diagram. In appliance systems, the ACST6-7S switch intends to drive medium power load in ON / OFF full cycle or phase angle control mode. Thanks to its thermal and turn-off commutation characteristics, the ACST6-7S switch is able to drive an inductive load up to 6A without a turn-off aid snubber circuit. TYPICAL APPLICATION DIAGRAM
Run
Start
Run
Start
OUT OUT
G G COM COM
ST 62/72 MCU
ST 62/72 MCU
AC LINE TRANSIENT VOLTAGE RUGGEDNESS The ACST6-7S switch is able to safely withstand the AC line transient voltages either by clamping the low energy spikes or by breaking over under high energy shocks. The test circuit in Figure A is representative of the ACST application and is used to test the ACST switch according to the IEC61000-4-5 standard conditions. Thanks to the load impedance, the ACST switch withstands voltage spikes up to 2 kV above the peak line voltage by breaking over safely. Such non-repetitive testing can be done 10 times on each AC line voltage polarity.
Fig. A: Overvoltage ruggedness test circuit for resistive and inductive loads according to IEC61000-4-5 standard R = 10, L = 5H & VPP = 2kV
R
L
OUT
SURGE VOLTAGE AC LINE & GENERATOR
VAC + VPP
G COM
4/9
ACST6-7S
Fig. 1: Maximum power dissipation versus RMS on-state current (full cycle).
P (W) 8 7 6 5 4 3 2 1 0 0 1 2 IT(RMS) (A) 3 4 5 6
7 6 5 4 3 2 1 0 0 25 50 Tc(C) 75 100 125
TO-220FP
Fig. 2-1: RMS on-state current versus case temperature (full cycle).
IT(RMS) (A)
TO-220AB DPAK
Fig. 2-2: RMS on-state current versus ambient temperature (printed circuit board FR4, copper thickness: 35m), full cycle.
IT(RMS) (A) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 25 Tamb(C) 50 75 100 125
TO-220AB or TO-220FP Free air DPAK S=1cm
Fig. 3: Relative variation of thermal impedance versus pulse duration.
K=[Zth/Rth] 1E+0
Zth(j-c) TO-220AB & DPAK
1E-1
Zth(j-c) TO-220FP
Zth(j-a)
1E-2 tp (s) 1E-3 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2
Fig. 4: On-state characteristics (maximum values).
Fig. 5: Surge peak on-state current versus number of cycles.
ITSM (A) 50 45 40 35 30 25 20 15 10 5 0
ITM (A) 50.0 10.0
Tj max.
t=20ms
One cycle
Non repetitive Tj initial=25C
Tj=25C
1.0
Tj max.: Vto = 0.9 V Rd = 80 mW
Repetitive Tc=105C
VTM (V) 0.1 0.5 1.0 1.5 2.0 2.5 3.0
Number of cycles 1 10 100 1000
3.5
4.0
5/9
ACST6-7S
Fig. 6: Non repetitive surge peak on-state current for a sinusoidal pulse with width tp<10ms, and corresponding value of I2t. Fig. 7: Relative variation of gate trigger current, holding current and latching current versus junction temperature (typical values).
ITSM (A), It (As) 1000
dI/dt limitation: 100A/s
IGT,IH,IL[Tj] / IGT,IH,IL [Tj=25C] 3.0
Tj initial=25C
2.5
ITSM
100
2.0 1.5
IGT QIII
It
10 tp (ms) 1 0.01 0.10 1.00 10.00
1.0 0.5 0.0 -40
IGT QI, QII, IH & IL
Tj(C) -20 0 20 40 60 80 100 120 140
Fig. 8: Relative variation of critical rate of decrease of main current versus reapplied (dV/dt)c (typical values).
Fig. 9: Relative variation of critical rate of decrease of main current versus junction teperature.
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0.1 1.0 (dV/dt)c (V/s) 10.0 100.0
(dI/dt)c [Tj] / (dI/dt)c [Tj=125C] 6
Tj=125C
5 4 3 2 1 0 0 25 50 Tj (C) 75 100 125
Fig. 10: Relative variation of dV/dt immunity versus junction temperature for different values of gate to com resistance (gate open is the reference value).
dV/dt [Tj] / dV/dt [Tj=125C] 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 25 50 Tj (C) 75 100 125 150
Rgk = 1kW Rgk = 470W Rgk < 220W
Fig. 11: Thermal resistance junction to ambient versus copper surface under tab (printed circuit board FR4, copper thickness: 35m).
