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1. Features
* MPEGI/II-Layer 3 Hardwired Decoder
- Stand-alone MP3 decoder - 48, 44.1, 32, 24, 22.05, 16 KHz sampling freq. - Separated digital volume control on left and right channels (software control using 31 steps) - Bass, medium, and Treble Control (31 steps) - Bass Boost sound effect. - Ancillary data extraction - "CRC Error" and "MPEG Frame Synchronization" indicators Programmable Audio Output for interfacing with common audio DAC available on the market - PCM format compatible - I2S format compatible 8-bit MCU C51 core based (FMAX= 20 MHz) 2304 bytes of Internal RAM 64 Kbytes of Code Memory - FLASH: T89C51SND1, ROM: T83C51SND1 4 Kbytes of Boot Flash Memory (T89C51SND1) - ISP: download from USB or UART to any external memory cards USB Rev 1.1 controller - "Full speed" data transmission Built-in PLL - MP3 Audio clocks - USB clock MultiMediaCard Interface Compatibility Atmel DataFlash SPI Interface Compatibility IDE/ATAPI Interface 2 Channels 10-bit ADC, 8KHz (8 true bit) - Battery voltage Monitoring - Voice recording controlled by software Up to 44 bits of General Purpose I/Os for: - 4-bit interrupt keyboard port for a 4 x n matrix - Smartmedia software interface Standard Two 16-bit Timers/Counters Hardware Watchdog Timer Standard Full Duplex UART with Baud Rate Generator 2-wire Master and Slave Modes Controller SPI Master and Slave Modes Controller Power Management - Power-On reset - Software programmable MCU clock - Idle mode, Power-Down mode Operating conditions: - 3V, 10%, 25 mA typical operating at 25C - -40C to +85C Packages - TQFP80, PLCC84 (development board) - Dice
*
* * * * * * * * * * * * * * * * *
Single Chip Microcontroller with MP3 Decoder and Man Machine Interface
T8XC51SND1
* *
Rev. D - 15-Nov-01
1
2. Description
The T8XC51SND1 product is a fully integrated stand-alone hardwired MPEGI/II-Layer 3 decoder with a C51 microcontroller core handling data flow and MP3-player control. The T89C51SND1 includes 64 Kbytes of FLASH memory and allows In System Programming through an embedded 4 Kbytes of Boot FLASH Memory. The T83C51SND1 includes 64 Kbytes of ROM memory. The T8XC51SND1 includes 2304 bytes of RAM memory. The T8XC51SND1 provides all necessary features for man machine interface like timers, keyboard port, serial or parallel interface (USB, 2-wire, SPI, IDE), ADC input, I2S output, and all external memory interface (NAND or NOR FLASH, SmartMedia, MultiMedia).
3. Typical Applications
* * * * MP3-Player PDA, Camera, Mobile Phone MP3 Car Audio/Multimedia MP3 Home Audio/Multimedia MP3
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T8XC51SND1
4. Pin Description
4.1 Pinouts
Figure 1. T8XC51SND1 80-pin QFP Package
P5.1 P5.0 P0.0/AD0 P0.1/AD1 P0.2/AD2 P0.3/AD3 P0.4/AD4 P0.5/AD5 VSS VDD P0.6/AD6 P0.7/AD7 P4.3/SS# P4.2/SCK P4.1/MOSI P4.0/MISO P2.0/A8 P2.1/A9 P4.7 P4.6 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61
ALE ISP# P1.0/KIN0 P1.1/KIN1 P1.2/KIN2 P1.3/KIN3 P1.4 P1.5 P1.6/SCL P1.7/SDA VDD PVDD FILT PVSS VSS X2 X1 TST# UVDD UVSS
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
T89C51SND1-RO (FLASH) T83C51SND1-RO (ROM)
60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41
P4.5 P4.4 P2.2/A10 P2.3/A11 P2.4/A12 P2.5/A13 P2.6/A14 P2.7/A15 VSS VDD MCLK MDAT MCMD RST SCLK DSEL DCLK DOUT VSS VDD
D+ DVDD VSS P3.0/RXD P3.1/TXD P3.2/INT0# P3.3/INT1# P3.4/T0 P3.5/T1 P3.6/WR# P3.7/RD# AVDD AVSS AREFP AREFN AIN0 AIN1 P5.2 P5.3
21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
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Rev. D - 15-Nov-01
Figure 2. T8XC51SND1 84-pin PLCC Package
NC P5.1 P5.0 P0.0/AD0 P0.1/AD1 P0.2/AD2 P0.3/AD3 P0.4/AD4 P0.5/AD5 VSS VDD P0.6/AD6 P0.7/AD7 P4.3/SS# P4.2/SCK P4.1/MOSI P4.0/MISO P2.0/A8 P2.1/A9 P4.7 P4.6 ALE ISP# P1.0/KIN0 P1.1/KIN1 P1.2/KIN2 P1.3/KIN3 P1.4 P1.5 P1.6/SCL P1.7/SDA VDD PAVDD FILT PAVSS VSS X2 NC X1 TST# UVDD UVSS 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 11 10 9 8 7 6 5 4 3 2 1 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54
T89C51SND1-SR (FLASH)
NC P4.5 P4.4 P2.2/A10 P2.3/A11 P2.4/A12 P2.5/A13 P2.6/A14 P2.7/A15 VSS VDD MCLK MDAT MCMD RST SCLK DSEL DCLK DOUT VSS VDD
4.2 Signals
All the T8XC51SND1 signals are detailed by functionality in Table 1 to Table 14. Table 1. Ports Signal Description
Signal Name Type Description Port 0 P0 is an 8-bit open-drain bidirectional I/O port. Port 0 pins that have 1s written to them float and can be used as high impedance inputs. To avoid any parasitic current consumption, floating P0 inputs must be polarized to VDD or VSS. Port 1 P1 is an 8-bit bidirectional I/O port with internal pull-ups. Alternate Function
P0.7:0
I/O
D+ DVDD VSS P3.0/RXD P3.1/TXD P3.2/INT0# P3.3/INT1# P3.4/T0 P3.5/T1 P3.6/WR# P3.7/RD# AVDD AVSS AREFP AREFN AIN0 AIN1 P5.2 P5.3 NC
33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53
AD7:0
P1.7:0
I/O
KIN3:0 SCL SDA
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T8XC51SND1
Signal Name P2.7:0 Alternate Function A15:8 RXD TXD P3.7:0 I/O Port 3 P3 is an 8-bit bidirectional I/O port with internal pull-ups. INT0# INT1# T0 T1 WR# RD# MISO MOSI SCK SS# -
Type I/O
Description Port 2 P2 is an 8-bit bidirectional I/O port with internal pull-ups.
P4.7:0
I/O
Port 4 P4 is an 8-bit bidirectional I/O port with internal pull-ups.
P5.3:0
I/O
Port 5 P5 is a 4-bit bidirectional I/O port with internal pull-ups.
Table 2. Clock Signal Description
Signal Name Type Description Input to the on-chip inverting oscillator amplifier To use the internal oscillator, a crystal/resonator circuit is connected to this pin. If an external oscillator is used, its output is connected to this pin. X1 is the clock source for internal timing. Output of the on-chip inverting oscillator amplifier To use the internal oscillator, a crystal/resonator circuit is connected to this pin. If an external oscillator is used, leave X2 unconnected. PLL Low Pass Filter input FILT receives the RC network of the PLL low pass filter. Alternate Function
X1
I
-
X2
O
-
FILT
I
-
Table 3. Timer 0 and Timer 1 Signal Description
Signal Name Type Description Timer 0 Gate Input INT0# serves as external run control for timer 0, when selected by GATE0 bit in TCON register. INT0# I External Interrupt 0 INT0# input sets IE0 in the TCON register. If bit IT0 in this register is set, bit IE0 is set by a falling edge on INT0#. If bit IT0 is cleared, bit IE0 is set by a low level on INT0#. Timer 1 Gate Input INT1# serves as external run control for timer 1, when selected by GATE1 bit in TCON register. INT1# I External Interrupt 1 INT1# input sets IE1 in the TCON register. If bit IT1 in this register is set, bit IE1 is set by a falling edge on INT1#. If bit IT1 is cleared, bit IE1 is set by a low level on INT1#. P3.3 P3.2 Alternate Function
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Rev. D - 15-Nov-01
Signal Name
Type
Description Timer 0 External Clock Input When timer 0 operates as a counter, a falling edge on the T0 pin increments the count. Timer 1 External Clock Input When timer 1 operates as a counter, a falling edge on the T1 pin increments the count.
