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Package information - SOT23-5
Surface mounted, 5 pin package Package outline
DIM A A1 A2 b C D E E1 e e1 L a Min. 0.90 0.00 0.90 0.20 0.09 2.70 2.20 1.30
Millimeters Max. 1.45 0.15 1.30 0.50 0.26 3.10 3.20 1.80 0.95 REF 1.90 REF 0.10 0 0.60 30 0.0039 0 Min. 0.0354 0.00 0.0354 0.0078 0.0035 0.1062 0.0866 0.0511
Inches Max. 0.0570 0.0059 0.0511 0.0196 0.0102 0.1220 0.1181 0.0708 0.0374 REF 0.0748 REF 0.0236 30
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
Soldering footprint
0.95 0.375 1.06 0.042 2.2 0.087
0.65 0.025
mm inches
Issue 1 - September 2005
(c) Zetex Semiconductors plc 2005
1
www.zetex.com
Package information - SOT23-5
Nominal weight
Nominal weight per device 12mg.
Tape and reel information
Orientation Tape width (mm) 8 8 Reel size (inches) 7 13 No. of components 3,000 10,000 Tape option indicator TA TC
Embossed carrier tape configuration
P0 K t
Top cover tape 10 pitches culmulative tolerance on tape 0.2mm (0.008")
D
P2
E
See Note 1
A0
See Note 1
F
W
B1
K0
See Note 1
B0 P
Embossment Center lines of cavity
D1
User direction of feed
Dimensions mm (inches) A0, B0, K0 B1 (max.) D D1 (max.) E F P
Tape size (mm) 8 See note
*
12 See note
*
16 See note
*
24 See note* 20.10 (0.791) 1.50 + 0.10 - 0.00 1.50 (0.059) 1.75 0.10 11.50 0.10 (0.453 0.004) 4.00 0.10 (0.157 0.004) to 20.00 0.10 (0.787 0.004) in 4.00 (0.157) increments 4.00 0.10 2.00 0.05 0.40 24.30 (0.957)
4.55 (0.179) 1.50 + 0.10 - 0.00 1.00 (0.039) 1.75 0.10 3.50 0.10 (0.138 0.004) 4.00 0.10 (0.157 0.004)
8.20 (0.323) 1.50 + 0.10 - 0.00 1.50 (0.059) 1.75 0.10 5.50 0.05 (0.217 0.002) 4.00 0.10 (0.157 0.004) 8.00 0.10 (0.315 0.004)
12.10 (0.476) 1.50 + 0.10 - 0.00 1.50 (0.059) 1.75 0.10 7.50 0.10 (0.295 0.004) 4.00 0.10 (0.157 0.004) 8.00 0.10 (0.315 0.004) 12.00 0.10 (0.472 0.004) 4.00 0.10 2.00 0.05 0.40 16.30 (0.642)
P0 P2 t (max.) W
4.00 0.10 2.00 0.05 0.40 8.00 (0.315)
4.00 0.10 2.00 0.05 0.40 12.00 0.30 (0.472 0.012)
NOTES: * A0, B0 and K0 dimensions are determined with respect to EIA/JEDEC rotational and lateral movement requirements (see fig. 1).
Issue 1 - September 2005
(c) Zetex Semiconductors plc 2005
2
www.zetex.com
Package information - SOT23-5
0.5mm maximum 20 maximum Component cavity center line
0.5mm maximum
B0
20 maximum Component center line A0
Component rotation - side view
Component lateral movement
Component rotation - top view
Figure 1 - rotational and lateral movement
Reel configuration
Tape slot in core for tape start. 2.5mm min. width, 10mm min. depth
T
B
A
D
N
C
Full radius
G
Tape size 8mm 12mm 16mm 24mm
A (max.) 179 (7.047) 330 (12.992) 330 (12.992) 330 (12.992)
B (min.) 1.5 (0.06) 1.5 (0.06) 1.5 (0.06) 1.5 (0.06)
C 13.00 0.02 (0.512 0.008) 13.00 0.02 (0.512 0.008) 13.00 0.02 (0.512 0.008) 13.00 0.02 (0.512 0.008)
D (min.) 25.0 (0.984) 20.2 (0.795) 20.2 (0.795) 20.2 (0.795)
N (min.) 50 (1.969) 50 (1.969) 50 (1.969) 60 (2.362)
G 8.4 +1.5 -0.0 (0.33 +0.06 - 0.00) 12.4 +2.0 -0.0 (0.49 +0.079 - 0.00) 16.4 +2.0 -0.0 (0.65 +0.079 - 0.00) 24.4 +2.0 -0.0 (0.96 +0.079 -0.00)
T (max.) 14.4 (0.567) 18.4 (0.724) 22.4 (0.882) 30.4 (1.197)
This publication is issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contact or be regarded as a representation relating to the products or services concerned. The company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service.
Issue 1 - September 2005
(c) Zetex Semiconductors plc 2005
3
www.zetex.com

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