Rth(j-a) (C/W) 70
DPAK
60 50 40 30
Gate open
20 10 0 0 2 4 6 8 S(cm) 10 12 14 16 18 20
6/9
ACST6-7S
ORDERING INFORMATION
ACS
AC Switch
T
6
-
7
S
IGT S = 10mA
T
Package T: TO-220AB 2 G: D PAK FP: TO-220FPAB 2 R: I PAK
IT(RMS): 6A Topology: Triac
VDRM: 700V
PACKAGE MECHANICAL DATA D2PAK Plastic
DIMENSIONS REF.
A E L2 C2
Millimeters Min. Max. 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20 8 4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40 0
Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 0 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126 8
A A1 A2
D
B B2 C C2
L L3 A1 B2 B G A2 C R
D E G L L2 L3 M R V2
M
*
V2
0.40 typ.
0.016 typ.
* FLAT ZONE NO LESS THAN 2mm
FOOTPRINT DIMENSIONS (in millimeters)
16.90
10.30 1.30
5.08
3.70 8.90
7/9
ACST6-7S
PACKAGE MECHANICAL DATA TO-220AB (Plastic) REF. A C D E F F1 F2 G G1 H2 L2 L4 L5 L6 L7 L9 M Diam. DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.40 4.60 0.173 0.181 1.23 1.32 0.048 0.051 2.40 2.72 0.094 0.107 0.49 0.70 0.019 0.027 0.61 0.88 0.024 0.034 1.14 1.70 0.044 0.066 1.14 1.70 0.044 0.066 4.95 5.15 0.194 0.202 2.40 2.70 0.094 0.106 10 10.40 0.393 0.409 16.4 typ. 0.645 typ. 13 14 0.511 0.551 2.65 2.95 0.104 0.116 15.25 15.75 0.600 0.620 6.20 6.60 0.244 0.259 3.50 3.93 0.137 0.154 2.6 typ. 0.102 typ. 3.75 3.85 0.147 0.151
H2 Dia L5 C
A
L7 L6
L2 F2 F1 L9 L4 F G1 G M E D
PACKAGE MECHANICAL DATA I2PAK DIMENSIONS REF.
A E L2
Cropping Direction
Millimeters Min. Max. 4.60 2.69 0.93 1.7 0.60 1.36 9.35 10.4 5.28 17.5 1.40 14.42 4.40 2.49 0.70 1.14 0.45 1.23 8.95 10.0 4.88 16.7 1.27 13.82
Inches Min. 0.173 0.098 0.027 0.045 0.018 0.048 0.352 0.394 0.192 0.657 0.050 0.544 Max. 0.181 0.106 0.037 0.067 0.024 0.053 0.368 0.409 0.208 0.689 0.055 0.568
Note 2
C2
A A1 B
D
L
L3
B2 C C2 D
A1 C
Note 2
G B2 B
E G L L2 L3
8/9
ACST6-7S
PACKAGE MECHANICAL DATA TO-220FPAB (Plastic) DIMENSIONS REF.
A H B
Millimeters Min. Max. 4.4 4.6 2.5 2.7 2.5 2.75 0.45 0.70 0.75 1 1.15 1.70 1.15 1.70 4.95 5.20 2.4 2.7 10 10.4 16 Typ. 28.6 30.6 9.8 10.6 2.9 3.6 15.9 16.4 9.00 9.30 3.00 3.20
Inches Min. Max. 0.173 0.181 0.098 0.106 0.098 0.108 0.018 0.027 0.030 0.039 0.045 0.067 0.045 0.067 0.195 0.205 0.094 0.106 0.393 0.409 0.63 Typ. 1.126 1.205 0.386 0.417 0.114 0.142 0.626 0.646 0.354 0.366 0.118 0.126
Dia L6 L2 L3 L5 D F1 L4 F2 L7
F G1 G
E
A B D E F F1 F2 G G1 H L2 L3 L4 L5 L6 L7 Dia.
OTHER INFORMATION
Ordering type ACST6-7ST ACST6-7SG ACST6-7SFP ACST6-7SR
s
Marking ACST67S ACST67S ACST67S ACST67S
Package TO-220AB D PAK TO-220FPAB I PAK
2 2
Weight 2.3 g 1.5 g 2.4 g 1.5 g
Base qty 50 50 50 50
Delivery mode Tube Tube Tube Tube
Epoxy meets UL94,V0
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics (c) 2002 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 9/9


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