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E2E0045-38-96
Semiconductor MSM64P164
Semiconductor
This version: Sep. 1998 MSM64P164 Previous version: Sep. 1995
4-Bit Microcontroller with Built-in RC Oscillation Type A/D Converter and LCD Driver
Pr el im in ar y
GENERAL DESCRIPTION
The MSM64P164 is a one-time-programmable ROM-version product, which has one-time PROM (OTP) as internal program memory. On the other hand, the MSM64164C is a mask ROMversion product, which has mask ROM as internal program memory. Unlike the mask ROM-version MSM64164C, which has a P-well CMOS structure, the MSM64P164 has been fabricated with the N-well CMOS-structured EEPROM process technology. Therefore, the MSM64P164 differs from the MSM64164C in the polarity of the power supply for LCD bias generation and 5 V interface, and in the external circuit structure. Unlike the mask ROM-version product, the MSM64P164 cannot be supplied in the form of a chip. The MSM64P164 is an OTP-version product used to evaluate an application program. The MSM64P164 has two operation modes, microcontroller operation mode and PROM mode. The microcontroller operation mode is used to operate the MSM64P164 like a mask ROM-version product and the PROM mode is used to program or read the PROM.
FEATURES
* Operating range Operating frequencies Operating voltage Operating temperature * Memory space Internal program memory Internal data memory * RC oscillation type A/D converter Counter A Counter B * Serial port : : : : : : : : : 32.768 kHz, 400 kHz 1.5 V/3.0 V selectable by mask option Low supply current 0 to +65C 4064 bytes 256 nibbles 2 channels Time dividing 2-channel method 1/(104 8) 1 1/214 1 Synchronous 8-bit transfer External clock/internal clock selectable MSB first/LSB first selectable 34 outputs; duty ratio switchable by software 120 segments (max) 93 segments (max) 64 segments (max) 1 output (4 output modes selectable) 2 channels (256 Hz, 128 Hz, 64 Hz, 32 Hz)
* LCD driver (1) At 1/4 duty and 1/3 bias (2) At 1/3 duty and 1/3 bias (3) At 1/2 duty and 1/2 bias * Buzzer driver * Capture circuit * Watchdog timer * I/O port Input-output port Input port Output port
: : : : : :
: : :
3 ports 4 bits 1 port 4 bits 1 port 4 bits
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Semiconductor
MSM64P164
* Interrupt sources External interrupt : 2 sources Internal interrupt : 8 sources * Package: 80-pin plastic QFP (QFP80-P-1420-0.80-BK) : (Product name : MSM64P164-GS-BK) indicates a code number.
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VPP
BIAS Program data/address LCD
VDD1 VDD2 VDD3 C1 C2 L0 L1
Semiconductor
BLOCK DIAGRAM
HALT
TR2
TR0
(4)
TR1 PCM PCL PCH A11 to A8 A7 to A0
PROM (4064 bytes)
PORT ADDRESS
MIEF
C
ALU
B BSR
A
H
L
X
Y
RAM (256 nibbles)
P2 P3 P4 INT
L33 VDD P2.0 P2.1 P4.3 VDD
(4)
(4)
DB7 to DB0 OSC2 OSC1 XT XT RESET TST1 TST2 VSSL SP
(8)
2CLK
TIMING CONTROLLER TBC 5 INT
ROMR
P0 SIOP INT P1 VDD
P0.0 P0.1 P0.2 P0.3
RSTG TST
I*R DECODER
IR
(8)
INT
PORT ADDRESS DB7 to DB0 INT BD ADC
IN0 CS0 RS0 CRT0 RT0 IN1 CS1 RS1 RT1
P1.0 P1.1 P1.2 P1.3 VDD VSS
VR WDT INT INTC
MSM64P164
CAPR
BD
3/37
Semiconductor
MSM64P164
PIN CONFIGURATION (TOP VIEW)
70 RESET 66 OSC1 65 OSC2 72 TST2 71 TST1
80 P0.3
78 P0.1
77 P0.0
76 P1.3
75 P1.2
74 P1.1
73 P1.0
79 P0.2
67 VDD
69 XT
68 XT
L0/D0 L1/D1 L2/D2 L3/D3 L4/D4 L5/D5 L6/D6 L7/D7 L8/CE L9/OE L10/A0 L11/A1 L12/A2 L13/A3 L14/A4 L15/A5 L16/A6 P2.0 P2.1 P2.2 P2.3 P3.0 P3.1 P3.2
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
64 L33/P6.3 63 L32/P6.2 62 L31/P6.1 61 L30/P6.0 60 L29/P5.3 59 L28/P5.2 58 L27/P5.1 57 L26/P5.0 56 L25 55 L24 54 L23 53 L22 52 L21/A11 51 L20/A10 50 L19/A9 49 L18/A8 48 L17/A7 47 C2 46 C1 45 VDD3 44 VDD2 43 VDD 42 VDD1 41 RT1
P3.3 25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
Note: Because pin 32 and pin 67 are internally connected with each other, VDD can be supplied from either pin 32 or pin 67.
