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| (R) EMIF02-MIC02F2 IPADTM 2 LINES EMI FILTER INCLUDING ESD PROTECTION MAIN PRODUCT CHARACTERISTICS: Where EMI filtering in ESD sensitive equipment is required: Mobile phones and communication systems Computers, printers and MCU Boards DESCRIPTION The EMIF02-MIC02 is a highly integrated devices designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. The EMIF02 flip chip packaging means the package size is equal to the die size. This filter includes an ESD protection circuitry which prevents the device from destruction when subjected to ESD surges up 15kV. BENEFITS EMI symmetrical (I/O) low-pass filter High efficiency in EMI filtering Lead free package Very low PCB space consuming: 1.07mm x 1.57mm Very thin package: 0.65 mm High efficiency in ESD suppression High reliability offered by monolithic integration High reducing of parasitic elements through integration & wafer level packaging. COMPLIES WITH THE FOLLOWING STANDARDS: IEC61000-4-2 Level 4 on input pins 15kV (air discharge) 8kV (contact discharge) Level 1 on output pins 2kV 2kV (air discharge) (contact discharge) Flip-Chip (6 Bumps) Table 1: Order Code Part Number EMIF02-MIC02F2 Marking FJ Figure 1: Pin Configuration (Ball side) 3 I2 O2 2 GND GND 1 I1 O1 A B Figure 2: Basic Cell Configuration Low-pass Filter Input Output Ri/o = 470 Cline = 16pF GND TM: IPAD is a trademark of STMicroelectronics. GND GND October 2004 REV. 1 1/7 EMIF02-MIC02F2 Table 2: Absolute Ratings (limiting values) Symbol Tj Top Tstg Parameter and test conditions Maximum junction temperature Operating temperature range Storage temperature range Value 125 - 40 to + 85 - 55 to + 150 Unit C C C Table 3: Electrical Characteristics (Tamb = 25C) Symbol VBR IRM VRM VCL Rd IPP RI/O Cline Symbol VBR IRM RI/O Cline @ 0V IR = 1 mA VRM = 12V per line 423 470 16 Parameter Breakdown voltage Leakage current @ VRM Stand-off voltage Clamping voltage Dynamic impedance Peak pulse current Series resistance between Input & Output Input capacitance per line Test conditions Min. 14 Typ. 16 500 517 Max. Unit V nA pF IPP VCL VBR VRM IR IRM IRM IR VRM VBR VCL V I IPP Figure 3: S21 (dB) attenuation measurement and Aplac simulation - 10.00 dB - 15.00 - 20.00 - 25.00 - 30.00 - 35.00 Measurement Figure 4: Analog crosstalk measurements -20.00 dB -30.00 -40.00 I2/O1 -50.00 -60.00 - 40.00 - 45.00 Simulation -70.00 - 50.00 1.0M 3.0M 10.0M 30.0M 100.0M f/Hz 300.0M 1.0G 3.0G -80.00 1.0M 3.0M 10.0M 30.0M 100.0M f/Hz 300.0M 1.0G 3.0G 2/7 EMIF02-MIC02F2 Figure 5: Digital crosstalk measurement Figure 6: ESD response to IEC61000-4-2 (+15kV air discharge) on one input V(in) and on one output (Vout) Figure 7: ESD response to IEC61000-4-2 (+15kV air discharge) on one input V(in) and on one output (Vout) Figure 8: Line capacitance versus applied voltage C(pF) 20 18 16 14 12 10 8 6 4 2 0 0 1 2 3 4 5 6 7 8 9 10 11 12 VR(V) F=1MHz Vosc=30mVRMS Tj=25C 3/7 EMIF02-MIC02F2 Figure 9: Aplac model R_470R O1 I1 gnd Cox MODEL = D01-int MODEL = D01-ext Cox 50pH Rsubump MODEL = D01-gnd gnd 50pH Rsubump 50m 50m Rsubump MODEL = D01-ext Cox MODEL = D01-int Rsubump Lgnd Cgnd Cgnd Rgnd O2 Lgnd Cox Rgnd I2 R_470R Figure 10: Aplac parameters Model D01-ext BV = 7 CJO = Cz_ext IBV = 1u IKF = 1000 IS = 10f ISR = 100p N=1 M = 0.3333 RS = Rs_ext VJ = 0.6 TT = 50n Model D01-int BV = 7 CJO = Cz_int IBV = 1u IKF = 1000 IS = 10f ISR = 100p N=1 M = 0.3333 RS = Rs_int VJ = 0.6 TT = 50n Model D01-gnd BV = 7 CJO = Cz_gnd IBV = 1u IKF = 1000 IS = 10f ISR = 100p N=1 M = 0.3333 RS = Rs_gnd VJ = 0.6 TT = 50n Ls 400pH Rs 100m R_470R 482.6 Cz_ext 8.73pF Rs_ext 850m Cz_int 2.9pF Rs_int 850m Cz_gnd 215.61pF Rs_gnd 470m Rgnd 10m Lgnd 48pH Cgnd 0.15pF Cox 3.05pF Rsubump 200m 4/7 EMIF02-MIC02F2 Figure 11: Ordering Information Scheme EMIF EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version Package F = Flip-Chip x = 1: 500m, Bump = 315m = 2: Leadfree Pitch = 500m, Bump = 315m = 3: Leadfree Pitch = 400m, Bump = 250m yy - xxx zz Fx Figure 12: FLIP-CHIP Package Mechanical Data 500m 50 315m 50 650m 65 500m 50 1.07mm 50m Figure 13: Foot print recommendations 1.57mm 50m Figure 14: Marking Copper pad Diameter : 250m recommended , 300m max Solder stencil opening : 330m Dot, ST logo xx = marking z = packaging location yww = datecode (y = year ww = week) 365 240 365 E Solder mask opening recommendation : 340m min for 300m copper pad diameter xxz y ww 40 220 All dimensions in m 5/7 EMIF02-MIC02F2 Figure 15: FLIP-CHIP Tape and Reel Specification Dot identifying Pin A1 location 4 +/- 0.1 O 1.5 +/- 0.1 1.75 +/- 0.1 3.5 +/- 0.1 0.73 +/- 0.05 All dimensions in mm Table 4: Ordering Information Ordering code EMIF02-MIC02F2 Marking FJ Package Flip-Chip Weight 2.3 mg Base qty 5000 Delivery mode Tape & reel 7" Note: More informations are available in the application notes: AN1235: "Flip-Chip: Package description and recommendations for use" AN1751: "EMI Filters: Recommendations and measurements" Table 5: Revision History Date 12-Oct-2004 Revision 1 First issue Description of Changes 8 +/- 0.3 STE STE STE xxz yww User direction of unreeling xxz yww xxz yww 4 +/- 0.1 6/7 EMIF02-MIC02F2 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2004 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 7/7 |
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