Alternate Function
T0
I
P3.4
T1
I
P3.5
Table 4. Audio Interface Signal Description
Signal Name DCLK DOUT DSEL Type O O O DAC Data Bit Clock DAC Audio Data DAC Channel Select Signal DSEL is the sample rate clock output. DAC System Clock SCLK is the oversampling clock synchronized to the digital audio data (DOUT) and the channel selection signal (DSEL). Description Alternate Function -
SCLK
O
-
Table 5. USB Controller Signal Description
Signal Name Type Description USB Positive Data Upstream Port This pin requires an external 1.5 K pull-up to VDD for full speed operation. USB Negative Data Upstream Port Alternate Function
D+
I/O
-
D-
I/O
-
Table 6. MutiMediaCard Interface Signal Description
Signal Name MCLK Type O Description MMC Clock output Data or command clock transfer. MMC Command line Bidirectional command channel used for card initialization and data transfer commands. To avoid any parasitic current consumption, unused MCMD input must be polarized to VDD or VSS. MMC Data line Bidirectional data channel. To avoid any parasitic current consumption, unused MDAT input must be polarized to VDD or VSS. Alternate Function -
MCMD
I/O
-
MDAT
I/O
-
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Table 7. UART Signal Description
Signal Name Type Description Receive Serial Data RXD sends and receives data in serial I/O mode 0 and receives data in serial I/O modes 1, 2 and 3. Transmit Serial Data TXD outputs the shift clock in serial I/O mode 0 and transmits data in serial I/O modes 1, 2 and 3. Alternate Function
RXD
I/O
P3.0
TXD
O
P3.1
Table 8. SPI Controller Signal Description
Signal Name Type Description SPI Master Input Slave Output Data Line When in master mode, MISO receives data from the slave peripheral. When in slave mode, MISO outputs data to the master controller. SPI Master Output Slave Input Data Line When in master mode, MOSI outputs data to the slave peripheral. When in slave mode, MOSI receives data from the master controller. SPI Clock Line When in master mode, SCK outputs clock to the slave peripheral. When in slave mode, SCK receives clock from the master controller. SPI Slave Select Line When in controlled slave mode, SS# enables the slave mode. Alternate Function
MISO
I/O
P4.0
MOSI
I/O
P4.1
SCK
I/O
P4.2
SS#
I
P4.3
Table 9. 2-wire Controller Signal Description
Signal Name Type Description 2-wire Serial Clock When 2-wire controller is in master mode, SCL outputs the serial clock to the slave peripherals. When 2-wire controller is in slave mode, SCL receives clock from the master controller. 2-wire Serial Data SDA is the bidirectional 2-wire data line. Alternate Function
SCL
I/O
P1.6
SDA
I/O
P1.7
Table 10. A/D Converter Signal Description
Signal Name AIN1:0 AREFP AREFN Type I I I Description A/D Converter Analog Inputs Analog Positive Voltage Reference Input Analog Negative Voltage Reference Input This pin is internally connected to AVSS. Alternate Function -
7
Rev. D - 15-Nov-01
Table 11. Keypad Interface Signal Description
Signal Name Type Description Keypad Input Lines Holding one of these pins high or low for 24 oscillator periods triggers a keypad interrupt. Alternate Function
KIN3:0
I
P1.3:0
Table 12. External Access Signal Description
Signal Name Type Description Address Lines Upper address lines for the external bus. Multiplexed higher address and data lines for the IDE interface. Address/Data Lines Multiplexed lower address and data lines for the external memory or the IDE interface. Address Latch Enable Output ALE signals the start of an external bus cycle and indicates that valid address information is available on lines A7:0. An external latch is used to demultiplex the address from address/data bus. ISP Enable Input This signal must be held to GND through a pull-down resistor at the falling reset to force execution of the internal bootloader. Read Signal Read signal asserted during external data memory read operation. Write Signal Write signal asserted during external data memory write operation. Alternate Function
A15:8
I/O
P2.7:0
AD7:0
I/O
P0.7:0
ALE
O
-
ISP#
I/O
-
RD#
O
P3.7
WR#
O
P3.6
Table 13. System Signal Description
Signal Name Type Description Reset Input Holding this pin high for 64 oscillator periods while the oscillator is running resets the device. The Port pins are driven to their reset conditions when a voltage lower than VIL is applied, whether or not the oscillator is running. This pin has an internal pull-down resistor which allows the device to be reset by connecting a capacitor between this pin and VDD. Asserting RST when the chip is in Idle mode or Power-Down mode returns the chip to normal operation. Test Input Test mode entry signal. This pin must be set to VDD. Alternate Function
RST
I
-
TST#
I
-
8
T8XC51SND1
Rev. D - 15-Nov-01
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Table 14. Power Signal Description
Signal Name VDD Type PWR Description Digital Supply Voltage Connect these pins to +3V supply voltage. Circuit Ground Connect these pins to ground. Analog Supply Voltage Connect this pin to +3V supply voltage. Analog Ground Connect this pin to ground. PLL Supply voltage Connect this pin to +3V supply voltage. PLL Circuit Ground Connect this pin to ground. USB Supply Voltage Connect this pin to +3V supply voltage. USB Ground Connect this pin to ground. Alternate Function -
VSS
GND
-
AVDD
PWR
-
AVSS
GND
-
PVDD
PWR
-
PVSS
GND
-
UVDD
PWR
-
UVSS
GND
-
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Rev. D - 15-Nov-01
4.3 Internal Pin Structure
Table 15. Detailed Internal Pin Structure
Circuit1
VDD
Type
Pins
RTST
Input
TST#
VDD
Watchdog Output
P Input/Output
RRST
RST
VSS
2 osc periods Latch Output
VDD
VDD
VDD
P1
P2
P3 Input/Output
N
VSS VDD
P12 P23 P3 P4 P53:0
P Input/Output N
VSS VDD
P0 MCMD MDAT ISP#
P Output N
VSS
ALE SCLK DCLK DOUT DSEL MCLK
D+ D-
Input/Output
D+ D-
Notes:
1. For information on resistors value, input/output levels, and drive capability, refer to the Section "DC Characteristics", page 34. 2. When the 2-wire controller is enabled, P1, P2, and P3 transistors are disabled allowing pseudo open-drain structure. 3. In Port 2, P1 transistor is continuously driven when outputting a high level bit address (A15:8).
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5. Block Diagram
Figure 3. T8XC51SND1 Block Diagram
INT0# INT1# VDD VSS UVDD UVSS AVDD AVSS AREF AIN1:0 TXD RXD T0 T1 SS# MISO MOSI SCK SCL SDA
3
3 Interrupt Handler Unit
3
3
3
3
4
4
4
4
1
1
RAM 2304 bytes
FLASH ROM 64 Kbytes FLASH Boot 4 Kbytes
10-bit A to D Converter
UART & BRG
Timers 0/1 Watchdog
SPI / DataFlash Controller
2-wire Controller
C51 (X2 CORE)
8-BIT INTERNAL BUS
Clock & PLL Unit
MP3 Decoder Unit
I2S / PCM Audio Interface
USB Controller
MMC Interface
Keyboard Interface
I/O Ports IDE Interface
1
FILT X1 X2 RST ISP# ALE DOUT DCLK DSEL SCLK D+ DMCLK MDAT MCMD KIN3:0 P0-P5
1 Alternate function of Port 1 3 Alternate function of Port 3 4 Alternate function of Port 4
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Rev. D - 15-Nov-01
6. Application Information
Figure 4. T8XC51SND1 Typical Application with On-Board Atmel DataFlash and 2-wire LCD
LCD
Battery
Ref.
P1.6/SCL P1.7/SDA
AIN1
AIN0
VREFP
VREFN
P1.0/KIN0 P1.1/KIN1 P1.2/KIN2 P1.3/KIN3 P0.0 P0.1 P0.2 P0.3 X1 X2
AVDD
VDD
RST
MCLK MDAT MCMD
MMC1 MMC2
T8XC51SND1
UVDD D+ DUVSS
USB PORT
P4.2/SCK
P4.0/SI
DOUT DCLK DSEL SCLK
FILT PVSS P4n
P4.1/SO
DataFlash Memories
Audio DAC
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T8XC51SND1
Rev. D - 15-Nov-01
AVSS
P1.4
P1.5
VSS
T8XC51SND1
Figure 5. T8XC51SND1 Typical Application with On-Board Atmel DataFlash and // LCD
LCD
Battery
P1.6/SCL P1.7/SDA
Ref.
P1.3 P0.4 P0.5 P0.6 P0.7
VREFN
VDD
VREFP
AVDD
AIN1
AIN0
RST
P1.0/KIN0 P1.1/KIN1 P1.2/KIN2 P0.0 P0.1 P0.2 P0.3 X1 X2
MMC1
MCLK MDAT MCMD
MMC2
T8XC51SND1
UVDD D+ DUVSS
USB PORT
P4.2/SCK
P4.0/SI
DOUT DCLK DSEL SCLK
FILT P4.n PVSS
P4.1/SO
DataFlash Memories
Audio DAC
Figure 6. T8XC51SND1 Typical Application with On-Board SSFDC Flash
LCD
Battery
Ref.
P4.0 P4.1 P4.2 P4.4 P4.5 P4.6 P4.7
VREFP
VREFN
P1.0/KIN0 P1.1/KIN1 P1.2/KIN2 P1.3/KIN3 P0.0 P0.1 P0.2 P0.3 X1 X2
AVDD
AIN1
AIN0
VDD
RST
AVSS
P1.4
P1.5
VSS
MMC1
MCLK MDAT MCMD
MMC2
T8XC51SND1
UVDD D+ DUVSS
USB PORT
P3.6/WR#
DOUT DCLK DSEL SCLK
FILT P2 PVSS P0
P3.7/RD#
Audio DAC SSFDC Memories or SmartMedia Cards
SmartMedia
AVSS
P3.4
P3.5
VSS
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Rev. D - 15-Nov-01
Figure 7. T8XC51SND1 Typical Application with IDE CD-ROM Drive
LCD
Battery
P1.6/SCL P1.7/SDA
Ref.
P4.0 P4.1 P4.2 P4.4 P4.5 P4.6 P4.7
VREFP
VREFN
AVDD
AIN1
AIN0
VDD
RST
P1.0/KIN0 P1.1/KIN1 P1.2/KIN2 P0.0 P0.1 P0.2 P0.3 X1 X2 P3.6/WR# FILT P2 PVSS P0
MMC1
MCLK MDAT MCMD
MMC2
T8XC51SND1
UVDD D+ DUVSS
USB PORT
P3.7/RD#
DOUT DCLK DSEL SCLK
Audio DAC IDE CD-ROM
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T8XC51SND1
Rev. D - 15-Nov-01
AVSS
P3.4
P3.5
VSS
T8XC51SND1
7. Address Spaces
The T8XC51SND1 derivatives implement four different address spaces: * * * * Program/Code Memory Boot Memory Data Memory Special Function Registers (SFRs)
7.1 Code Memory
The T89C51SND1 and T83C51SND1 implement 64 Kbytes of on-chip program/code memory. The T83C51SND1 product provides the internal program/code memory in ROM technology while the T89C51SND1 product provides it in FLASH technology. The FLASH memory increases EPROM and ROM functionality by in-circuit electrical erasure and programming. Thanks to the internal charge pump, the high voltage needed for programming or erasing FLASH cells is generated on-chip using the standard VDD voltage. Thus, the T89C51SND1 can be programmed using only one voltage and allows in application software programming commonly known as IAP. Hardware programming mode is also available using specific programming tool.
7.2 Boot Memory
The T89C51SND1 implements 4 Kbytes of on-chip boot memory provided in FLASH technology. This boot memory is delivered programmed with a standard boot loader software allowing in system programming commonly known as ISP. It also contains some Application Programming Interfaces routines commonly known as API allowing user to develop its own boot loader.
7.3 Data Memory
The T89C51CC01 derivatives implement 2304 bytes of on-chip data RAM. This memory is divided in two separate areas: * * 256 bytes of on-chip RAM memory (standard C51 memory). 2048 bytes of on-chip expanded RAM memory (ERAM accessible via MOVX instructions).
7.4 Special Function Registers
The Special Function Registers (SFRs) of the T89C51CC01 derivatives fall into the categories detailed in Table 16 to Table 32. The relative addresses of these SFRs are provided together with their reset values in Table 33. In this table, the bit-addressable registers are identified by Note 1.