P4.0 P4.1 P4.2 P4.3 BD VPP VSS RT0 CRT0 RS0 CS0 IN0 IN1 CS1 RS1
80-Pin Plastic QFP
40
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Semiconductor
MSM64P164
PIN DESCRIPTIONS
Basic Functions
Function Pin 32 42 Power Supply 44 45 43 31 46,47 69 68 66 65 73 to 76 Ports 77 to 80 18 to 29 30 33 34 35 A/D Converter 36 37 41 40 39 38 Symbol VSS VDD1 VDD2 VDD3 VDD VPP C1, C2 XT XT OSC1 OSC2 P1.0 to P1.3 P0.0 to P0.3 P2.0 to P4.3 BD RT0 CRT0 RS0 CS0 IN0 RT1 RS1 CS1 IN1 Type -- -- -- -- -- -- -- I O I O O I I/O O O O O O I O O O I 0 V power supply Bias output for driving LCD (+1.5 V), or positive power supply at 1.5 V spec. Bias output for driving LCD (+3.0 V), or positive power supply at 3.0 V spec. Bias output for driving LCD (+4.5 V). Positive power supply for I/O port interface Positive power supply for writing to PROM (+12.5 V) Pins for connecting a capacitor for generating LCD driving bias. 32.768 kHz crystal connection pins External 400 kHz oscillation resistor (ROS) connection pins Output port (P1.0 : high current output) Input port Input-output ports Output pin for the buzzer driver Resistance temperature sensor connection pin Resistance/capacitance temperature sensor connection pin Reference resistor connection pin Reference capacitor connection pin Input pin for RC oscillator circuit Resistance temperature sensor connection pin Reference resistor connection pin Reference capacitor connection pin Input pin for RC oscillator circuit RC oscillation pins for A/D converter (channel 1) (CROSC1) RC oscillation pins for A/D converter (channel 0) (CROSC0) Description
Oscillation
Reset
70
RESET
I
System reset input pin. Setting this pin to "L" level puts this device into a reset state. Them, setting this pin to "H" level starts executing an instruction from address 000H. This pin is internally pulled up to VDD. Input pins for testing. LCD driver pins LCD driver pins, or output ports by mask option
Test
71 72 1 to 17, 48 to 56 57 to 64
TST1 TST2 L0 to L25 L26/P5.0 to L33/P6.3
I I O O
LCD Drivers
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Semiconductor Secondary Functions
Function Pin 77 78 79 80 18 19 20 External Interrupt 21 22 23 24 25 26 27 28 29 Capture Trigger 77 78 25 26 Serial Port 27 28 P4.1 P4.2 O I/O Symbol P0.0 P0.1 P0.2 P0.3 P2.0 P2.1 P2.2 P2.3 P3.0 P3.1 P3.2 P3.3 P4.0 P4.1 P4.2 P4.3 P0.0 P0.1 P3.3 P4.0 I I O Secondary functions of P0.0 and P0.1: Capture circuit trigger input pins. Secondary functions of P3.3: I I Type Description Secondary functions of P0.0 to P0.3: Level-triggered external interrupt input pins.
MSM64P164
The change of input signal level causes an interrupt to occur. Secondary functions of P2.0 to P2.3, P3.0 to P3.3, and P4.0 to P4.3: Level-triggered external interrupt input pins. The change of input signal level causes an interrupt to occur.
This pin is assigned the data input of a serial port (SIN). Secondary functions of P4.0: This pin is assigned the data output of a serial port (SOUT). Secondary functions of P4.1: This pin is assigned the ready output of a serial port (SPR). Secondary functions of P4.2: This pin is assigned the clock I/O of a serial port (SCLK). Secondary functions of P4.3: This pin is a monitor output (MON) of an RC oscillation clock (OSCCLK) for an A/D converter and a 400 kHz RC oscillation clock for a system clock.
RC Oscillation Monitor
29
P4.3
O
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Semiconductor PROM-Related Pins
Function Pin 32, 67 42 44 31 70 71 72 1 2 3 4 5 6 7 Programming 8 9 10 11 12 13 14 15 16 17 48 49 50 51 52 53 Symbol VSS VDD1* VDD2* VPP RESET TST1 TST2 L0/D0 L1/D1 L2/D2 L3/D3 L4/D4 L5/D5 L6/D6 L7/D7 L8/CE L9/OE L10/A0 L11/A1 L12/A2 L13/A3 L14/A4 L15/A5 L16/A6 L17/A7 L18/A8 L19/A9 L20/A10 L21/A11 L22 I Apply a "H" level to this pin. I/O I/O I PROM chip enable pin. PROM output enable signal. Program address input pins. I/O Pins for writing and reading program data. Type O -- -- -- I 0 V power supply. Positive power supply pin (+5 V supplied). Positive power supply pin (+5 V supplied). PROM write power supply (+12.5 V supplied). PROM write setting pins: PROM mode is set by a "L" level input. Description
MSM64P164
*
When in PROM mode, supply a 5 V power to both VDD1 and VDD2.
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Semiconductor
MSM64P164
ABSOLUTE MAXIMUM RATINGS (1.5 V Spec.)
Parameter Power Supply Voltage 1 Power Supply Voltage 2 Power Supply Voltage 3 Power Supply Voltage 4 Input Voltage 1 Input Voltage 2 Output Voltage 1 Output Voltage 2 Output Voltage 3 Output Voltage 4 Storage Temperature Symbol VDD1 VDD2 VDD3 VDD VIN1 VIN2 VOUT1 VOUT2 VOUT3 VOUT4 TSTG Condition Ta = 25C Ta = 25C Ta = 25C Ta = 25C VDD1 input, Ta = 25C VDD input, Ta = 25C VDD1 output, Ta = 25C VDD2 output Ta = 25C VDD3 output, Ta = 25C VDD output, Ta = 25C -- Rating -0.3 to +2.0 -0.3 to +4.0 -0.3 to +5.5 -0.3 to +5.5 -0.3 to VDD1 + 0.3 -0.3 to VDD + 0.3 -0.3 to VDD1 + 0.3 -0.3 to VDD2 + 0.3 -0.3 to VDD3 + 0.3 -0.3 to VDD + 0.3 -55 to +150 (VSS = 0 V) Unit V V V V V V V V V V C
RECOMMENDED OPERATING CONDITIONS (1.5 V Spec.)
(VSS = 0 V) Parameter Operating Temperature Operating Voltage External 400 kHz RC Oscillator Resistance Crystal Oscillation Frequency Symbol Top VDD1 VDD ROS fXT Condition -- -- -- -- -- Range 0 to +65 1.4 to 1.7 VDD1 to 5.25 250 to 500 30 to 35 Unit C V V kW kHz
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Semiconductor
MSM64P164
ELECTRICAL CHARACTERISTICS (1.5 V Spec.)
