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CRS08
TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type
CRS08
Switching Mode Power Supply Applications Portable Equipment Battery Applications
* * * * Forward voltage: VFM = 0.36 V (max) Average forward current: IF (AV) = 1.5 A Repetitive peak reverse voltage: VRRM = 30 V Suitable for compact assembly due to small surface-mount package "S-FLATTM" (Toshiba package name) Unit: mm
Maximum Ratings (Ta = 25C)
Characteristics Repetitive peak reverse voltage Average forward current Peak one cycle surge forward current (non-repetitive) Junction temperature Storage temperature Symbol VRRM IF (AV) IFSM Tj Tstg Rating 30 1.5 (Note) 30 (50 Hz) -40~125 -40~150 Unit V A A C C
JEDEC JEITA TOSHIBA
3-2A1A
Note: T = 86C: Rectangular waveform (a = 180C), VR = 15 V
Weight: 0.013 g (typ.)
Electrical Characteristics (Ta = 25C)
Characteristics Symbol VFM (1) Peak forward voltage VFM (2) VFM (3) Repetitive peak reverse current Junction capacitance IRRM (1) IRRM (2) Cj Test Condition IFM = 0.1 A IFM = 1.0 A IFM = 1.5 A VRRM = 5 V VRRM = 30 V VR = 10 V, f = 1.0 MHz Device mounted on a ceramic board (soldering land: 2 mm 2 mm) Thermal resistance (junction to ambient) Rth (j-a) Device mounted on a glass-epoxy board (soldering land: 6 mm 6 mm) 3/4 Min 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 Typ. 0.23 0.32 0.345 50 3/4 90 3/4 3/4 3/4 Max 3/4 3/4 0.36 3/4 1.0 3/4 70 C/W 140 20 C/W mA mA pF V Unit
Thermal resistance (junction to lead)
Rth (j-)
1
2003-02-17
CRS08
Marking Following Indicates the Date of Manufacture
Type Code Lot No. Month of manufacture Year of manufacture January to December are denoted by letter A to L respectively. Last decimal digit of the year of manufacture 0 1 2 3 4
S8
5
6
7
8
9
Cathode mark
Standard Soldering Pad
Unit: mm 1.2 1.2 2.8
Handling Precaution
Schottky barrier diodes are having large-reverse-current-leakage characteristic compare to the other rectifier products. This current leakage and improper operating temperature or voltage may cause thermal runaway. Please take forward and reverse loss into consideration when you design.
2
2003-02-17
CRS08
iF - vF
10 0.7
PF (AV) - IF (AV)
DC
(A)
iF
3 Tj = 125C 1
Average forward power dissipation PF (AV) (W)
0.6 180 0.5 0.4 0.3 0.2 0.1 0 0 0 a 360 Conduction angle a 0.4 0.8 1.2 1.6 2.0 2.4 120
Instantaneous forward current
0.3
75C 25C
a = 60
0.1
Rectangular waveform
0.03
0.01 0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
Instantaneous forward voltage
vF
(V)
Average forward current
IF (AV)
(A)
T max - IF (AV)
140 30000 10000
rth (j-a) - t
Device mounted on a ceramic board Soldering land: 2 mm 2 mm Device mounted on a glass-epoxy board Soldering land: 6 mm 6 mm
Maximum allowable lead temperature T MAX (C)
120 100 80 a = 60 60 40 20 a a 0 a 360 IF (AV) Conduction angle a VR = 15 V 0.4 0.8 1.2 1.6 2.0 2.4 Rectangular waveform 120 180 DC
Transient thermal impedance rth (j-a) (C/W)
1000
100 10
0
1 1
10
100
1000
10000
100000
Average forward current
IF (AV)
(A)
Time t (ms)
Cj - VR
1000
(typ.)
f = 1 MHz Ta = 25C 40
Surge forward current (non-repetitive)
(A)
Ta = 25C f = 50 Hz 30
500
(pF)
100
Peak surge forward current IFSM
3 5 10 30 50 100
300
Junction capacitance
Cj
20
50 30
10
10 1
0 1
3
5
10
30
50
100
Reverse voltage VR
(V)
Number of cycles
3
2003-02-17
CRS08
I R - Tj
1000 Pulse test
(typ.)
4.8 Rectangular waveform 360
PR (AV) - VR
(typ.)
Average reverse power dissipation PR (AV) (W)
(mA)
100 VR = 30 V 10 20 V 1 3V 0.1 10 V 5V
4.0
0
3.2
VR Conduction angle a Tj = 125C DC 300 240
Reverse current IR
2.4
1.6 60 0.8
180 120
0.01 0
20
40
60
80
100
120
140
0
0
4
8
12
16
20
24
28
Junction temperature Tj
(C)
Reverse voltage VR
(V)
4
2003-02-17
CRS08
RESTRICTIONS ON PRODUCT USE
000707EAA
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. * The information contained herein is subject to change without notice.
5
2003-02-17

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