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Rev. D - 15-Nov-01
Table 16. C51 Core SFRs
Mnemonic ACC B PSW SP DPL Add Name 7 6 5 4 3 2 1 0
E0h Accumulator F0h D0h 81h 82h B Register Program Status Word Stack Pointer Data Pointer Low byte Data Pointer High byte CY AC F0 RS1 RS0 OV F1 P
DPH
83h
Table 17. System Management SFRs
Mnemonic PCON AUXR AUXR1 NVERS Add 87h Name Power Control 7 SMOD1 NV7 6 SMOD0 EXT16 NV6 5 M0 ENBOOT NV5 4 DPHDIS NV4 3 GF1 XRS1 GF3 NV3 2 GF0 XRS0 0 NV2 1 PD EXTRAM NV1 0 IDL AO DPS NV0
8Eh Auxiliary Register 0 A2h Auxiliary Register 1 FBh Version Number
Table 18. PLL & System Clock SFRs
Mnemonic CKCON PLLCON PLLNDIV PLLRDIV Add 8Fh Name Clock Control 7 R1 R9 6 R0 N6 R8 5 N5 R7 4 N4 R6 3 PLLRES N3 R5 2 N2 R4 1 PLLEN N1 R3 0 X2 PLOCK N0 R2
E9h PLL Control EEh PLL N Divider EFh PLL R Divider
Table 19. Interrupt SFRs
Mnemonic IEN0 Add A8h Name Interrupt Enable Control 0 Interrupt Enable Control 1 Interrupt Priority Control High 0 Interrupt Priority Control Low 0 Interrupt Priority Control High 1 Interrupt Priority Control Low 1 7 EA 6 EAUD 5 EMP3 4 ES 3 ET1 2 EX1 1 ET0 0 EX0
IEN1
B1h
-
EUSB
-
EKB
EADC
ESPI
EI2C
EMMC
IPH0
B7h
-
IPHAUD
IPHMP3
IPHS
IPHT1
IPHX1
IPHT0
IPHX0
IPL0
B8h
-
IPLAUD
IPLMP3
IPLS
IPLT1
IPLX1
IPLT0
IPLX0
IPH1
B3h
-
IPHUSB
-
IPHKB
IPHADC
IPHSPI
IPHI2C
IPHMMC
IPL1
B2h
-
IPLUSB
-
IPLKB
IPLADC
IPLSPI
IPLI2C
IPLMMC
16
T8XC51SND1
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T8XC51SND1
Table 20. Port SFRs
Mnemonic P0 P1 P2 P3 P4 P5 Add 80h 90h Name 8-bit Port 0 8-bit Port 1 7 6 5 4 3 2 1 0
A0h 8-bit Port 2 B0h 8-bit Port 3 C0h 8-bit Port 4 D8h 4-bit Port 5

Table 21. Flash Memory SFR
Mnemonic FCON Add Name 7 FPL3 6 FPL2 5 FPL1 4 FPL0 3 FPS 2 FMOD1 1 FMOD0 0 FBUSY
D1h Flash Control
Table 22. Timer SFRs
Mnemonic TCON Add 88h Name Timer/Counter 0 and 1 Control Timer/Counter 0 and 1 Modes Timer/Counter 0 Low Byte Timer/Counter 0 High Byte Timer/Counter 1 Low Byte Timer/Counter 1 High Byte WatchDog Timer Reset WatchDog Timer Program WTO2 WTO1 WTO0 7 TF1 6 TR1 5 TF0 4 TR0 3 IE1 2 IT1 1 IE0 0 IT0
TMOD
89h
GATE1
C/T1#
M11
M01
GATE0
C/T0#
M10
M00
TL0
8Ah
TH0
8Ch
TL1
8Bh
TH1
8Dh
WDTRST
A6h
WDTPRG
A7h
Table 23. MP3 Decoder SFRs
Mnemonic MP3CON MP3STA MP3STA1 Add Name 7 MPEN MPAN C 6 MPBBST MPREQ 5 CRCEN ERRLAY 4 MSKANC ERRSYN MPFREQ 3 MSKREQ ERRCRC MPBREQ 2 MSKLAY MPFS1 1 MSKSYN MPFS0 0 MSKCRC MPVER -
AAh MP3 Control C8h MP3 Status AFh MP3 Status 1
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Rev. D - 15-Nov-01
Mnemonic MP3DAT MP3ANC MP3VOL
Add
Name
7 MPD7 AND7 -
6 MPD6 AND6 -
5 MPD5 AND5 -
4 MPD4 AND4 VOL4
3 MPD3 AND3 VOL3
2 MPD2 AND2 VOL2
1 MPD1 AND1 VOL1
0 MPD0 AND0 VOL0
ACh MP3 Data ADh MP3 Ancillary Data 9Eh MP3 Audio Volume Control Left MP3 Audio Volume Control Right MP3 Audio Bass Control MP3 Audio Medium Control MP3 Audio Treble Control
MP3VOR
9Fh
-
-
-
VOR4
VOR3
VOR2
VOR1
VOR0
MP3BAS
B4h
-
-
-
BAS4
BAS3
BAS2
BAS1
BAS0
MP3MED
B5h
-
-
-
MED4
MED3
MED2
MED1
MED0
MP3TRE MP3CLK
B6h
-
-
-
TRE4 MPCD4
TRE3 MPCD3
TRE2 MPCD2
TRE1 MPCD1
TRE0 MPCD0
EBh MP3 Clock Divider
Table 24. Audio Interface SFRs
Mnemonic AUDCON0 AUDCON1 AUDSTA AUDDAT AUDCLK Add Name 7 JUST4 SRC SREQ AUD7 6 JUST3 DRQEN UDRN AUD6 5 JUST2 MSREQ AUBUSY AUD5 4 JUST1 MUDRN AUD4 AUCD4 3 JUST0 AUD3 AUCD3 2 POL DUP1 AUD2 AUCD2 1 DSIZ DUP0 AUD1 AUCD1 0 HLR AUDEN AUD0 AUCD0
9Ah Audio Control 0 9Bh Audio Control 1 9Ch Audio Status 9Dh Audio Data ECh Audio Clock Divider
Table 25. USB Controller SFRs
Mnemonic USBCON USBADDR USBINT USBIEN Add Name 7 USBE FEN 6 SUSPCLK UADD6 5 SDRMWUP UADD5 WUPCPU EWUPCPU 4 UADD4 EORINT EEORINT 3 UPRSM UADD3 SOFINT ESOFINT 2 RMWUPE UADD2 1 CONFG UADD1 0 FADDEN UADD0 SPINT ESPINT
BCh USB Global Control C6h USB Address BDh USB Global Interrupt BEh USB Global Interrupt Enable USB Endpoint Number USB Endpoint X Control USB Endpoint X Status
UEPNUM
C7h
-
-
-
-
-
-
EPNUM1
EPNUM0
UEPCONX
D4h
EPEN
-
-
-
DTGL
EPDIR
EPTYPE1
EPTYPE0
UEPSTAX UEPRST UEPINT
CEh
DIR -
-
STALLRQ -
TXRDY -
STLCRC EP3RST EP3INT
RXSETUP EP2RST EP2INT
RXOUT EP1RST EP1INT
TXCMP EP0RST EP0INT
D5h USB Endpoint Reset F8h USB Endpoint Interrupt USB Endpoint Interrupt Enable
UEPIEN
C2h
-
-
-
-
EP3INTE
EP2INTE
EP1INTE
EP0INTE
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Mnemonic UEPDATX Add CFh Name USB Endpoint X Fifo Data USB Endpoint X Byte Counter USB Frame Number Low USB Frame Number High 7 FDAT7 6 FDAT6 5 FDAT5 4 FDAT4 3 FDAT3 2 FDAT2 1 FDAT1 0 FDAT0
UBYCTX
E2h
-
BYCT6
BYCT5
BYCT4
BYCT3
BYCT2
BYCT1
BYCT0
UFNUML
BAh
FNUM7
FNUM6
FNUM5
FNUM4
FNUM3
FNUM2
FNUM1
FNUM0
UFNUMH USBCLK
BBh
-
-
CRCOK -
CRCERR -
-
FNUM10 -
FNUM9 USBCD1
FNUM8 USBCD0
EAh USB Clock Divider
Table 26. MMC Controller SFRs
Mnemonic MMCON0 MMCON1 MMCON2 Add Name 7 DRPTR BLEN3 MMCE N MCBI MCBM MC7 MD7 MMCD 7 6 DTPTR BLEN2 DCR 5 CRPTR BLEN1 CCR 4 CTPTR BLEN0 3 MBLOCK DATDIR 2 DFMT DATEN DATD1 1 RFMT RESPEN DATD0 0 CRCDIS CMDEN FLOWC
E4h MMC Control 0 E5h MMC Control 1 E6h MMC Control 2 MMC Control and Status
MMSTA MMINT MMMSK MMCMD MMDAT MMCLK
DEh
EORI EORM MC6 MD6 MMCD6
CBUSY EOCI EOCM MC5 MD5 MMCD5
CRC16S EOFI EOFM MC4 MD4 MMCD4
DATFS F2FI F2FM MC3 MD3 MMCD3
CRC7S F1FI F1FM MC2 MD2 MMCD2
RESPFS F2EI F2EM MC1 MD1 MMCD1
CFLCK F1EI F1EM MC0 MD0 MMCD0
E7h MMC Interrupt DFh MMC Interrupt Mask DDh MMC Command DCh MMC Data EDh MMC Clock Divider
Table 27. IDE Interface SFR
Mnemonic DAT16H Add F9h Name High Order Data Byte 7 D15 6 D14 5 D13 4 D12 3 D11 2 D10 1 D9 0 D8
Table 28. Serial I/O Port SFRs
Mnemonic SCON SBUF SADEN SADDR BDRCON BRL Add 98h 99h Name Serial Control Serial Data Buffer 7 FE/SM 0 6 SM1 5 SM2 4 REN 3 TB8 2 RB8 1 TI 0 RI
B9h Slave Address Mask A9h Slave Address 92h 91h Baud Rate Control Baud Rate Reload BRR TBCK RBCK SPD SRC
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Rev. D - 15-Nov-01
Table 29. SPI Controller SFRs
Mnemonic SPCON SPSTA SPDAT Add Name 7 SPR2 SPIF SPD7 6 SPEN WCOL SPD6 5 SSDIS SPD5 4 MSTR MODF SPD4 3 CPOL SPD3 2 CPHA SPD2 1 SPR1 SPD1 0 SPR0 SPD0
C3h SPI Control C4h SPI Status C5h SPI Data
Table 30. 2-wire Controller SFRs
Mnemonic SSCON Add 93h Name Synchronous Serial control Synchronous Serial Status Synchronous Serial Data Synchronous Serial Address 7 SSCR2 6 SSPE 5 SSSTA 4 SSSTO 3 SSI 2 SSAA 1 SSCR1 0 SSCR0
SSSTA
94h
SSC4
SSC3
SSC2
SSC1
SSC0
0
0
0
SSDAT
95h
SSD7
SSD6
SSD5
SSD4
SSD3
SSD2
SSD1
SSD0
SSADR
96h
SSA7
SSA6
SSA5
SSA4
SSA3
SSA2
SSA1
SSGC
Table 31. Keyboard Interface SFRs
Mnemonic KBCON KBSTA Add Name 7 KINL3 KPDE 6 KINL2 5 KINL1 4 KINL0 3 KINM3 KINF3 2 KINM2 KINF2 1 KINM1 KINF1 0 KINM0 KINF0
A3h Keyboard Control A4h Keyboard Status
Table 32. A/D Controller SFRs
Mnemonic ADCON ADCLK ADDL ADDH Add F3h F2h F4h F5h Name ADC Control ADC Clock Divider ADC Data Low Byte ADC Data High Byte 7 ADAT9 6 ADIDL ADAT8 5 ADEN ADAT7 4 ADEOC ADCD4 ADAT6 3 ADSST ADCD3 ADAT5 2 ADCD2 ADAT4 1 ADCD1 ADAT1 ADAT3 0 ADCS ADCD0 ADAT0 ADAT2
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Table 33. SFR Addresses and Reset Values