DC Characteristics
(VSS = 0 V, VDD1 = VDD = 1.5 V, Ta = 0 to +65C unless otherwise specified) Parameter
Symbol Measuring Circuit
Condition +100% -50% +100% -50%
Min.
Typ.
Max.
Unit
VDD2 Voltage VDD3 Voltage Crystal Oscillation Start Voltage Crystal Oscillation Hold Voltage Crystal Oscillation Stop Detection Time Internal Crystal Oscillator Capacitance External Crystal Oscillator Capacitance Internal Crystal Oscillator Capacitance Internal 400k RC Oscillator Capacitance 400k RC Oscillation Frequency POR Generation Voltage POR Non-generation Voltage
VDD2 VDD3 VSTA VHOLD TSTOP CG CGEX CD COS fOSC VPOR1 VPOR2
Ca, Cb, C12 = 0.1 mF Ca, Cb, C12 = 0.1 mF Oscillation start time: within 5 seconds -- -- -- When external CG used -- --
2.8 4.3 1.47 1.40 0.1 10 10 10 8 80 0 1.4
3.0 4.5 -- -- -- 15 -- 15 12 220 -- --
3.2 4.7 -- -- 1000 20 30 20 16 350 0.4 1.5
V V V V ms pF pF pF pF kHz V V
1
External resistor ROS = 300 kW VDD1 = 1.40 to 1.7 V When VDD1 is between VPOR1 and 1.5 V No POR when VDD1 is between VPOR2 and 1.5 V
Notes: 1. "POR" denotes Power On Reset. 2. "TSTOP" indicates that if the crystal oscillator stops over the value of TSTOP, the system reset occurs.
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Semiconductor DC Characteristics (continued)
MSM64P164
(VSS = 0 V, VDD1 = VDD = 1.5 V, Ta = 0 to +65C unless otherwise specified) Parameter
Symbol
Condition CPU in halt state (400k RC oscillation halt) CPU in operating state (400k RC oscillation halt) CPU in operating state (400k RC oscillation in operation) ROS = 300 kW Serial transfer, fSCK = 300 kHz, CPU in operating state (400k RC oscillation halt)
CPU in halt state (400k RC oscillation
Min.
Typ.
Max.
Unit
Measuring Circuit
Supply Current 1 Supply Current 2
IDD1 IDD2
-- --
2.0 50
5.0 80
mA mA
Supply Current 3
IDD3
--
90
180
mA
1
Supply Current 4
IDD4
--
60
100
mA
RT0 = 10 kW
--
150
230
mA
Supply Current 5
IDD5
halt), RC oscillator for A/D converter is in operating state
RT0 = 2 kW
--
600
900
mA
10/37
Semiconductor DC Characteristics (continued)
MSM64P164
(VSS = 0 V, VDD1 = VDD = 1.5 V, VDD2 = 3.0 V, VDD3 = 4.5 V, Ta = 0 to +65C unless otherwise specified) Parameter (Pin Name) Output Current 1 (P1.0) Output Current 2 (P1.1 to P1.3) (P2.0 to P2.3) (P3.0 to P3.3) (P4.0 to P4.3) Output Current 3 (BD)
Symbol
Condition VOH1 = VDD - 0.5 V VOL1 = 0.5 V VDD = 5 V, VOL1 = 0.5 V VOH2 = VDD - 0.5 V VOL2 = 0.5 V VDD = 5 V, VOL2 = 0.5 V VOH3 = VDD1 - 0.7 V VOL3 = 0.7 V VOH4 = VDD1 - 0.1 V VOL4 = 0.1 V VOH5 = VDD - 0.5 V VOL5 = 0.5 V VDD = 5 V, VOL5S = 0.5 V VOH6 = VDD1 - 0.5 V VOL6 = 0.5 V VOH7 = VDD3 - 0.2 V (VDD3 level) VOMH7 = VDD2 + 0.2 V (VDD2 level) VOMH7S = VDD2 - 0.2 V (VDD2 level) VOML7 = VDD1 + 0.2 V (VDD1 level) VOML7S = VDD1 - 0.2 V (VDD1 level) VOL7 = VSS + 0.2 V VOH = VDD1 (VSS level)
Min. -2.1 1.0 4.0 -2.1 0.2 1.0 -1.8 0.2 -1.1 0.3 -1.5 0.1 0.2 -2.1 0.2 -- 4.0 -- 4.0 -- 4.0 --
Typ. -0.7 3.0 12 -0.7 0.7 3.0 -0.6 0.6 -0.6 0.6 -0.5 0.5 0.7 -0.7 0.7 -- -- -- -- -- -- --
Max. -0.2 9.0 36 -0.2 2.1 9.0 -0.2 1.8 -0.3 1.1 -0.1 1.5 2.0 -0.2 2.1 -4.0 -- -4.0 -- -4.0 -- 0.3
Unit mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA
Measuring Circuit
IOH1 IOL1 IOL1S IOH2 IOL2 IOL2S IOH3 IOL3
Output Current 4 IOH4 (RT0, RT1, RS0, RS1, IOL4 CRT0, CS0, CS1) Output Current 5 IOH5 (When L26 to L33 are IOL5 configured as output IOL5S ports) Output Current 6 (OSC2) IOH6 IOL6 IOH7 IOMH7 Output Current 7 (L0 to L33) IOMH7S IOML7 IOML7S IOL7 Output Leakage Current (P1.0 to P1.3) (P2.0 to P2.3) (P3.0 to P3.3) (P4.0 to P4.3) (RT0, RT1, RS0, RS1, CRT0, CS0, CS1) IOOH
2
IOOL
