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ST1394
IEEE1394 ONE PORT CABLE TERMINATION NETWORK WITH ESD PROTECTION DIODES
IPADTM
MAIN APPLICATIONS
IEEE1394 line termination on:

TPB+ TPATpBias
Desktops Notebooks Digital Camcorders External storage drive Set Top Box
139
TPBGND TPA-
FEATURES Line termination for 2 twisted pairs TPA and TPB The device complies with IEEE1394 requirement for differential and common more impedance on TPA and TPB line Monolithic device with complete termination for one IEEE1394 connection DESCRIPTION The ST1394-01SC6 is an integrated termination network that optimizes board layout of the PHY layer in IEEE1394 one port cable application. This monolithic device is tested, according to ESD requirement described in IEC61000-4-2 standard level 2. ST1394-01SC6 device ruggedness limits overvoltage at the 1394 tranceiver inputs and outputs below acceptable limits. The ST1394-01SC6 implements IEEE1394 recommendation for line termination of TPA and TPB differential lines. Excellent matching of the termination resistor will minimize common mode noise that is needed to improve communication speed. BENEFITS

SOT23-6L (Plastic) Table 1: Order Code Part Number ST1394-01SC6
Marking 139
Figure 1: Pinout Configuration
TPA+ GND
R1 R2
TpBias TPA-
C
R5
TPB-
R4
R3
TPB+
Resistor matching between TPA / TPB lines. Resistor matching between TPA+ / TPASingle chip devise versus 11 discretes No need for additional overvoltage protection device High level of integration
Lines
Names Value
TPA+ TPA- TPB+ TPBR1 55 R12 55 Typ. R3 55 Typ. R4 55 Typ.
Rpd
R5 55 20%
GND
C 250pF 20%
Zener Capacitance
Cz 5pF Max.
Tolerance Typ.
Matching
Matching between 55 Resistor at 1% max
TM: IPAD is a trademark of STMicroelectronics.
October 2004
REV. 2
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ST1394
Table 2: Absolute Ratings (Tamb = 25C) Symbol Tstg Tj TL Parameter and test conditions Storage temperature range Maximum junction temperature Lead solder temperature (10 second duration) Value - 55 to + 150 + 150 260 Unit C C C
Table 3: Electrical Characteristics (Tamb = 25C) Symbol CZ Rpd C (R1+R2), (R3+R4) Parameter Zener capacitance Pull down resistor Capacitor in parallel with Rpd Bus termination impedance 102 5 250 110 118 Min. Typ. 55 5 Max. Unit pF k pF R1, R2, R3, R4 Bus termination resistors (note 1)
Note 1: matching between 55 resistors is better than 1%.
Figure 2: Functionnal Diagram
TpBias 1F TPA+ TPA55
Twisted Pair A
55
250pF
5k
55
55
TPB+ TPB-
Twisted Pair B 1M Outer shied 0.1F termination
Minimize this distance
0.01F
APPLICATION INFORMATION The functional diagram here above presents a IEEE1394-a cable and shows how to connect the ST1394-01SC6 in order to correctly terminate and filter the TPA and TPB lines.
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ST1394
TECHNICAL INFORMATION: Frequency behavior of data and strobe signals Figure 3: Measurement confitions Figure 4: Test Board
TRACKING GENERATOR 50
+5V
RF test board
SPECTRUM ANALYSER
Calibration kit board
ST1394
Vg 50 Vin Vout
Figure 5: TPA line: comparison between Aplac model and device
0.00 dB -5.00
Figure 6: TPB line: comparison between Aplac model and device
0.00 dB -5.00 -10.00 -15.00 -20.00
-10.00
-25.00 -30.00
-15.00
-35.00 -40.00 -45.00
-20.00 100.0k
1.0M Line 1
10.0M 100.0M f/Hz SimLine 1
1.0G
-50.00 100.0k
1.0M Line 2
10.0M 100.0M f/Hz SimLine 2
1.0G
Note: For a convenience reason, frequency response have been carried out on both TPA and TPB lines as if TPA+ and TPA- or TPB+ and TPB- were respectively Inputs and Outputs lines
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ST1394
Figure 7: Crosstalk between TPA and TPB lines
0.00 dB -25.00
-50.00
-75.00
-100.00 100.0k
1.0M
10.0M 100.0M f/Hz
1.0G
Figure 8: CST1394 APLAC model
Lbond 55 55 Lbond Rbond Lframe Lpin Lbond Rpin Rbond Ls Lpin Rs Rpin Port9 Ls Rs Ls Rpin Rgnd Lpin Lgnd 55 55 Rbond Rframepin Port10 250p Ls Lbond Lpin Rs Rpin Rbond Lpin
Ls=1n Rs=100m Lpin =230p Rpin =50m Lbond =420p Rbond =50m LFrame=80p Rframepin=8.6m
5k
Rs
Lgnd =50p Rgnd =50m
Port11 Port12
Cdiode =4p
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ST1394
Figure 9: SOT23-6L Package Mechanical Data DIMENSIONS REF.
A2 A
Millimeters Min. Typ. Max. 0.10 Min. 0 0.90 0 0.90 0.35 0.09 2.80 1.50 0.95 2.60 0.10 3.00 0.102 0.60 0.004 10 1.45 0.035 1.30 0.035 0.50 0.014 0.20 0.004 3.05 0.110 1.75 0.059
Inches Typ. Max. 0.057 0.004 0.051 0.02 0.008 0.120 0.069 0.037 0.118 0.024 10
A
D
A1 A2 b C D E e H L
A1
b
L
H
E
c
e
e
Figure 10: SOT23-6L Foot print dimensions (in millimeters)
0.60
TPBIAS TPA+ TPATPA+ TpBias
1.20 0.95
TPB+ TPBAGND
GND
TPA-
TPB-
TPB+
Table 4: Ordering Information Ordering code ST1394-01SC6 Marking 139 Package SOT23-6L Weight 16.7 mg Base qty 3000 Delivery mode Tape & reel
Note: More informations are available in the application note: AN1783: "HOW TO MAKE FIRE-WIRE COMMUNICATION PORT SAFE?"
Table 5: Revision History Date Jul-2003 28-Oct-2004 Revision 1A 2 First issue. SOT23-6L package dimensions change for reference "D" from 3.0 millimeters (0.118 inches) to 3.05 millimeters (0.120 inches). Description of Changes
AVDD
AGND
3.50
2.30
1.10
AVDD
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ST1394
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2004 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com
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