0/8 F8h UEPINT 0000 0000 B1 0000 0000 PLLCON 0000 1000 ACC1 0000 0000 P51 XXXX 1111 PSW1 0000 0000 MP3STA1 0000 0001 P41 1111 1111 IPL01 X000 0000 P31 1111 1111 IEN01 0000 0000 P21 1111 1111 SCON 0000 0000 P11 1111 1111 TCON1 0000 0000 P01 1111 1111 0/8 SBUF XXXX XXXX BRL 0000 0000 TMOD 0000 0000 SP 0000 0111 1/9 SADEN 0000 0000 IEN1 0000 0000 SADDR 0000 0000 UEPIEN 0000 0000 UFNUML 0000 0000 IPL1 0000 0000 MP3CON 0011 1111 AUXR1 XXXX 00X0 AUDCON0 0000 1000 BDRCON XXX0 0000 TL0 0000 0000 DPL 0000 0000 2/A Reserved KBCON 0000 1111 AUDCON1 1011 0010 SSCON 0000 0000 TL1 0000 0000 DPH 0000 0000 3/B 4/C 5/D 6/E SPCON 0001 0100 UFNUMH 0000 0000 IPH1 0000 0000 SPSTA 0000 0000 USBCON 0000 0000 MP3BAS 0000 0000 MP3DAT 0000 0000 KBSTA 0000 0000 AUDSTA 1100 0000 SSSTA 1111 1000 TH0 0000 0000 AUDDAT 1111 1111 SSDAT 1111 1111 TH1 0000 0000 SPDAT XXXX XXXX USBINT 0000 0000 MP3MED 0000 0000 MP3ANC 0000 0000 WDTRST 0000 1000 MP3VOL 0000 0000 SSADR 1111 1110 AUXR X000 1101 CKCON 0000 000X5 PCON XXXX 0000 7/F FCON3 1111 00004 1/9 DAT16H XXXX XXXX ADCLK 0000 0000 USBCLK 0000 0000 UBYCTLX 0000 0000 2/A 3/B NVERS2 1000 0010 ADCON 0000 0000 MP3CLK 0000 0000 ADDL 0000 0000 AUDCLK 0000 0000 MMCON0 0000 0000 MMDAT 1111 1111 UEPCONX 0000 0000 ADDH 0000 0000 MMCLK 0000 0000 MMCON1 0000 0000 MMCMD 1111 1111 UEPRST 0000 0000 UEPSTAX 0000 0000 USBADDR 1000 0000 USBIEN 0001 0000 MP3TRE 0000 0000 IPH0 X000 0000 MP3STA1 0100 0001 WDTPRG 0000 1000 MP3VOR 0000 0000 UEPDATX 0000 0000 UEPNUM 0000 0000 PLLNDIV 0000 0000 MMCON2 0000 0000 MMSTA 0000 0000 PLLRDIV 0000 0000 MMINT 0000 0011 MMMSK 1111 1111 4/C 5/D 6/E 7/F FFh
F0h
F7h
E8h
EFh
E0h
E7h
D8h
DFh
D0h
D7h
C8h
CFh
C0h
C7h
B8h
BFh
B0h
B7h
A8h
AFh
A0h
A7h
98h
9Fh
90h
97h
88h
8Fh
80h
87h
Notes:
1. SFR registers with least significant nibble address equal to 0 or 8 are bitaddressable. 2. NVERS reset value depends on the silicon version. 3. FCON register is only available in T89C51SND1 product. 4. FCON reset value is 00h in case of reset with hardware condition. 5. CKCON reset value depends on the X2B bit (programmed or unprogrammed) in the Hardware Byte.
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8. In System & In Application Programming
8.1 Introduction
As described in the section "Program/Code Memory" of the T8XC51SND1 design guide, The T89C51SND1 implements a 4 Kbytes FLASH boot memory. This boot memory is delivered programmed with a standard boot loader software allowing In System Programming (ISP). It also contains some Application Programming Interface routines named API routines allowing In Application Programming (IAP) by using user's own boot loader.
8.2 In System Programming
The ISP boot process is divided in two different processes: the hardware and software boot process detailed in the following sections. 8.3.1 Hardware Boot Process As detailed in Figure 8 there are two hardware conditions that allow user executing the boot loader: the hardware and the programmed conditions. The hardware condition is based on the ISP# pin. When driving this pin to low level, the chip reset forces the execution of the boot loader software. The hardware condition takes precedence on the programmed condition and always allows in system recovery when user's memory has been corrupted. The programmed condition is based on the Boot Loader Jump Bit (BLJB) in the hardware security bytes (HSB). When this bit is programmed (by hardware or software programming mode), the chip reset forces the execution of the boot loader software. Whatever the physical medium may be, the boot loader software always starts execution by testing FCON to know if execution comes from hardware or programmed condition. If it is from hardware condition, the Atmel's boot loader is executed. If it is from programmed condition, the Software Boot Vector (SBV) is used to build a 16-bit address, SBV content being the MSB and the LSB being 00h. If this address is valid (< F000h), jump is done to this address to execute user's boot loader. Otherwise jump is done to the Atmel's boot loader. This implies that user's boot loader does not execute any code mapped from F000h to FFFFh.
Hardware condition
Programmed Condition
8.4.2 Software Boot Process
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Figure 8. Boot Process Algorithm
RESET
Hard Cond? ISP#= L?
Hardware Process
Prog Cond? BLJB= P?
Hard Cond Init ENBOOT= 1 PC= F000h FCON= 00h
Standard Init ENBOOT= 0 PC= 0000h FCON= F0h
Prog Cond Init ENBOOT= 1 PC= F000h FCON= F0h
Hard Cond? FCON= 00h?
Software Process
User Vector? SBV< F0h?
User Init PCH= SBV PCL= 00h
User's Application
User's Boot Loader
Atmel's Boot Loader
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Rev. D - 15-Nov-01
8.5 Serial Boot Loader
8.6.1 Configuration The serial boot loader is based on the internal UART and needs only 3 pins: the TXD and RXD pins of the UART and the VSS pin. The data transmission format on the serial link must be set to 8 data bits with 1 stop bit. The baud rate is automatically recognized during the synchronization phase. Before any data may be sent to the boot loader, a synchronization must be achieved with the host so that both side converse at the same baud rate. This is done by sending the "U" character (ASCII 35h) to the boot loader. The boot loader acknowledges the synchronization by responding the same "U" character. At this time, the boot loader is able to receive data, then all data received are echoed to the host.
8.7.2 Synchronization Phase
8.8.3 Command Protocol Definition The protocol is based on the INTEL HEX type records. These records are composed of seven fields of ASCII characters as detailed in Table 34. All fields except SOR (Start Of Record) end EOR (End Of Record) are ASCII coded hexadecimal values. The SOR field is always a ":" character. The EOR field is always a Carriage Return (ASCII 13h) followed by a Line Feed (ASCII 0Ah). The SIZE field is the size of the DATA field. The ADDRESS field is the address where to store data contained in the DATA field. The TYPE field is the record type detailed in Table 35. The DATA field contains the data and must never exceed 128 data bytes (256 ASCII characters). The CKSUM field is the checksum computed on the SIZE, ADDRESS, TYPE, DATA fields. Table 34. Hex Record Format
SOR : SIZE NN ADDRESS AAAA TYPE RR DATA DD...DD CKSUM CC EOR CR LF
Error Handling
All received records that present a checksum error, a data length greater than 128 bytes or a bad type record are immediately acknowledged to the host by sending a "X" character followed by a CRLF sequence. Table 35. Hex Record Commands
TYPE SIZE ADDRESS Description Program Data Program the data in the DATA field at the address contained in the ADDRESS field. Return "." "P" Done. Not done. Part protected (secured by level 1 or 2).
Command description
00h
01h to 80h
0000h to FFFFh
01h
00h
0000h
End of File No operation. Return "."
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TYPE SIZE ADDRESS Description Block Erase: DATA[0]= 01h DATA[1]= 00h Erase block 0 from address 0000h to 1FFFh. DATA[1]= 20h Erase block 1 from address 2000h to 3FFFh. DATA[1]= 40h Erase block 2 from address 4000h to 7FFFh. DATA[1]= 80h Erase block 3 from address 8000h to BFFFh. DATA[1]= C0h Erase block 4 from address C000h to FFFFh. Return "." "P" Done. Not done. Part protected (secured by level 1 or 2).
02h
XXXX
01h
XXXX
Reset Software Boot Vector and Boot Status Byte: DATA[0]= 04h Set SBV to F0h and BSB to FFh. Return "." "P" Done. Not done. Part protected (secured by level 1 or 2).
02h
XXXX
Program Software Security Bits: DATA[0]= 05h DATA[1]= 00h Program level 1. Disable FLASH programming. DATA[1]= 01h Program level 2. Disable FLASH programming & verifying. Return "." "P" Done. Not done. Part protected (secured by level 1 or 2).
03h
03h
XXXX
Program Software Boot Vector or Boot Status Byte: DATA[0]= 06h DATA[1]= 00h Program BSB with DATA[2]. DATA[1]= 01h Program SBV with DATA[2]. Return "." "P" Done. Not done. Part already protected (secured by level 2).
01h
XXXX
Full Chip Erase: DATA[0]= 07h Erase user memory from address 0000h to FFFFh. Set SBV to F0h and BSB to FFh. Program software security to level 0. Return "." Program Fuse bits: DATA[0]= 0Ah DATA[1]= 04h DATA[2]= 00h Program BLJB bit. DATA[2]= 01h Erase BLJB bit. DATA[1]= 08h DATA[2]= 00h Program X2 bit. DATA[2]= 01h Erase X2 bit. Return "." "P" Done. Not done. Part protected (secured by level 1 or 2).