VOL = VSS
-0.3
--
--
mA
11/37
Semiconductor DC Characteristics (continued)
MSM64P164
(VSS = 0 V, VDD1 = VDD = 1.5 V, VDD2 = 3.0 V, VDD3 = 4.5 V, Ta = 0 to +65C unless otherwise specified) Parameter (Pin Name)
Symbol
Condition VIH1 = VDD (when pulled down) VIL1 = VSS (when pulled up) VIH1 = VDD = 5 V (when pulled down)
Min. 5.0 -60 70
Typ. 18 -18 250 -250 -- -- 18 -- -- -22 -- -- -- -0.3 -- -- -- -- -- -- -- --
Max. 60 -5.0 660 -70 1.0 0 60 1.0 0 -6.0 1.0 0 1.0 -0.1 1.5 0.3 5.0 1.0 1.5 0.3 1.5 0.3
Unit mA mA mA mA mA mA mA mA mA mA mA mA mA mA V V V V V V V V
Measuring Circuit
IIH1 Input Current 1 (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3) (P4.0 to P4.3) IIL1 IIH1S IIL1S IIH1Z IIL1Z IIH2 Input Current 2 (IN0, IN1) IIH2Z IIL2Z IIL3 Input Current 3 (OSC1) IIH3Z IIL3Z Input Current 4 (RESET, TST1, TST2) Input Voltage 1 (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3) (P4.0 to P4.3) Input Voltage 2 (IN0, IN1, OSC1) Input Voltage 3 (RESET, TST1, TST2) IIH4 IIL4 VIH1 VIL1 VIH1S VIL1S VIH2 VIL2 VIH3 VIL3
VIL1 = VSS, VDD = 5 V (when pulled up) -660
VIH1 = VDD (in a high impedance state) VIL1 = VSS (in a high impedance state) VIH2 = VDD1 (when pulled down) VIH2 = VDD1 (in a high impedance state)
0 -1.0 5.0 0
3
VIL2 = VSS (in a high impedance state) -1.0 VIL3 = VSS (when pulled up) VIH3 = VDD1 (in a high impedance state) -60 0
VIL3 = VSS (in a high impedance state) -1.0 VIH4 = VDD1 VIL4 = VSS -- -- VDD = 5 V VDD = 5 V -- -- -- -- 0 -1.0 1.2 0 4.0 0 1.2 0 1.2 0
4
12/37
Semiconductor DC Characteristics (continued)
MSM64P164
(VSS = 0 V, VDD1 = VDD = 1.5 V, VDD2 = 3.0 V, VDD3 = 4.5 V, Ta = 0 to +65C unless otherwise specified) Parameter (Pin Name) Hysteresis Width (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3) (P4.0 to P4.3) Hysteresis Width (RESET, TST1, TST2) Input Pin Capacitance (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3) (P4.0 to P4.3)
Symbol
Condition
Min.
Typ.
Max.
Unit
Measuring Circuit
DVT1 DVT1S DVT2 VDD = 5 V
--
0.05 0.25
0.1 1.0
0.3 1.5
V V 4
--
0.05
0.1
0.3
V
CIN
--
--
--
5.0
pF
1
13/37
Semiconductor Measuring circuit 1
MSM64P164
RT0
CS0
RI0
RT0 OSC1 ROS OSC2
CS0
IN0
XT Crystal 32.768 kHz XT C1 C2 C12
VSS
VDD1 VDD2
VDD3
VDD Ca Cb, C12 ROS RT0 CS0 RI0 : 1 mF : 0.1 mF : 300 kW : 10 kW/2 kW : 820 pF : 10 kW
A
Ca V
Cb V
Measuring circuit 2
(*2)
OUTPUT
(*1) VIL
INPUT
VIH
A
VSS
VDD1
VDD2
VDD3
VDD
14/37
Semiconductor Measuring circuit 3
OUTPUT
(*3) A
MSM64P164
INPUT
VSS
VDD1
VDD2
VDD3
VDD
Measuring circuit 4
OUTPUT
VIH (*3) VIL
INPUT
Waveform Monitoring
VSS
VDD1
VDD2
VDD3
VDD
*1 Input logic circuit to determine the specified measuring conditions. *2 Measured at the specified output pins. *3 Measured at the specified input pins.
15/37
Semiconductor A/D Converter Characteristics
MSM64P164
(VSS = 0 V, VDD = 1.5 V, Ta = 0 to +65C unless otherwise specified) Parameter Symbol RS0, RS1, RT0, RT0-1, RT1 RI0, RI1 fOSC1 Oscillation Frequency fOSC2 fOSC3 RS*RT Oscillation Frequency Ratio (*) Kf1 Kf2 Kf3 Condition Min. Typ. Max. Unit
Measuring Circuit
Resistor for Oscillation
CS0, CT0, CS1 740 pF
2.0
--
--
kW
Input Current Limiting Resistor
-- Resistor for oscillation = 2 kW Resistor for oscillation = 10 kW Resistor for oscillation = 200 kW RT0, RT0-1, RT1 = 2 kW RT0, RT0-1, RT1 = 10 kW RT0, RT0-1, RT1 = 200 kW
1.0 165 41.8 2.55 3.89 0.990
10 221 52.2 3.04 4.18 1.0
-- 256 60.6 3.53 4.35 1.010
kW 5 kHz kHz kHz -- -- --
0.0561 0.0584 0.0637
*
Kfx is the ratio of the oscillation frequency by a sensor resistor to the oscillation frequency by a reference resistor in the same condition.
