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 PD - 90432C
REPETITIVE A ALANCHE AND dv/dt RATED V
HEXFET TRANSISTORS THRU-HOLE (TO-205AF)
Product Summary
Part Number IRFF330 BVDSS 400V RDS(on) 1.0 ID 3.0A
IRFF330 JANTX2N6800 JANTXV2N6800 REF:MIL-PRF-19500/557 400V, N-CHANNEL
The HEXFET technology is the key to International Rectifier's advanced line of power MOSFET transistors. The efficient geometry and unique processing of this latest "State of the Art" design achieves: very low on-state resistance combined with high transconductance. The HEXFET transistors also feature all of the well established advantages of MOSFETs such as voltage control, very fast switching, ease of parelleling and temperature stability of the electrical parameters. They are well suited for applications such as switching power supplies, motor controls, inverters, choppers, audio amplifiers and high energy pulse circuits.
TO-39
Features:
n n n n n
Repetitive Avalanche Ratings Dynamic dv/dt Rating Hermetically Sealed Simple Drive Requirements Ease of Paralleling
Absolute Maximum Ratings
Parameter
ID @ VGS = 10V, TC = 25C ID @ VGS = 10V, TC = 100C I DM PD @ TC = 25C VGS EAS IAR EAR dv/dt TJ T STG Continuous Drain Current Continuous Drain Current Pulsed Drain Current Max. Power Dissipation Linear Derating Factor Gate-to-Source Voltage Single Pulse Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Operating Junction Storage Temperature Range Lead Temperature Weight For footnotes refer to the last page 3.0 2.0 14 25 0.20 20 0.51 -- -- 4.0 -55 to 150 300 (0.063 in. (1.6mm) from case for 10s) 0.98(typical)
Units A
W
W/C
V mJ A mJ V/ns
o
C
g
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1
01/22/01
IRFF330
Electrical Characteristics
Parameter
BVDSS BVDSS/T J RDS(on) VGS(th) gfs IDSS
@ Tj = 25C (Unless Otherwise Specified) Min
400 -- -- -- 2.0 2.0 -- -- -- -- 19.1 1.0 6.7 -- -- -- -- --
Typ Max Units
-- 0.37 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 7.0 -- -- 1.0 1.15 4.0 -- 25 250 100 -100 33 5.8 19.9 30 35 55 35 -- V V/C V S( ) A
Test Conditions
VGS = 0V, ID = 1.0mA Reference to 25C, ID = 1.0mA VGS = 10V, ID = 2.0A VGS =10V, ID =3.0A VDS = VGS, ID = 250A VDS > 15V, IDS = 2.0A VDS= 320V, VGS=0V VDS = 320V VGS = 0V, TJ = 125C VGS = 20V VGS = -20V VGS =10V, ID =3.0A VDS= 200V VDD = 200V, ID = 3.0A, RG = 7.5
Drain-to-Source Breakdown Voltage Temperature Coefficient of Breakdown Voltage Static Drain-to-Source On-State Resistance Gate Threshold Voltage Forward Transconductance Zero Gate Voltage Drain Current
I GSS I GSS Qg Qgs Qgd td(on) tr td(off) tf LS + LD
Gate-to-Source Leakage Forward Gate-to-Source Leakage Reverse Total Gate Charge Gate-to-Source Charge Gate-to-Drain (`Miller') Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Inductance
nA nC
ns
nH
Measured from drain lead (6mm/0.25in. from package) to source lead (6mm/0.25in. from package)
Ciss Coss Crss
Input Capacitance Output Capacitance Reverse Transfer Capacitance
-- -- --
620 200 75
-- --
pF
VGS = 0V, VDS = 25V f = 1.0MHz
Source-Drain Diode Ratings and Characteristics
Parameter
IS ISM VSD t rr QRR ton Continuous Source Current (Body Diode) Pulse Source Current (Body Diode) Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Forward Turn-On Time
Min Typ Max Units
-- -- -- -- -- -- -- -- -- -- 3.0 14 1.4 700 6.2
Test Conditions
A
V nS C Tj = 25C, IS =3.0A, VGS = 0V Tj = 25C, IF =3.0A, di/dt 100A/s VDD 50V
Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD.
Thermal Resistance
Parameter
RthJC R thJA Junction-to-Case Junction-to-Ambient
Min Typ Max Units
-- -- -- -- 5.0 175
C/W
Test Conditions
Typical socket mount.
Note: Corresponding Spice and Saber models are available on the G&S Website. For footnotes refer to the last page
2
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IRFF330
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
Fig 4. Normalized On-Resistance Vs. Temperature
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3
IRFF330
13 a& b
Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage
Fig 6. Typical Gate Charge Vs. Gate-to-Source Voltage
Fig 7. Typical Source-Drain Diode Forward Voltage
Fig 8. Maximum Safe Operating Area
4
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IRFF330
V DS VGS RG
RD
D.U.T.
+
-V DD
10V
Pulse Width 1 s Duty Factor 0.1 %
Fig 10a. Switching Time Test Circuit
VDS 90%
Fig 9. Maximum Drain Current Vs. Case Temperature
10% VGS
td(on) tr t d(off) tf
Fig 10b. Switching Time Waveforms
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
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5
IRFF330
1 5V
VD S
L
D R IV E R
RG
D .U .T
IA S
+ - VD D
A
10V 20V
tp
0 .0 1
Fig 12a. Unclamped Inductive Test Circuit
V (B R )D S S tp
Fig 12c. Maximum Avalanche Energy Vs. Drain Current
IAS
Fig 12b. Unclamped Inductive Waveforms
Current Regulator Same Type as D.U.T.
50K
QG
12V
.2F .3F
10 V
QGS VG QGD
VGS
3mA
D.U.T.
+ V - DS
Charge
IG
ID
Current Sampling Resistors
Fig 13a. Basic Gate Charge Waveform
Fig 13b. Gate Charge Test Circuit
6
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IRFF330
Foot Notes:
Repetitive Rating; Pulse width limited by
maximum junction temperature. VDD =50V, starting TJ = 25C, Peak IL = 3.0A,
ISD 3.0A, di/dt 90A/s,
VDD 400V, TJ 150C Suggested RG =7.5 Pulse width 300 s; Duty Cycle 2%
Case Outline and Dimensions --TO-205AF
LEGEND 1- SOURCE 2- GATE 3- DRAIN
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 IR EUROPEAN REGIONAL CENTRE: 439/445 Godstone Rd, Whyteleafe, Surrey CR3 OBL, UK Tel: ++ 44 (0)20 8645 8000 IR CANADA: 15 Lincoln Court, Brampton, Ontario L6T3Z2, Tel: (905) 453 2200 IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 (0) 6172 96590 IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 011 451 0111 IR JAPAN: K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo 171 Tel: 81 (0)3 3983 0086 IR SOUTHEAST ASIA: 1 Kim Seng Promenade, Great World City West Tower, 13-11, Singapore 237994 Tel: ++ 65 (0)838 4630 IR TAIWAN:16 Fl. Suite D. 207, Sec. 2, Tun Haw South Road, Taipei, 10673 Tel: 886-(0)2 2377 9936 Data and specifications subject to change without notice. 1/01
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7
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