03h
XXXX
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Rev. D - 15-Nov-01
TYPE
SIZE
ADDRESS
Description Read Data: DATA[4]= 00h Read data from address given by DATA[1:0] (start address) to address given by DATA[3:2] (end address). Return "AAAA=DD...DD" up to 16 data bytes by line.
05h
XXXX
04h
05h
XXXX
Blank Check: DATA[4]= 01h Check blanked data from address given by DATA[1:0] (start address) to address given by DATA[3:2] (end address). Return "." "XXXX" Done. First address not blanked.
02h
XXXX
Read Id: DATA[0]= 00h DATA[1]= 00h Return manufacturer id. DATA[1]= 01h Return device id 1. DATA[1]= 02h Return device id 2. DATA[1]= 03h Return device id 3. Return "XX" Selected id value.
02h
XXXX
Read Special Bytes: DATA[0]= 07h DATA[1]= 00h Return SSB. DATA[1]= 01h Return BSB. DATA[1]= 02h Return SBV. Return "XX" Selected byte value.
05h
01h
XXXX
Read HSB: DATA[0]= 0Bh Return HSB. Return "XX" HSB value.
02h
XXXX
Read Boot Id: DATA[0]= 0Eh DATA[1]= 00h Return boot id 1. DATA[1]= 01h Return boot id 1. Return "XX" Selected id value.
01h
XXXX
Read Boot Loader Version: DATA[0]= 0Fh Return boot loader version. Return "XX" Boot loader version.
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8.9 In Application Programming
The IAP is based on several Application Program Interface routines (APIs) that may be called by the user's boot loader to allow programming of the FLASH memory. The APIs are executed by calling the API_CALL function at address FFF0h and by passing the API routine number in R1 register. Some other parameters may also be passed in registers as detailed in Table 36. Table 36. API Routines and Parameters
R1 Description PROGRAM DATA BYTE Program a data in the FLASH memory at a given address. 02h Parameters DPTR Address of the byte to program. ACC Data to program. Return None. PROGRAM DATA PAGE Program a page of data in the FLASH memory at a given page address. 09h Parameters DPTR0 Address of the page to program. DPTR1 Address in ERAM of the first data to program. ACC Number of bytes to program limited to 128. Return None. PROGRAM SOFTWARE SECURITY BYTE Program SSB. 05h Parameters DPL 00h 01h Return None. PROGRAM BOOT STATUS BYTE Program BSB. 06h Parameters DPL 00h Select BSB programming. ACC Data to program in BSB. Return None. PROGRAM SOFTWARE BOOT VECTOR Program SBV. 06h Parameters DPL 01h Select SBV programming. ACC Data to program in SBV. Return None. PROGRAM BOOT LOADER JUMP BIT Program BLJB. 06h Parameters DPL 04h ACC 00h 01h Return None. Select BLJB programming. Program BLJB. Erase BLJB. Program level 1. Disable FLASH programming. Program level 2. Disable FLASH programming & verifying.
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R1 PROGRAM X2 BIT Program X2B. 06h Parameters DPL 08h ACC 00h 01h Return None. Erase BLOCK Erase one of the 5 available blocks. Parameters DPH 00h 20h 40h 80h C0h Return None.
Description
Select X2B programming. Program X2B. Erase X2B.
01h
Erase block 0 from address 0000h to 1FFFh. Erase block 1 from address 2000h to 3FFFh. Erase block 2 from address 4000h to 7FFFh. Erase block 3 from address 8000h to BFFFh. Erase block 4 from address C000h to FFFFh.
ERASE SOFTWARE BOOT VECTOR and BOOT STATUS BYTE Erase SBV and BSB. 04h Parameters None. Return None. READ DATA BYTE Read data at a given address. 03h Parameters DPTR Address of the byte to program. Return ACC Data read.
READ MANUFACTURER ID Read manufacturer Id. 00h Parameters DPL 00h Return ACC Id value. Select manufacturer Id.
READ DEVICE ID 1 Read device Id 1 00h Parameters DPL 01h Return ACC Id value. Select device Id 1.
READ DEVICE ID 2 Read device Id 2. 00h Parameters DPL 02h Return ACC Id value. Select device Id 2.
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R1 READ DEVICE ID 3 Read device Id 3. 00h Parameters DPL 03h Return ACC Id value. Select device Id 3. Description
READ SOFTWARE SECURITY BYTE Read SSB. 07h Parameters DPL 00h Return ACC SSB value. Select SSB.
READ BOOT STATUS BYTE Read BSB. 07h Parameters DPL 01h Return ACC BSB value. Select BSB.
READ SOFTWARE BOOT VECTOR Read SBV. 07h Parameters DPL 02h Return ACC SBV value. Select SBV.
READ HARDWARE SECURITY BYTE Read HSB. 0Bh Parameters None. Return ACC HSB value.
READ BOOT ID 1 Read boot Id 1. 0Eh Parameters DPL 00h Return ACC Id value. Select boot Id 1.
READ BOOT ID 2 Read boot Id 2. 0Eh Parameters DPL 01h Return ACC Id value. Select boot Id 2.
READ BOOT LOADER VERSION Read BLV. 0Fh Parameters None. Return ACC BLV value.
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Rev. D - 15-Nov-01
9. Peripherals
The T8XC51SND1 peripherals are briefly described in the following sections. For further details on how to interface (hardware and software) to these peripherals, please refer to the T8XC51SND1 design guide.
9.1 Clock Generator System
The T8XC51SND1 internal clocks are extracted from an on-chip PLL fed by an on-chip oscillator. Four clocks are generated respectively for the C51 core, the MP3 decoder, the audio interface, and the other peripherals. The C51 and peripheral clocks are derived from the oscillator clock. The MP3 decoder clock is generated by dividing the PLL output clock. The audio interface sample rates are also obtained by dividing the PLL output clock.
9.2 Ports
The T8XC51SND1 implements five 8-bit ports (P0 to P4) and one 4-bit port (P5). In addition to performing general-purpose I/O, some ports are capable of external data memory operations; others allow for alternate functions. All I/O Ports are bidirectional. Each Port contains a latch, an output driver and an input buffer. Port 0 and Port 2 output drivers and input buffers facilitate external memory operations. Some Port 1, Port 3 and Port 4 pins serve for both general-purpose I/O and alternate functions.
9.3 Timers/Counters
The T8XC51SND1 implements the two general-purpose, 16-bit Timers/Counters of a standard C51. They are identified as Timer 0, Timer 1, and can independently be configured each to operate in a variety of modes as a Timer or as an event Counter. When operating as a Timer, a Timer/Counter runs for a programmed length of time, then issues an interrupt request. When operating as a Counter, a Timer/Counter counts negative transitions on an external pin. After a preset number of counts, the Counter issues an interrupt request.
9.4 Watchdog Timer
The T8XC51SND1 implements a hardware Watchdog Timer that automatically resets the chip if it is allowed to time out. The WDT provides a means of recovering from routines that do not complete successfully due to software or hardware malfunctions.
9.5 MP3 Decoder
The T8XC51SND1 implements a MPEG I/II audio layer 3 decoder (known as MP3 decoder). In MPEG I (ISO 11172-3) three layers of compression have been standardized supporting three sampling frequencies: 48, 44.1, and 32 KHz. Among these layers, layer 3 allows highest compression rate of about 12:1 while still maintaining CD audio quality. For example, 3 minutes of CD audio (16-bit PCM, 44.1 KHz) data, which needs about 32 MBytes of storage, can be encoded into only 2.7 MBytes of MPEG I audio layer 3 data. In MPEG II (ISO 13818-3), three additional sampling frequencies: 24, 22.05, and 16 KHz are supported for low bit rates applications. The T8XC51SND1 can decode in real-time the MPEG I audio layer 3 encoded data into a PCM audio data, and also supports MPEG II audio layer 3 additional frequencies.
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Additional features are supported by the T8XC51SND1 MP3 decoder such as volume, bass, medium, and treble controls, bass boost effect and ancillary data extraction.
9.6 Audio Output Interface
The T8XC51SND1 implements an audio output interface allowing the decoded audio bitstream to be output in various formats. It is compatible with right and left justification PCM and I2S formats and thanks to the on-chip PLL (see Section 9.1) allows connection of almost all of the commercial audio DAC families available on the market.
9.7 Universal Serial Bus Interface
The T8XC51SND1 implements a full speed Universal Serial Bus Interface. It can be used for the following purposes: * * Download of MP3 encoded audio files by supporting the USB mass storage class. In System Programming by supporting the USB firmware upgrade class.
9.8 MultiMediaCard Interface
The T8XC51SND1 implements a MultiMediaCard (MMC) interface compliant to the V2.2 specification in MultiMediaCard Mode. The MMC allows storage of MP3 encoded audio files in removable flash memory cards that can be easily plugged or removed from the application. It can also be used for In System Programming.
9.9 IDE/ATAPI interface
The T8XC51SND1 provides an IDE/ATAPI interface allowing connexion of devices such as CD-ROM reader, CompactFlash cards, Hard Disk Drive... It consists in a 16-bit bidirectional bus part of the low-level ANSI ATA/ATAPI specification. It is provided for mass storage interface but could be used for In System Programming using CD-ROM.
9.10 Serial I/O Interface
The T8XC51SND1 implements a serial port with its own baud rate generator providing one single synchronous communication mode and three full-duplex Universal Asynchronous Receiver Transmitter (UART) communication modes. It is provided for the following purposes: * * In System Programming. Remote control of the T8XC51SND1 by a host.
9.11 Serial Peripheral Interface
The T8XC51SND1 implements a Serial Peripheral Interface (SPI) supporting master and slave modes. It is provided for the following purposes: * * * Interfacing DataFlash memory for MP3 encoded audio files storage. Remote control of the T8XC51SND1 by a host. In System Programming.
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9.12 2-wire Controller
The T8XC51SND1 implements a 2-wire controller supporting the four standard master and slave modes with multimaster capability. It is provided for the following purposes: * * * Connection of slave devices like LCD controller, audio DAC... Remote control of the T8XC51SND1 by a host. In System Programming.
9.13 A/D Controller
The T8XC51SND1 implements a 2-channel 10-bit (8 true bits) analog to digital converter (ADC). It is provided for the following purposes: * * * Battery monitoring. Voice recording. Corded remote control.
9.14 Keyboard Interface
The T8XC51SND1 implements a keyboard interface allowing connection of 4 x n matrix keyboard. It is based on 4 inputs with programmable interrupt capability on both high or low level. These inputs are available as alternate function of P1.3:0 and allow exit from idle and power down modes.