Kfx = fOSCX (RT0-CS0 Oscillation) fOSCX (RS0-CS0 Oscillation) , (x = 1, 2, 3) fOSCX (RT0-1-CS0 Oscillation) fOSCX (RS0-CS0 Oscillation) fOSCX (RT1-CS1 Oscillation) , fOSCX (RS1-CS1 Oscillation)
16/37
Semiconductor Measuring circuit 5
(CROSC1)
RS1 CS1 CS0 RT1 RI1 RI0
MSM64P164
(CROSC0)
RS0 CT0 RT0-1
RT1 RS1 CS1 IN1
Oscillation Mode Specified
IN0 CS0 RS0
CRT0
RT0
RESET TST1 TST2 P0.0 P0.1 P0.2 P0.3 VSS VDD VDD1 D. U. T. P4.3 Frequency Measurement (fOSCX)
RT0, RT0-1, RT1 = 2 kW/10 kW/200 kW RS0, RS1 = 10 kW RI0, RI1 = 10 kW CS0, CT0, CS1 = 820 pF
RT0
17/37
Semiconductor AC Characteristics (Serial Interface)
MSM64P164
(VSS = 0 V, VDD1 = 1.5 V, VDD = 5 V, Ta = 0 to +65C) Parameter SCLK Input Fall Time SCLK Input Rise Time SCLK Input "L" Level Pulse Width SCLK Input "H" Level Pulse Width SCLK Input Cycle Time SCLK Output Cycle Time SCLK Output Cycle Time SOUT Output Delay Time SIN Input Setup Time SIN Input Hold TIme Symbol tf tr tCWL tCWH tCYC Condition -- -- -- -- -- Min. -- -- 0.8 0.8 2.0 -- -- -- 0.5 0.8 Typ. Max. 15 15 -- -- -- 30.5 2.5 -- -- -- 50 50 -- -- -- -- -- 0.4 -- -- Unit ns ns ms ms ms ms ms ms ms ms
tCYC1(O) CPU is operating at 32.768 kHz. tCYC2(O) CPU is operating at 400 kHz. tDDR tDS tDH Cl = 10 pF -- --
tCYC SCLK (P4.2) tr tCWH tDDR SOUT (P4.0) tDDR 5V tf tCWL 5V
tDS SIN (P3.3)
tDH
tDS 5V
("H" level = 4 V, "L" level = 1 V)
18/37
Semiconductor
MSM64P164
ABSOLUTE MAXIMUM RATINGS (3.0 V Spec.)
Parameter Power Supply Voltage 1 Power Supply Voltage 2 Power Supply Voltage 3 Power Supply Voltage 4 Input Voltage 1 Input Voltage 2 Output Voltage 1 Output Voltage 2 Output Voltage 3 Storage Temperature Symbol VDD1 VDD2 VDD3 VDD VIN1 VIN2 VOUT1 VOUT2 VOUT3 TSTG Condition Ta = 25C Ta = 25C Ta = 25C Ta = 25C VDD2 input, Ta = 25C VDD input, Ta = 25C VDD2 output, Ta = 25C VDD3 output Ta = 25C VDD output, Ta = 25C -- Rating -0.3 to +2.0 -0.3 to +4.0 -0.3 to +5.5 -0.3 to +5.5 -0.3 to VDD2 + 0.3 -0.3 to VDD + 0.3 -0.3 to VDD2 + 0.3 -0.3 to VDD3 + 0.3 -0.3 to VDD + 0.3 -55 to +150 (VSS = 0 V) Unit V V V V V V V V V C
RECOMMENDED OPERATING CONDITIONS (3.0 V Spec.)
Parameter Operating Temperature Operating Voltage External 400kHz RC Oscillator Resistance Crystal Oscillation Frequency Symbol Top VDD2 VDD ROS fXT Condition -- -- -- -- -- Range 0 to +65 2.7 to 3.5 VDD2 to 5.25 90 to 500 30 to 66
(VSS = 0 V) Unit C V V kW kHz
19/37
Semiconductor
MSM64P164
ELECTRICAL CHARACTERISTICS (3.0 V Spec.)
DC Characteristics
(VSS = 0 V, VDD2 = VDD = 3.0 V, Ta = 0 to +65C unless otherwise specified) Condition +100% -20% +100% -20% Min. Typ. Max. Unit
Measuring Circuit
Parameter
Symbol
VDD1 Voltage VDD3 Voltage Crystal Oscillation Start Voltage Crystal Oscillation Hold Voltage Crystal Oscillation Stop Detection Time Internal Crystal Oscillator Capacitance External Crystal Oscillator Capacitance Internal Crystal Oscillator Capacitance Internal 400k RC Oscillator Capacitance 400k RC Oscillation Frequency POR Generation Voltage POR Non-generation Voltage
VDD1 VDD3 VSTA VHOLD TSTOP CG CGEX CD COS fOSC VPOR1 VPOR2
Ca, Cb, C12 = 0.1 mF Ca, Cb, C12 = 0.1 mF Oscillation start time: within 5 seconds -- -- -- When external CG used -- --
1.3 4.3 2.7 2.7 0.1 10 10 10 8 300 0 2.7
1.5 4.5 -- -- -- 15 -- 15 12 400 -- --
1.7 4.7 -- -- 1000 20 30 20 16 620 0.7 3
V V V V ms pF
1
pF pF pF kHz V V
External resistor ROS = 100 kW VDD2 = 2.7 to 3.5 V When VDD2 is between VPOR1 and 3.0 V No POR when VDD2 is between VPOR2 and 3.0 V
Notes: 1. "POR" denotes Power On Reset. 2. "TSTOP" indicates that if the crystal oscillator stops over the value of TSTOP, the system reset occurs.
20/37
Semiconductor DC Characteristics (continued)
MSM64P164
(VSS = 0 V, VDD2 = VDD = 3.0 V, Ta = 0 to +65C unless otherwise specified) Parameter
Symbol
Condition CPU in halt state (400k RC oscillation halt) CPU in operating state (400k RC oscillation halt) CPU in operating state (400k RC oscillation in operation) Serial transfer, fSCK = 300 kHz, CPU in operating state (400k RC oscillation halt)
CPU in halt state (400k RC oscillation
Min.
Typ.
Max.
