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| TM ACTS74MS Radiation Hardened Dual D Flip Flop with Set and Reset Pinouts 14 PIN CERAMIC DUAL-IN-LINE MIL-STD-1835 DESIGNATOR CDIP2-T14, LEAD FINISH C TOP VIEW R1 1 D1 2 CP1 3 S1 4 Q1 5 Q1 6 GND 7 14 VCC 13 R2 12 D2 11 CP2 10 S2 9 Q2 8 Q2 January 1996 Features * Devices QML Qualified in Accordance with MIL-PRFF-38535 itle CTS MS) bt adian rded al D p p th t and set) thor eyrds terminctor, dian rded, , d rd, L, tel, D, ass * Detailed Electrical and Screening Requirements are Contained in SMD# 5962-96713 and Intersil's QM Plan * 1.25 Micron Radiation Hardened SOS CMOS * Total Dose . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >300K RAD (Si) * Single Event Upset (SEU) Immunity: <1 x 10-10 Errors/Bit/Day (Typ) * SEU LET Threshold . . . . . . . . . . . . . . . . . . . . . . . >100 MEV-cm2/mg * Dose Rate Upset . . . . . . . . . . . . . . . . >1011 RAD (Si)/s, 20ns Pulse * Dose Rate Survivability . . . . . . . . . . . >1012 RAD (Si)/s, 20ns Pulse * Latch-Up Free Under Any Conditions * Military Temperature Range . . . . . . . . . . . . . . . . . . -55oC to +125oC * Significant Power Reduction Compared to ALSTTL Logic * DC Operating Voltage Range . . . . . . . . . . . . . . . . . . . . 4.5V to 5.5V * Input Logic Levels - VIL = 0.8V Max - VIH = VCC/2 Min * Input Current 1A at VOL, VOH * Fast Propagation Delay . . . . . . . . . . . . . . . . 20ns (Max), 13ns (Typ) 14 PIN CERAMIC FLATPACK MIL-STD-1835 DESIGNATOR CDFP3-F14, LEAD FINISH C TOP VIEW R1 D1 CP1 S1 Q1 1 2 3 4 5 6 7 14 13 12 11 10 9 8 VCC R2 D2 CP2 S2 Q2 Q2 Description The Intersil ACTS74MS is a Radiation Hardened Dual D Flip Flop with Set(s) and Reset (R). The logic level at data input is transferred to the output during the positive transition of the clock. The Set and Reset are independent from the clock and accomplished by a low level on the appropriate input. The ACTS74MS utilizes advanced CMOS/SOS technology to achieve high-speed operation. This device is a member of a radiation hardened, high-speed, CMOS/SOS Logic Family. The ACTS74MS is supplied in a 14 lead Ceramic Flatpack (K suffix) or a 14 Lead Ceramic Dual-In-Line Package (D suffix). Q1 GND Ordering Information PART NUMBER 5962F9671301VCC 5962F9671301VXC ACTS74D/Sample ACTS74K/Sample ACTS74HMSR TEMPERATURE RANGE -55 C to +125 C -55oC to +125oC o o SCREENING LEVEL MIL-PRF-38535 Class V MIL-PRF-38535 Class V Sample Sample Die PACKAGE 14 Lead SBDIP 14 Lead Ceramic Flatpack 14 Lead SBDIP 14 Lead Ceramic Flatpack Die 25 C 25oC 25oC o CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil and Design is a trademark of Intersil Americas Inc. Copyright (c) Intersil Americas Inc. 2001, All Rights Reserved 1 Spec Number File Number 518787 3382.1 ACTS74MS Functional Diagram S 4(10) CL P N CL D 2(12) P N CL CL P N R 1(13) Cp 3(11) CL CL CL CL CL P N CL Q 6(8) Q 5(9) TRUTH TABLE INPUTS SET L H L H H H RESET H L L H H H L CP X X X D X X X H L X OUTPUTS Q H L Q L H H (Note 2) H (Note 2) H L Q0 L H Q0 H = High Level (Steady State) L = Low Level (Steady State) NOTES: X = Don't Care = Transition from Low to High Level 1. Q0 = the level of Q before the indicated input conditions were established. 2. This configuration is nonstable, that is, it will not persist when set and reset inputs return to their inactive (high) level. All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com Spec Number 2 518787 ACTS74MS Die Characteristics DIE DIMENSIONS: 88 mils x 88 mils 2240mm x 2240mm METALLIZATION: Type: AlSi Metal 1 Thickness: 7.125kA 1.125kA Metal 2 Thickness: 9kA 1kA GLASSIVATION: Type: SiO2 Thickness: 8kA 1kA WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 110m x 110m 4.3 mils x 4.3 mils Metallization Mask Layout ACTS74MS D1 (2) R1 (1) VCC (14) R2 (13) CP1 (3) (12) D2 S1 (4) (11) CP2 Q1 (5) (10) S2 NC NC (6) Q1 (7) GND (8) Q2 (9) Q2 Spec Number 3 518787 |
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