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10. Absolute Maximum Rating and Operating Conditions
10.1 Absolute Maximum Rating
Table 37. Absolute Maximum Ratings Storage Temperature .................................................... -65 to +150C Voltage on any other Pin to VSS .................................... -0.3 to +4.0 V IOL per I/O Pin 5 mA Power Dissipation ......................................................... 1 W
10.2 Operating Conditions
Table 38. Operating Conditions Ambient Temperature Under Bias ................................. -40 to +85C VDD ................................................................................................................... 2.7 to 3.3V
Note: Stressing the device beyond the "Absolute Maximum Ratings" may cause permanent damage. These are stress ratings only. Operation beyond the "operating conditions" is not recommended and extended exposure beyond the "Operating Conditions" may affect device reliability.
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Rev. D - 15-Nov-01
11. DC Characteristics
11.1 DC Characteristics - Digital Logic
Table 39. Digital DC Characteristics VDD= 2.7 to 3.3 V, TA= -40 to +85C
Symbol VIL VIH1 VIH2 Parameter Input Low Voltage Input High Voltage (except RST) Input High Voltage (RST) Output Low Voltage (except P0, ALE, MCMD, MDAT, MCLK, SCLK, DCLK, DSEL, DOUT) Output Low Voltage (P0, ALE, MCMD, MDAT, MCLK, SCLK, DCLK, DSEL, DOUT) Output High Voltage (P1, P2, P3, P4 and P5) Output High Voltage (P0, P2 address mode, ALE, MCMD, MDAT, MCLK, SCLK, DCLK, DSEL, DOUT) Logical 0 Input Current (P1, P2, P3, P4 and P5) Input Leakage Current (P0, ALE, MCMD, MDAT, MCLK, SCLK, DCLK, DSEL, DOUT) Logical 1 to 0 Transition Current (P1, P2, P3, P4 and P5) Pull-Down Resistor Pin Capacitance VDD Data Retention Limit Operating Current TBD 50 90 10 1.8 VDD - 0.7 Min -0.5 0.2*VDD + 0.9 0.7*VDD Typ1 Max 0.2*VDD - 0.1 VDD VDD + 0.5 Units V V V Test Conditions
VOL1
0.45
V
IOL= 1.6 mA
VOL2
0.45
V
IOL= 3.2 mA
VOH1
V
IOH= -30 A
VOH2
VDD - 0.7
V
IOH= -3.2 mA
IIL
-50
A
Vin = 0.45 V
ILI
10
A
0.45 < VIN < VDD
ITL RRST CIO VRET IDD
-650
A k pF V
Vin = 2.0 V
200
TA= 25C
TBD
mA
12 MHz, VDD < 3.3 V 16 MHz, VDD < 3.3 V 20 MHz, VDD < 3.3 V 12 MHz, VDD < 3.3 V 16 MHz, VDD < 3.3 V 20 MHz, VDD < 3.3 V VRET < VDD < 3.3 V
IDL IPD
Idle Mode Current
TBD
TBD
mA A
Power-Down Current
TBD
TBD
Notes:
1. Typical values are obtained using VDD= 3 V and TA= 25C. They are not tested and there is no guarantee on these values.
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Figure 9. IDD/IDL Versus XTAL Frequency; VDD= 2.7 to 3.3 V
TBD
IDD/IDL (mA)
TBD
TBD
0
2
4
6
8
10
12
14
16
18
20
max Active mode (mA) typ Active mode (mA) max Idle mode (mA) typ Idle mode (mA)
Frequency at XTAL (MHz)
11.2 DC Characteristics - IDD, IDL and IPD Test Conditions
Figure 10. IDD Test Condition, Active Mode
VDD VDD
RST
VDD
IDD
VDD
P0 (NC) Clock Signal X2 X1 VSS
VSS
TST#
All other pins are unconnected
Figure 11. IDL Test Condition, Idle Mode
VDD RST VSS P0 (NC) Clock Signal X2 X1 VSS VSS All other pins are unconnected TST# VDD IDL VDD
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Rev. D - 15-Nov-01
Figure 12. IPD Test Condition, Power-Down Mode
VDD RST VSS P0 (NC) X2 X1 VSS VSS All other pins are unconnected MCMD MDAT TST# VDD IPD VDD
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11.3 DC Characteristics - A to D Converter
Table 40. A to D Converter DC Characteristics VDD= 2.7 to 3.3 V, TA= -40 to +85C
Symbol AVDD AIDD AIPD AVIN AVREF RREF CIA Parameter Analog Supply Voltage Analog Operating Supply Current Analog Standby Current Analog Input Voltage Reference Voltage AREFN AREFP AREF Input Resistance Analog Input capacitance AVSS AVSS 2.4 10 Min 2.7 Typ Max 3.3 600 Units V A A V AVDD= 3.3V AIN1:0= 0 to AVDD AVDD= 3.3V ADEN= 0 or PD= 1 Test Conditions
2 AVDD
AVDD 30 10
V V K pF TA= 25C TA= 25C
11.4 DC Characteristics - Oscillator & Crystal
11.5.1 Schematic Figure 13. Crystal Connection
X1 C1 Q C2 VSS X2
Note:
For operation with most standard crystals, no external components are needed on X1 and X2. It may be necessary to add external capacitors on X1 and X2 to ground in special cases (max 10 pF). X1 and X2 may not be used to drive other circuits.
11.6.2 Parameters
Table 41. Oscillator & Crystal Characteristics VDD= 2.7 to 3.3 V, TA= -40 to +85C
Symbol CX1 CX2 CL DL F RS CS Parameter Internal Capacitance (X1 - VSS) Internal Capacitance (X2 - VSS) Equivalent Load Capacitance (X1 - X2) Drive Level Crystal Frequency Crystal Series Resistance Crystal Shunt Capacitance Min Typ 10 10 5 50 20 40 6 Max Unit pF pF pF W MHz pF
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Rev. D - 15-Nov-01
11.7 DC Characteristics - Phase Lock Loop
11.8.1 Schematic Figure 14. PLL Filter Connection
PFILT R C1 VSS VSS C2
11.9.2 Parameters
Table 42. PLL Filter Characteristics VDD= 2.7 to 3.3 V, TA= -40 to +85C
Symbol R C1 C2 Filter Resistor Filter Capacitance 1 Filter Capacitance 2 Parameter Min Typ 100 10 2.2 Max Unit nF nF
11.10 DC Characteristics - In System Programming
11.11.1 Schematic Figure 15. ISP Pull-Down Connection
ISP# RISP VSS
11.12.2 Parameters
Table 43. ISP Pull-Down Characteristics VDD= 2.7 to 3.3 V, TA= -40 to +85C
Symbol RISP Parameter ISP Pull-Down Resistor Min Typ 2.2 Max Unit K
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12. AC Characteristics
12.1 AC Characteristics - External 8-bit Bus Cycles
12.2.1 Definition of symbols Table 44. External 8-bit Bus Cycles Timing Symbol Definitions
Signals A D L Q R W Address Data In ALE Data Out RD# WR# H L V X Z Conditions High Low Valid No Longer Valid Floating
12.3.2 Timings
Test conditions: capacitive load on all pins= 50 pF. Table 45. External 8-bit Bus Cycle - Data Read AC Timings VDD= 2.7 to 3.3 V, TA= -40 to +85C
Variable Clock Standard Mode Symbol TCLCL TLHLL TAVLL TLLAX TLLRL TRLRH TRHLH TAVDV TAVRL TRLDV TRLAZ TRHDX TRHDZ Parameter Clock Period ALE Pulse Width Address Valid to ALE Low Address hold after ALE Low ALE Low to RD# Low RD# Pulse Width RD# high to ALE High Address Valid to Valid Data In Address Valid to RD# Low RD# Low to Valid Data RD# Low to Address Float Data Hold After RD# High Instruction Float After RD# High 0 2*TCLCL-25 4*TCLCL-30 5*TCLCL-30 0 0 TCLCL-25 Min 50 2*TCLCL-15 TCLCL-20 TCLCL-20 3*TCLCL-30 6*TCLCL-25 TCLCL-20 TCLCL+20 9*TCLCL-65 2*TCLCL-30 2.5*TCLCL-30 0 Max Variable Clock X2 Mode Min 50 TCLCL-15 0.5*TCLCL-20 0.5*TCLCL-20 1.5*TCLCL-30 3*TCLCL-25 0.5*TCLCL-20 0.5*TCLCL+20 4.5*TCLCL-65 Max Unit ns ns ns ns ns ns ns ns ns ns ns ns ns
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Rev. D - 15-Nov-01
Table 46. External 8-bit Bus Cycle - Data Write AC Timings VDD= 2.7 to 3.3 V, TA= -40 to +85C
Variable Clock Standard Mode Symbol TCLCL TLHLL TAVLL TLLAX TLLWL TWLWH TWHLH TAVWL TQVWH TWHQX Parameter Clock Period ALE Pulse Width Address Valid to ALE Low Address hold after ALE Low ALE Low to WR# Low WR# Pulse Width WR# High to ALE High Address Valid to WR# Low Data Valid to WR# High Data Hold after WR# High Min 50 2*TCLCL-15 TCLCL-20 TCLCL-20 3*TCLCL-30 6*TCLCL-25 TCLCL-20 4*TCLCL-30 7*TCLCL-20 TCLCL-15 TCLCL+20 Max Variable Clock X2 Mode Min 50 TCLCL-15 0.5*TCLCL-20 0.5*TCLCL-20 1.5*TCLCL-30 3*TCLCL-25 0.5*TCLCL-20 2*TCLCL-30 3.5*TCLCL-20 0.5*TCLCL-15 0.5*TCLCL+20 Max Unit ns ns ns ns ns ns ns ns ns ns
12.4.3 Waveforms
Figure 16. External 8-bit Bus Cycle - Data Read Waveforms
ALE
TLHLL
TLLRL
TRLRH
TRHLH
RD# TRLDV TRLAZ TAVLL P0 TLLAX A7:0 TAVRL TAVDV P2 A15:8 D7:0 Data In TRHDZ TRHDX
Figure 17. External 8-bit Bus Cycle - Data Write Waveforms
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ALE
TLHLL
TLLWL
TWLWH
TWHLH
WR# TAVWL TAVLL P0 TLLAX A7:0 TQVWH D7:0 Data Out P2 A15:8 TWHQX
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Rev. D - 15-Nov-01
12.5 AC Characteristics - External IDE 16-bit Bus Cycles
12.6.1 Definition of symbols Table 47. External IDE 16-bit Bus Cycles Timing Symbol Definitions
Signals A D L Q R W Address Data In ALE Data Out RD# WR# H L V X Z Conditions High Low Valid No Longer Valid Floating
12.7.2 Timings
Test conditions: capacitive load on all pins= 50 pF. Table 48. External IDE 16-bit Bus Cycle - Data Read AC Timings VDD= 2.7 to 3.3 V, TA= -40 to +85C
Variable Clock Standard Mode Symbo l TCLCL TLHLL TAVLL TLLAX TLLRL TRLRH TRHLH TAVDV TAVRL TRLDV TRLAZ TRHDX TRHDZ Parameter Clock Period ALE Pulse Width Address Valid to ALE Low Address hold after ALE Low ALE Low to RD# Low RD# Pulse Width RD# high to ALE High Address Valid to Valid Data In Address Valid to RD# Low RD# Low to Valid Data RD# Low to Address Float Data Hold After RD# High Instruction Float After RD# High 0 2*TCLCL-25 4*TCLCL-30 5*TCLCL-30 0 0 TCLCL-25 Min 50 2*TCLCL-15 TCLCL-20 TCLCL-20 3*TCLCL-30 6*TCLCL-25 TCLCL-20 TCLCL+20 9*TCLCL-65 2*TCLCL-30 2.5*TCLCL-30 0 Max Variable Clock X2 Mode Min 50 TCLCL-15 0.5*TCLCL-20 0.5*TCLCL-20 1.5*TCLCL-30 3*TCLCL-25 0.5*TCLCL-20 0.5*TCLCL+20 4.5*TCLCL-65 Max Unit ns ns ns ns ns ns ns ns ns ns ns ns ns
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Table 49. External IDE 16-bit Bus Cycle - Data Write AC Timings VDD= 2.7 to 3.3 V, TA= -40 to +85C
Variable Clock Standard Mode Symbol TCLCL TLHLL TAVLL TLLAX TLLWL TWLWH TWHLH TAVWL TQVWH TWHQX Parameter Clock Period ALE Pulse Width Address Valid to ALE Low Address hold after ALE Low ALE Low to WR# Low WR# Pulse Width WR# High to ALE High Address Valid to WR# Low Data Valid to WR# High Data Hold after WR# High Min 50 2*TCLCL-15 TCLCL-20 TCLCL-20 3*TCLCL-30 6*TCLCL-25 TCLCL-20 4*TCLCL-30 7*TCLCL-20 TCLCL-15 TCLCL+20 Max Variable Clock X2 Mode Min 50 TCLCL-15 0.5*TCLCL-20 0.5*TCLCL-20 1.5*TCLCL-30 3*TCLCL-25 0.5*TCLCL-20 2*TCLCL-30 3.5*TCLCL-20 0.5*TCLCL-15 0.5*TCLCL+20 Max Unit ns ns ns ns ns ns ns ns ns ns
12.8.3 Waveforms
Figure 18. External IDE 16-bit Bus Cycle - Data Read Waveforms
ALE
TLHLL
TLLRL
TRLRH
TRHLH
RD# TRLDV TRLAZ TAVLL P0 TLLAX A7:0 TAVRL TAVDV P2 A15:8 D15:81 Data In D7:0 Data In TRHDZ TRHDX
Note:
D15:8 is written in DAT16H SFR.