Unit
Measuring Circuit
Supply Current 1 Supply Current 2 Supply Current 3
IDD1 IDD2 IDD3
-- -- --
1.0 25 220
4.0 50 450
mA mA mA
Supply Current 4
IDD4
--
30
60
mA
1
RT0 = 10 kW
--
300
450
mA
Supply Current 5
IDD5
halt), RC oscillator for A/D converter is in operating state
RT0 = 2 kW
--
1300
2000
mA
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Semiconductor DC Characteristics (continued)
MSM64P164
(VSS = 0 V, VDD1 = 1.5 V, VDD2 = VDD = 3.0 V, VDD3 = 4.5 V, Ta = 0 to +65C unless otherwise specified) Parameter (Pin Name)
Symbol
Condition VOH1 = VDD - 0.5 V VOL1 = 0.5 V VDD = 5 V, VOL1 = 0.5 V VOH2 = VDD - 0.5 V VOL2 = 0.5 V VDD = 5 V, VOL2 = 0.5 V VOH3 = VDD2 - 0.7 V VOL3 = 0.7 V VOH4 = VDD2 - 0.1 V VOL4 = 0.1 V VOH5 = VDD - 0.5 V VOL5 = 0.5 V VDD = 5 V, VOL5S = 0.5 V VOH6 = VDD2 - 0.5 V VOL6 = 0.5 V VOH7 = VDD3 - 0.2 V (VDD3 level)
Min. -6.0 3.0 4.0 -6.0 0.7 1.0 -6.0 0.7 -2.5 0.7 -1.5 0.15 0.2 -6.0 0.7 -- 4.0 -- 4.0 -- 4.0 --
Typ. -2.0 8.0 12 -2.0 2.0 3.0 -2.0 2.0 -1.3 1.3 -0.6 0.6 0.7 -2.0 2.0 -- -- -- -- -- -- --
Max. -0.7 25 36 -0.7 6.0 9.0 -0.7 6.0 -0.7 2.5 -0.15 1.5 2.0 -0.7 6.0 -4.0 -- -4.0 -- -4.0 -- 0.3
Unit mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA
Measuring Circuit
IOH1 Output Current 1 (P1.0) Output Current 2 (P1.1 to P1.3) (P2.0 to P2.3) (P3.0 to P3.3) (P4.0 to P4.3) Output Current 3 (BD) Output Current 4 (RT0, RT1, RS0, RS1, CRT0, CS0, CS1) IOL1 IOL1S IOH2 IOL2 IOL2S IOH3 IOL3 IOH4 IOL4
IOH5 Output Current 5 (When L26 to L33 are IOL5 configured as output IOL5S ports) Output Current 6 (OSC2) IOH6 IOL6 IOH7 IOMH7 Output Current 7 (L0 to L33) IOMH7S IOML7 IOML7S IOL7 Output Leakage Current (P1.0 to P1.3) (P2.0 to P2.3) (P3.0 to P3.3) (P4.0 to P4.3) (RT0, RT1, RS0, RS1, CRT0, CS0, CS1) IOOH
2
VOMH7 = VDD2 + 0.2 V (VDD2 level) VOMH7S = VDD2 - 0.2 V (VDD2 level) VOML7 = VDD1 + 0.2 V (VDD1 level) VOML7S = VDD1 - 0.2 V (VDD1 level) VOL7 = 0.2 V VOH = VDD2 (VSS level)
IOOL
VOL = VSS
-0.3
--
--
mA
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Semiconductor DC Characteristics (continued)
MSM64P164
(VSS = 0 V, VDD1 = 1.5 V, VDD2 = VDD = 3.0 V, VDD3 = 4.5 V, Ta = 0 to +65C unless otherwise specified) Parameter (Pin Name)
Symbol
Condition VIH1 = VDD (when pulled down) VIL1 = VSS (when pulled up) VIH1 = VDD = 5 V (when pulled down)
Min. 30 -300 80
Typ. 90 -90 250 -250 -- -- 90 -- -- -110 -- -- -- -1.5 -- -- -- -- -- -- -- --
Max. 300 -30 800 -80 1.0 0 300 1.0 0 -10 1.0 0 1.0 -0.75 3.0 0.6 5.0 1.0 3.0 0.6 3.0 0.6
Unit mA mA mA mA mA mA mA mA mA mA mA mA mA mA V V V V V V V V
Measuring Circuit
IIH1 Input Current 1 (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3) (P4.0 to P4.3) IIL1 IIH1S IIL1S IIH1Z IIL1Z IIH2 Input Current 2 (IN0, IN1) IIH2Z IIL2Z IIL3 Input Current 3 (OSC1) IIH3Z IIL3Z Input Current 4 (RESET, TST1, TST2) Input Voltage 1 (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3) (P4.0 to P4.3) Input Voltage 2 (IN0, IN1, OSC1) Input Voltage 3 (RESET, TST1, TST2) IIH4 IIL4 VIH1 VIL1 VIH1S VIL1S VIH2 VIL2 VIH3 VIL3
VIL1 = VSS, VDD = 5 V (when pulled up) -800
VIH1 = VDD (in a high impedance state) VIL1 = VSS (in a high impedance state) VIH2 = VDD2 (when pulled down) VIH2 = VDD2 (in a high impedance state) VIL2 = VSS2 (in a high impedance state) VIL3 = VSS (when pulled up) VIH3 = VDD2 (in a high impedance state) VIL3 = VSS (in a high impedance state) VIH4 = VDD2 VIL4 = VSS -- -- VDD = 5 V VDD = 5 V -- -- -- --
0 -1.0 30 0 -1.0 -300 0 -1.0 0 -3.0 2.4 0 4.0 0 2.4 0 2.4 0
3
4
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Semiconductor DC Characteristics (continued)
MSM64P164
(VSS = 0 V, VDD1 = 1.5 V, VDD2 = VDD = 3.0 V, VDD3 = 4.5 V, Ta = 0 to +65C unless otherwise specified) Parameter (Pin Name) Hysteresis Width (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3) (P4.0 to P4.3) Hysteresis Width (RESET, TST1, TST2) Input Pin Capacitance (P0.0 to P0.3) (P2.0 to P2.3) (P3.0 to P3.3) (P4.0 to P4.3)
Symbol
Condition
Min.
Typ.
Max.
