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DISCRETE SEMICONDUCTORS DATA SHEET PMEG2015EA Low VF (MEGA) Schottky barrier diode Product specification Supersedes data of 2003 May 20 2004 Feb 03 Philips Semiconductors Product specification Low VF (MEGA) Schottky barrier diode FEATURES * Forward current: 1.5 A * Reverse voltage: 20 V * Ultra high-speed switching * Very low forward voltage * Very small plastic SMD package. APPLICATIONS * Ultra high-speed switching * Voltage clamping * Protection circuits. DESCRIPTION Planar Maximum Efficiency General Application (MEGA) Schottky barrier diode with an integrated guard ring for stress protection, encapsulated in a SOD323 (SC-76) very small SMD plastic package. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME PMEG2015EA - DESCRIPTION plastic surface mounted package; 2 leads Marking code: S5. The marking bar indicates the cathode. Top view 1 2 PMEG2015EA PINNING PIN 1 2 DESCRIPTION cathode anode 1 2 sym001 Fig.1 Simplified outline (SOD323; SC-76) and symbol. VERSION SOD323 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VR IF IFSM IFRM Tstg Tj Tamb PARAMETER continuous reverse voltage continuous forward current non-repetitive peak forward current repetitive peak forward current storage temperature junction temperature operating ambient temperature Ts < 55 C tp = 8 ms square wave tp = 1 ms; = 0.25 CONDITIONS - - - - -65 - -65 MIN. MAX. 20 1.5 10 4.5 +150 125 +125 V A A A C C C UNIT 2004 Feb 03 2 Philips Semiconductors Product specification Low VF (MEGA) Schottky barrier diode CHARACTERISTICS Tamb = 25 C unless otherwise specified. SYMBOL VF PARAMETER continuous forward voltage CONDITIONS see Fig.2; note 1 IF = 10 mA IF = 100 mA IF = 1000 mA IF = 1500 mA IR continuous reverse current see Fig.3; note 1 VR = 5 V VR = 8 V VR = 15 V Cd Note 1. Pulse test: tp = 300 s; = 0.02. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) Rth(j-s) Notes 1. Refer to SC-76 (SOD323) standard mounting conditions. 2. Device mounted on a printed-circuit board with copper clad 10 x 10 mm. 3. Soldering point of cathode tab. PARAMETER thermal resistance from junction to ambient thermal resistance from junction to solder point note 1 note 2 note 3 CONDITIONS diode capacitance VR = 5 V; f = 1 MHz; see Fig.4 5 7 10 19 240 300 480 560 PMEG2015EA TYP. MAX. 270 350 550 660 10 20 50 25 UNIT mV mV mV mV A A A pF VALUE 450 210 90 UNIT K/W K/W K/W 2004 Feb 03 3 Philips Semiconductors Product specification Low VF (MEGA) Schottky barrier diode GRAPHICAL DATA PMEG2015EA 104 handbook, halfpage IF (mA) MLE111 105 handbook, halfpage IR (A) (1) MHC312 103 104 102 (1) (2) (3) 103 (2) 10 102 (3) 1 10 10-1 0 0.2 0.4 VF (V) 0.6 1 0 5 10 15 20 VR (V) 25 (1) Tamb = 125 C. (2) Tamb = 85 C. (3) Tamb = 25 C. (1) Tamb = 125 C. (2) Tamb = 85 C. (3) Tamb = 25 C. Fig.2 Forward current as a function of forward voltage; typical values. Fig.3 Reverse current as a function of reverse voltage; typical values. handbook, halfpage 80 MHC313 Cd (pF) 60 40 20 0 0 5 10 15 VR (V) 20 Tamb = 25 C; f = 1 MHz. Fig.4 Diode capacitance as a function of reverse voltage; typical values. 2004 Feb 03 4 Philips Semiconductors Product specification Low VF (MEGA) Schottky barrier diode PACKAGE OUTLINE Plastic surface mounted package; 2 leads PMEG2015EA SOD323 D A E X HD v M A Q 1 2 bp A A1 (1) c Lp detail X 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.8 A1 max 0.05 bp 0.40 0.25 c 0.25 0.10 D 1.8 1.6 E 1.35 1.15 HD 2.7 2.3 Lp 0.45 0.15 Q 0.25 0.15 v 0.2 Note 1. The marking bar indicates the cathode OUTLINE VERSION SOD323 REFERENCES IEC JEDEC JEITA SC-76 EUROPEAN PROJECTION ISSUE DATE 99-09-13 03-12-17 2004 Feb 03 5 Philips Semiconductors Product specification Low VF (MEGA) Schottky barrier diode DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development DEFINITION PMEG2015EA This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). II Preliminary data Qualification III Product data Production Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 2004 Feb 03 6 Philips Semiconductors - a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. (c) Koninklijke Philips Electronics N.V. 2004 SCA76 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R76/02/pp7 Date of release: 2004 Feb 03 Document order number: 9397 750 12628 |
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