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Rev. D - 15-Nov-01
Figure 19. External IDE 16-bit Bus Cycle - Data Write Waveforms
ALE
TLHLL
TLLWL
TWLWH
TWHLH
WR# TAVWL TAVLL P0 TLLAX A7:0 TQVWH D7:0 Data Out P2 A15:8 D15:81 Data Out TWHQX
Note:
D15:8 is the content of DAT16H SFR.
12.9 AC Characteristics - SPI Interface
12.10.1 Definition of symbols Table 50. SPI Interface Timing Symbol Definitions
Signals C I O Clock Data In Data Out H L V X Z Conditions High Low Valid No Longer Valid Floating
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12.11.2 Timings Test conditions: capacitive load on all pins= 100 pF. Table 51. SPI Interface Master AC Timing VDD= 2.7 to 3.3 V, TA= -40 to +85C
Symbol Parameter Slave mode TCHCH TCHCX TCLCX TSLCH, TSLCL TIVCL, TIVCH TCLIX, TCHIX TCLOV, TCHOV TCLOX, TCHOX TCLSH, TCHSH TIVCL, TIVCH TCLIX, TCHIX TSLOV TSHOX TSHSL TILIH TIHIL TOLOH TOHOL Clock Period Clock High Time Clock Low Time SS# Low to Clock edge Input Data Valid to Clock Edge Input Data Hold after Clock Edge Output Data Valid after Clock Edge Output Data Hold Time after Clock Edge SS# High after Clock Edge Input Data Valid to Clock Edge Input Data Hold after Clock Edge SS# Low to Output Data Valid Output Data Hold after SS# High SS# High to SS# Low Input Rise Time Input Fall Time Output Rise time Output Fall Time Master mode TCHCH TCHCX TCLCX TIVCL, TIVCH TCLIX, TCHIX TCLOV, TCHOV TCLOX, TCHOX TILIH TIHIL TOLOH TOHOL Clock Period Clock High Time Clock Low Time Input Data Valid to Clock Edge Input Data Hold after Clock Edge Output Data Valid after Clock Edge Output Data Hold Time after Clock Edge Input Data Rise Time Input Data Fall Time Output Data Rise time Output Data Fall Time 0 2 2 50 50 4 1.6 1.6 50 50 65 TOSC TOSC TOSC ns ns ns ns s s ns ns
(1)
Min
Max
Unit
8 3.2 3.2 200 100 100 100 0 0 100 100 130 130
TOSC TOSC TOSC ns ns ns ns ns ns ns ns ns ns
2 2 100 100
s s ns ns
Notes:
1. Value of this parameter depends on software.
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Rev. D - 15-Nov-01
12.12.3 Waveforms
Figure 20. SPI Slave Waveforms (SSCPHA= 0)
SS# (input) TSLCH TSLCL SCK (SSCPOL= 0) (input) SCK (SSCPOL= 1) (input) TSLOV MISO (output) SLAVE MSB OUT TIVCH TCHIX TIVCL TCLIX MOSI (input) MSB IN BIT 6 LSB IN TCLOV TCHOV BIT 6 TCHCH TCLCH
TCLSH TCHSH
TSHSL
TCHCX
TCLCX TCHCL
TCLOX TCHOX SLAVE LSB OUT 1
TSHOX
Note:
Not Defined but generally the MSB of the character which has just been received.
Figure 21. SPI Slave Waveforms (SSCPHA= 1)
SS#1 (output) TCHCH SCK (SSCPOL= 0) (output) SCK (SSCPOL= 1) (output) TCLCH
TCHCX
TCLCX TCHCL
TIVCH TCHIX TIVCL TCLIX MSB IN BIT 6 TCLOV TCHOV LSB IN TCLOX TCHOX LSB OUT Port Data
SI (input)
SO (output)
Port Data
MSB OUT
BIT 6
Note:
Not Defined but generally the LSB of the character which has just been received.
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Figure 22. SPI Master Waveforms (SSCPHA= 0)
SS#1 (input) TSLCH TSLCL SCK (SSCPOL= 0) (input) SCK (SSCPOL= 1) (input) TSLOV MISO (output) 1 SLAVE MSB OUT TIVCH TCHIX TIVCL TCLIX MOSI (input) MSB IN BIT 6 LSB IN TCHCH TCLCH TCLSH TCHSH TSHSL
TCHCX
TCLCX TCHCL
TCHOV TCLOV BIT 6
TCHOX TCLOX SLAVE LSB OUT
TSHOX
Note:
SS# handled by software using general purpose port pin.
Figure 23. SPI Master Waveforms (SSCPHA= 1)
SS#1 (output) TCHCH SCK (SSCPOL= 0) (output) SCK (SSCPOL= 1) (output) TCLCH
TCHCX
TCLCX TCHCL
TIVCH TCHIX TIVCL TCLIX
SI (input)
MSB IN TCLOV
BIT 6 TCLOX TCHOX BIT 6
LSB IN
SO (output)
TCHOV Port Data MSB OUT
LSB OUT
Port Data
Note:
SS# handled by software using general purpose port pin.
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Rev. D - 15-Nov-01
12.13 AC Characteristics - 2-wire Interface
12.14.1 Timings Table 52. 2-wire Interface AC Timing VDD= 2.7 to 3.3 V, TA= -40 to +85C
INPUT Min Max 14*TCLCL(4) 16*TCLCL(4) 14*TCLCL(4) 1 s 0.3 s 250 ns 250 ns 250 ns 0 ns 14*TCLCL(4) 14*TCLCL(4) 14*TCLCL(4) 1 s 0.3 s OUTPUT Min Max 4.0 s(1) 4.7 s(1) 4.0 s(1) -(2) 0.3 s(3) 20*TCLCL(4)- TRD 1 s(1) 8*TCLCL(4) 8*TCLCL(4) - TFC 4.7 s(1) 4.0 s(1) 4.7 s(1) -(2) 0.3 s(3)
Symbol THD; STA TLOW THIGH TRC TFC TSU; DAT1 TSU; DAT2 TSU; DAT3 THD; DAT TSU; STA TSU; STO TBUF TRD TFD
Parameter Start condition hold time SCL low time SCL high time SCL rise time SCL fall time Data set-up time SDA set-up time (before repeated START condition) SDA set-up time (before STOP condition) Data hold time Repeated START set-up time STOP condition set-up time Bus free time SDA rise time SDA fall time
Notes:
1. At 100 kbit/s. At other bit-rates this value is inversely proportional to the bit-rate of 100 kbit/s. 2. Determined by the external bus-line capacitance and the external bus-line pull-up resistor, this must be < 1 s. 3. Spikes on the SDA and SCL lines with a duration of less than 3*TCLCL will be filtered out. Maximum capacitance on bus-lines SDA and SCL= 400 pF. 4. TCLCL= TOSC= one oscillator clock period.