Unit
Measuring Circuit
DVT1 DVT1S DVT2 VDD = 5 V
--
0.2 0.25
0.5 1.0
1.0 1.5
V V 4
--
0.2
0.5
1.0
V
CIN
--
--
--
5.0
pF
1
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Semiconductor Measuring circuit 1
MSM64P164
RT0
CS0
RI0
RT0 OSC1 ROS OSC2
CS0
IN0
XT Crystal 32.768 kHz XT C1 C2 C12
VSS
VDD2 VDD1
VDD3
VDD Ca, Cb, C12 ROS RT0 CS0 RI0 : 0.1 mF : 100 kW : 10 kW/2 kW : 820 pF : 10 kW
A
Ca V
Cb V
Measuring circuit 2
(*2)
OUTPUT
(*1) VIL
INPUT
VIH
A
VSS
VDD1
VDD2
VDD3
VDD
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Semiconductor Measuring circuit 3
OUTPUT INPUT
VSS VDD1 VDD2 VDD3 VDD (*3) A
MSM64P164
Measuring circuit 4
OUTPUT
VIH (*3) VIL
Waveform Monitoring
INPUT
VSS
VDD1
VDD2
VDD3
VDD
*1 Input logic circuit to determine the specified measuring conditions. *2 Measured at the specified output pins. *3 Measured at the specified input pins.
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Semiconductor A/D Converter Characteristics
MSM64P164
(VSS = 0 V, VDD2 = VDD = 3.0 V, Ta = 0 to +65C unless otherwise specified) Parameter Symbol RS0, RS1, RT0, RT0-1, RT1 RI0, RI1 fOSC1 Oscillation Frequency fOSC2 fOSC3 RS*RT Oscillation Frequency Ratio (*) Kf1 Kf2 Kf3 Condition Min. Typ. Max. Unit
Measuring Circuit
Resistor for Oscillation
CS0, CT0, CS1 740 pF
1.0
--
--
kW
Input Current Limiting Resistor
-- Resistor for oscillation = 2 kW Resistor for oscillation = 10 kW Resistor for oscillation = 200 kW RT0, RT0-1, RT1 = 2 kW RT0, RT0-1, RT1 = 10 kW RT0, RT0-1, RT1 = 200 kW
1.0 200 46.5 2.79 4.115 0.990
10 239 55.4 3.32 4.22 1.0
-- 277 64.3 3.85 4.326 1.010
kW 5 kHz kHz kHz -- -- --
0.0573 0.0616 0.0659
*
Kfx is the ratio of the oscillation frequency by a sensor resistor to the oscillation frequency by a reference resistor in the same condition.
fOSCX (RT0-CS0 Oscillation) fOSCX (RS0-CS0 Oscillation) , (x = 1, 2, 3) fOSCX (RT0-1-CS0 Oscillation) fOSCX (RS0-CS0 Oscillation) fOSCX (RT1-CS1 Oscillation) , fOSCX (RS1-CS1 Oscillation)
Kfx =
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Semiconductor Measuring circuit 5
(CROSC1) (CROSC0)
MSM64P164
RS1
RS0
CS1
CS0
RT1
RI1
RI0
CT0
RT0-1
CRT0
RT1 RS1 CS1 IN1
IN0 CS0 RS0
RT0
Oscillation Mode Specified
RESET TST1 TST2 P0.0 P0.1 P0.2 P0.3 VSS VDD VDD2 D. U. T. P4.3 Frequency Measurement (fOSCX)
RT0, RT0-1, RT1 = 2 kW/10 kW/200 kW RS0, RS1 = 10 kW RI0, RI1 = 10 kW CS0, CT0, CS1 = 820 pF
RT0
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Semiconductor AC Characteristics (Serial Interface)
MSM64P164
(VSS = 0 V, VDD2 = 3 V, VDD = 5 V, Ta = 0 to +65C) Parameter SCLK Input Fall Time SCLK Input Rise Time SCLK Input "L" Level Pulse Width SCLK Input "H" Level Pulse Width SCLK Input Cycle Time SCLK Output Cycle Time SCLK Output Cycle Time SOUT Output Delay Time SIN Input Setup Time SIN Input Hold TIme Symbol tf tr tCWL tCWH tCYC Condition -- -- -- -- -- Min. -- -- 0.8 0.8 2.0 -- -- -- 0.5 0.8 Typ. Max. 15 15 -- -- -- 30.5 2.5 -- -- -- 50 50 -- -- -- -- -- 0.4 -- -- Unit ns ns ms ms ms ms ms ms ms ms
tCYC1(O) CPU is operating at 32.768 kHz. tCYC2(O) CPU is operating at 400 kHz. tDDR tDS tDH
tCYC
Cl = 10 pF -- --
SCLK (P4.2) tr tCWH tDDR SOUT (P4.0) tDDR tf tCWL
5V
5V
tDS SIN (P3.3)
tDH
tDS 5V
("H" level = 4 V, "L" level = 1 V)
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Semiconductor
MSM64P164
ABSOLUTE MAXIMUM RATINGS (1.5 V/3.0 V Spec., PROM Mode)
Parameter PROM Power Supply Voltage Program Voltage PROM Input Voltage PROM Output Voltage Storage Temperature Symbol VCC VPP VI VO TSTG Condition VCC = VDD1 = VDD2, Ta = 25C Ta = 25C VCC input, Ta = 25C VCC output, Ta = 25C -- Rating -0.3 to +6.7 -0.3 to +14.0 -0.3 to VCC + 0.3 -0.3 to VCC + 0.3 -55 to +150 (VSS = 0 V) Unit V V V V C
RECOMMENDED OPERATING CONDITIONS (1.5 V/3.0 V Spec., PROM Mode)
(VSS = 0 V) Parameter Operating Temperature VCC Power Supply Voltage VPP Power Supply Voltage Input Voltage Symbol Top VCC VPP VIH VIL Condition -- VCC = VDD1 = VDD2 During read During write VCC = VDD1 = VDD2 -- Range 0 to 65 4.75 to 5.25 4.75 to 5.25 12.0 to 13.0 4 to VCC 0 to 1 Unit C V V V V V
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Semiconductor
MSM64P164
ELECTRICAL CHARACTERISTICS (1.5 V/3.0 V Spec., PROM Mode)
(1) Read Operation DC Characteristics