12.15.2 Waveforms
Figure 24. 2-wire Waveforms
START or Repeated START condition Trd Repeated START condition START condition STOP condition Tsu;STA 0.7 VDD 0.3 VDD Tfd Trc Tfc Tsu;STO Tsu;DAT3 0.7 VDD 0.3 VDD Tsu;DAT Tbuf
SDA (INPUT/OUTPUT)
SCL (INPUT/OUTPUT) Thd;STA Tlow Thigh Tsu;DAT1 Thd;DAT
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12.16 AC Characteristics - MMC Interface
12.17.1 Definition of symbols Table 53. MMC Interface Timing Symbol Definitions
Signals C D O Clock Data In Data Out H L V X Conditions High Low Valid No Longer Valid
12.18.2 Timings
Table 54. MMC Interface AC timings VDD= 2.7 to 3.3 V, TA= 0 to 70C, CL 100pF (10 cards)
Symbol TCHCH TCHCX TCLCX TCLCH TCHCL TDVCH TCHDX TCHOX TOVCH Clock Period Clock High Time Clock Low Time Clock Rise Time Clock Fall Time Input Data Valid to Clock High Input Data Hold after Clock High Output Data Hold after Clock High Output Data Valid to Clock High 3 3 5 5 Parameter Min 50 10 10 10 10 Max Unit ns ns ns ns ns ns ns ns ns
12.19.3 Waveforms
Figure 25. MMC Input-Output Waveforms
TCHCH TCHCX MCLK TCHCL TCHIX MCMD Input MDAT Input TCHOX MCMD Output MDAT Output TOVCH TCLCH TIVCH TCLCX
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Rev. D - 15-Nov-01
12.20 AC Characteristics - Audio Interface
12.21.1 Definition of symbols Table 55. Audio Interface Timing Symbol Definitions
Signals C O S Clock Data Out Data Select H L V X Conditions High Low Valid No Longer Valid
12.22.2 Timings
Table 56. Audio Interface AC timings VDD= 2.7 to 3.3 V, TA= 0 to 70C, CL 30pF
Symbol TCHCH TCHCX TCLCX TCLCH TCHCL TCLSV TCLOV Parameter Clock Period Clock High Time Clock Low Time Clock Rise Time Clock Fall Time Clock Low to Select Valid Clock Low to Data Valid 30 30 10 10 10 10 Min Max 325.5
(1)
Unit ns ns ns ns ns ns ns
Notes:
1. 32-bit format with Fs= 48 KHz.
12.23.3 Waveforms
Figure 26. Audio Interface Waveforms
TCHCH TCHCX DCLK TCHCL TCLSV DSEL TCLOV DDAT Right Left TCLCH TCLCX
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12.24 AC Characteristics - Analog to Digital Converter
12.25.1 Definition of symbols Table 57. Analog to Digital Converter Timing Symbol Definitions
Signals C E S Clock Enable (ADEN bit) Start Conversion (ADSST bit) H L Conditions High Low
12.26.2 Characteristics
Table 58. Analog to Digital Converter AC Characteristics VDD= 2.7 to 3.3 V, TA= 0 to 70C
Symbol TCLCL TEHSH TSHSL DLe Parameter Clock Period Start-up Time Conversion Time Differential nonlinearity error1, 2 Integral nonlinearity error1, 3 Offset error1, 4 Gain error
1, 5
Min 1.43
Max
Unit s
4 11*TCLCL TBD
s s LSB
ILe OSe Ge
TBD TBD TBD
LSB LSB %
Notes:
1. AVDD= AVREFP= 3.0 V, AVSS= AVREFN= 0 V. ADC is monotonic with no missing code. 2. The differential non-linearity is the difference between the actual step width and the ideal step width (see Figure 28). 3. The integral non-linearity is the peak difference between the center of the actual step and the ideal transfer curve after appropriate adjustment of gain and offset errors (see Figure 28). 4. The offset error is the absolute difference between the straight line which fits the actual transfer curve (after removing of gain error), and the straight line which fits the ideal transfer curve (see Figure 28). 5. The gain error is the relative difference in percent between the straight line which fits the actual transfer curve (after removing of offset error), and the straight line which fits the ideal transfer curve (see Figure 28).
12.27.3 Waveforms
Figure 27. Analog to Digital Converter Internal Waveforms
CLK TCLCL ADEN Bit TEHSH ADSST Bit TSHSL
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Rev. D - 15-Nov-01
Figure 28. Analog to Digital Converter Characteristics
Code Out
Offset Gain Error Error OSe Ge
1023 1022 1021 1020 1019 1018 Ideal Transfer curve
7 6 5 4 3 2 1 0 0 1 LSB (ideal) Center of a step
Example of an actual transfer curve
Integral non-linearity (ILe) Differential non-linearity (DLe)
AVIN (LSBideal)
1 Offset Error OSe 2 3 4 5 6 7 1018 1019 1020 1021 1022 1023 1024
12.28 AC Characteristics - FLASH Memory
12.29.1 Definition of symbols Table 59. FLASH Memory Timing Symbol Definitions
Signals S R B ISP# RST FBUSY flag L V X Conditions Low Valid No Longer Valid
12.30.2 Timings
Table 60. FLASH Memory AC Timing VDD= 2.7 to 3.3 V, TA= -40 to +85C
Symbol TSVRL TRLSX TBHBL Parameter Input ISP# Valid to RST Edge Input ISP# Hold after RST Edge FLASH Internal Busy (Programming) Time Min 50 50 10 Typ Max Unit ns ns ms
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12.31.3 Waveforms Figure 29. FLASH Memory - ISP Waveforms
RST TSVRL ISP#1 TRLSX
Note:
ISP# must be driven through a pull-down resistor (see Section 11.10, page 38).
Figure 30. FLASH Memory - Internal Busy Waveforms
FBUSY bit
TBHBL
12.32 AC Characteristics - External Clock Drive and Logic Level References
12.33.1 Definition of symbols Table 61. External Clock Timing Symbol Definitions
Signals C Clock H L X Conditions High Low No Longer Valid
12.34.2 Timings
Table 62. External Clock AC Timings VDD= 2.7 to 3.3 V, TA= 0 to 70C
Symbol TCLCL TCHCX TCLCX TCLCH TCHCL TCR Clock Period High Time Low Time Rise Time Fall Time Cyclic Ratio in X2 mode Parameter Min 50 10 10 3 3 40 60 Max Unit ns ns ns ns ns %
12.35.3 Waveforms Figure 31. External Clock Waveform
TCLCH VDD - 0.5 0.45 V VIH1 TCLCX TCHCL TCLCL
TCHCX
VIL
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Rev. D - 15-Nov-01
Figure 32. AC Testing Input/Output Waveforms
INPUTS VDD - 0.5 0.45 V 0.7 VDD 0.3 VDD
OUTPUTS VIH min VIL max
Note:
1. During AC testing, all inputs are driven at VDD -0.5 V for a logic 1 and 0.45 V for a logic 0. 2. Timing measurements are made on all outputs at VIH min for a logic 1 and VIL max for a logic 0.
Figure 33. Float Waveforms
VLOAD
VLOAD + 0.1 V VLOAD - 0.1 V
Timing Reference Points
VOH - 0.1 V VOL + 0.1 V
Note:
For timing purposes, a port pin is no longer floating when a 100 mV change from load voltage occurs and begins to float when a 100 mV change from the loading VOH/VOL level occurs with IOL/IOH= 20 mA.
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13. Packages
13.1 List of Packages
* * TQFP80 PLCC84
13.2 TQFP80 - Mechanical Outline
Figure 34. TQFP80 - Mechanical Outline
55
Rev. D - 15-Nov-01
13.3 PLCC84 - Mechanical Outline
Figure 35. PLCC84 - Mechanical Outline
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14. Ordering Information
Temperature range
Industrial Industrial
Part-number
T89C51SND1ROTIL T83C51SND1*ROTIL
Memory size
64K Flash 64K ROM
Supply voltage
3V 3V
Max frequency
40MHZ 40MHZ
Package
TQFP80 TQFP80
Packing
Tray Tray
(*)check for availability. PLCC84 package only available for development board.
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Rev. D - 15-Nov-01
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Table of Contents
1. Features ..........................................................................................................1 2. Description ......................................................................................................2 3. Typical Applications .........................................................................................2 4. Pin Description ................................................................................................3 4.1 Pinouts ......................................................................................................3 4.2 Signals........................................................................................................4 4.3 Internal Pin Structure .................................................................................10 5. Block Diagram .................................................................................................11 6. Application Information ....................................................................................12 7. Address Spaces ..............................................................................................15 7.1 Code Memory ............................................................................................15 7.2 Boot Memory .............................................................................................15 7.3 Data Memory .............................................................................................15 7.4 Special Function Registers ........................................................................15 8. In System & In Application Programming ........................................................22 8.1 Introduction ................................................................................................22 8.2 In System Programming ............................................................................22 8.3 Serial Boot Loader .....................................................................................24 8.4 In Application Programming ......................................................................27 9. Peripherals ......................................................................................................30 9.1 Clock Generator System ...........................................................................30 9.2 Ports ..........................................................................................................30 9.3 Timers/Counters ........................................................................................30 9.4 Watchdog Timer ........................................................................................30 9.5 MP3 Decoder ............................................................................................30 9.6 Audio Output Interface ..............................................................................31 9.7 Universal Serial Bus Interface ...................................................................31 9.8 MultiMediaCard Interface ..........................................................................31 9.9 IDE/ATAPI interface ..................................................................................31 9.10 Serial I/O Interface ..................................................................................31 9.11 Serial Peripheral Interface .......................................................................31 9.12 2-wire Controller ......................................................................................32 9.13 A/D Controller ..........................................................................................32 9.14 Keyboard Interface ..................................................................................32 10. Absolute Maximum Rating and Operating Conditions ...................................33 10.1 Absolute Maximum Rating ......................................................................33 10.2 Operating Conditions ...............................................................................33 11. DC Characteristics ........................................................................................34 11.1 DC Characteristics - Digital Logic ............................................................34 11.2 DC Characteristics - IDD, IDL and IPD Test Conditions ..........................35 11.3 DC Characteristics - A to D Converter .....................................................37 11.4 DC Characteristics - Oscillator & Crystal .................................................37 11.5 DC Characteristics - Phase Lock Loop ....................................................38 11.6 DC Characteristics - In System Programming .........................................38 12. AC Characteristics .........................................................................................39 12.1 AC Characteristics - External 8-bit Bus Cycles .......................................39 12.2 AC Characteristics - External IDE 16-bit Bus Cycles ..............................41 12.3 AC Characteristics - SPI Interface ...........................................................44 12.4 AC Characteristics - 2-wire Interface .......................................................48 12.5 AC Characteristics - MMC Interface ........................................................49 12.6 AC Characteristics - Audio Interface .......................................................50 12.7 AC Characteristics - Analog to Digital Converter .....................................51
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Rev. D - 15-Nov-01
12.8 AC Characteristics - FLASH Memory ......................................................52 12.9 AC Characteristics - External Clock Drive and Logic Level References .53 13. Packages .......................................................................................................55 13.1 List of Packages ......................................................................................55 13.2 TQFP80 - Mechanical Outline .................................................................55 13.3 PLCC84 - Mechanical Outline .................................................................56 14. Ordering Information .....................................................................................57
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(c) Atmel Nantes SA, 2001. Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company's standard warranty which is detailed in Atmel's Terms and Conditions located on the Company's web site. The Company assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Atmel are granted by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel's products are not authorized for use as critical components in life support devices or systems.
Printed on recycled paper.

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