(VDD1 = VDD2 = VPP = 5 V 5%, Ta = 25C 5C, unless otherwise specified) Parameter VCC Power Supply Current (Standby) VCC Power Supply Current (Operating) Input Voltage Symbol ICC1 ICC2 VIH VIL IOH IOL VCC = VDD1 = VDD2 VOH = VCC - 0.5 V VOL = 0.5 V CE = VIH VCC = VDD1 = VDD2 CE = VIL VCC = VDD1 = VDD2 -- Condition VCC = VDD1 = VDD2 Min. Typ. Max. Unit -- -- 4.0 0 -- -- -- -- 35 100 VCC 1.0 mA mA V V mA mA
Output Current
-2.0 -0.7 -0.2 0.2 0.7 2.0
AC Characteristics
Parameter Address Access Time CE Access Time OE Access Time Output Disable Time Symbol tACC tCE tOE tDF (VCC = 5 V 5%, VPP = VCC, Ta = 25C 5C, unless otherwise specified) Min. Typ. Max. Unit Condition OE = CE = VIL OE = VIL CE = VIL CE = VIL -- -- -- 0 -- -- -- -- 120 120 50 40 ns ns ns ns
Measurement conditions: Input pulse level ...................... 0.45 V to 4.55 V Input rise/fall time ................. 5 ns Threshold level ........................ input 0.8 V, 2 V/output 0.8 V, 2 V
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Semiconductor
MSM64P164
Address Input
CE
tCE
OE
tACC
Data Output
tOE
tDF
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Semiconductor (2) Write Operation DC Characteristics
Parameter VPP Power Supply Current VCC Power Supply Current Input Voltage
MSM64P164
(VSS = 0 V, VDD1 = VDD2 = 5 V 5%, VPP = 12.5 V 0.5 V, Ta = 25C 5C, unless otherwise specified) Min. Typ. Max. Unit Symbol Condition IPP ICC VIH VIL IOH IOL VCC = VDD1 = VDD2 VOH = VCC - 0.5 V VOL = 0.5 V CE = VIL VCC = VDD1 = VDD2 VCC = VDD1 = VDD2 -- -- -- 4.0 0 -- -- -- -- 50 100 VCC 1.0 mA mA V V mA mA
Output Current
-2.0 -0.7 -0.2 0.2 0.7 2.0
AC Characteristics
(VSS = 0 V, VDD1 = VDD2 = 5 V 5%, VPP = 12.5 V 0.5 V, Ta = 25C 5C, unless otherwise specified) Min. Typ. Max. Unit Symbol Condition Parameter Address Setup Time OE Setup Time Data Setup Time Address Hold Time Data Hold Time OE Output Floating Delay Time VPP Power Source Setup Time Initial Program Pulse Width Additional Program Pulse Width OE Output Effective Delay Time tAS tOES tDS tAH tDH tDFP tVS tPW tOPW tOE VDD1 = VDD2 6 V 0.25 V VDD1 = VDD2 6 V 0.25 V -- -- -- -- -- -- -- -- 2.0 2.0 2.0 0 2.0 0 2.0 -- -- -- -- -- -- -- -- -- -- -- -- 130 -- 1.05 ms ms ms ms ms ns ms ms
0.95 1.0 2.85 --
-- 78.75 ms -- 150 ns
Measurement conditions: Input pulse level ...................... 0.45 V to 4.55 V Input rise/fall time ................. less than 20 ns Threshold level ........................ input 0.8 V, 2 V/output 0.8 V, 2 V
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Semiconductor
MSM64P164
Address Input tAS Data Input-Output tDS VPP tVS Data Input tDH
Address N tAH Data Output tOE tDFP
CE tPW tOPW OE tOES
34/37
Semiconductor
APPLICATION CIRCUITS
LCD
ROS Crystal 32.768 kHz
OSC2 OSC1 VSS XT XT RESET P1.0 P1.1 P1.2 P1.3 P0.0 P0.1 P0.2 P0.3
L33
L0 VSS C2 C1 C12 VDD3 Cb VDD2 Ca VDD VDD1 VPP TST2 TST1
1.5 V Spec. Application Circuit
C1
MSM64P164-xxx (1.5 V spec.)
* 1.5 V
Switch matrix (4 4)
RT0 RT1 RS1 CS1 RI1 RS0 CS0 RI0
* Without 5 V interface * Temperature measurement by two thermistors * CG of crystal oscillator : Internal * Polarity is reversed when compared to mask ROM version of this device.
IN0 CS0 RS0 CRT0 RT0 IN1 CS1 RS1 RT1 BD P4.3 P4.2 P4.1 P4.0 P3.3
Buzzer
MSM64P164
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Semiconductor
APPLICATION CIRCUITS (continued)
LCD
ROS Crystal 32.768 kHz CGEX
OSC2 OSC1 VSS XT XT RESET P1.0 P1.1 P1.2 P1.3 P0.0 P0.1 P0.2 P0.3
L33
L0 VSS C2 C1 C12 VDD3 Cb VDD2 VDD VDD1 VPP TST2 TST1
C2
*
3V
*
5V CS
MSM64P164-xxx (3 V spec.)
3.0 V Spec. Application Circuit
Ca
Switch matrix (4 4)
RT0 RT1 RS1 CS1 RI1 RS0 CS0 RI0
* With 5 V interface * Temperature measurement by two thermistors * CGEX of crystal oscillator : External * Polarity is reversed when compared to mask ROM version of this device.
IN0 CS0 RS0 CRT0 RT0 IN1 CS1 RS1 RT1 BD P4.3 P4.2 P4.1 P4.0 P3.3
Buzzer
MSM64P164
OSC monitor SCLK SPR To the serial communication interface SOUT (5 V (VDD) system) SIN
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Semiconductor
MSM64P164
PACKAGE DIMENSIONS
(Unit : mm)
QFP80-P-1420-0.80-BK
Mirror finish
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 1.27 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
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