View SA56202_394443.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

SA56202
One-chip motor driver
Rev. 01 -- 19 July 2004 Preliminary data sheet
1. General description
The SA56202 is a one-chip motor driver IC that is capable to drive all motors of CD or DVD systems: spindle, sled and loading motors and actuators on the optical pick-up unit. The driver intended for the 3-phase, brushless, Hall-commutated spindle motor uses True-Silent PWM. This proprietary technology ensures that all 3-phase motor currents are sinusoidal resulting in an optimally silent driver. Internal regeneration of the back-EMF of the spindle motor enables the driver to operate in current-steering mode without using external power-dissipating sense resistors. The driver intended for the 2-phase sled stepper motor operates in current-steering PWM mode. In addition the IC contains four full-bridge linear channels that can be used to drive a loading motor and 3D actuators (focus, tracking and tilt). The SA56202 is available in an exposed die pad HTSSOP56 package.
2. Features
s True-Silent PWM spindle motor driver s Low heat generation due to power-efficient direct full-bridge switching of spindle motor driver s Controlled spindle motor current during acceleration and brake s Reverse torque brake function (full bridge) s Adjustable spindle motor current limiter s Internal regeneration for EMF of spindle motor s Current-steering PWM controlled stepper motor driver for sled s Four class-AB linear channels for loading motor and 3D actuators (focus, tracking and tilt) s Low on-resistance D-MOSFET output power stages s Built-in thermal shutdown, thermal warning and temperature diode s Interfaces to 3 V and 5 V logic s Package with low thermal resistance to heatsink (reflowable die pad).
3. Applications
s s s s DVD+RW, DVD-RW, DVD-ROM and DVD-RAM Combi CD-ROM and CD-RW Other compact disk media.
Philips Semiconductors
SA56202
One-chip motor driver
4. Ordering information
Table 1: Ordering information Package Name SA56202TW Description Version SOT793-1 HTSSOP56 plastic thermal enhanced thin shrink small outline package; 56 leads; body width 6.1 mm; exposed die pad Type number
9397 750 12772
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 01 -- 19 July 2004
2 of 24
Philips Semiconductors
SA56202
One-chip motor driver
5. Block diagram
HU+ HU- HV+ HV- HW+ HW-
1 2 3 4 5 6 HALL AMP
REVERSE DETECTION
OSCILLATOR
56 55
COSC DIODE
FG
THERMAL SHUTDOWN
54 53 52 51 50 49
VSS(DIO) VINLD VINFCS VINTRK VINTLT VDD(LD) LDO+ LDO- FCSO+ FCSO- VSS(LIN) VDD(ACT) TRKO+ TRKO- TLTO+ TLTO- RSLD1 SLDO1+ SLDO1- RSLD2 SLDO2+ SLDO2- VDD(SLD) VSSA VINSLD2
HBIAS
7
HALL BIAS VINREF CURRENT REFERENCE VINREF
48 LEVEL SHIFT 47 46 LEVEL SHIFT 45 44 43 42 LEVEL SHIFT
RREF REMF RLIM VSS1(SPN) U VDD1(SPN) V VSS2(SPN) W VDD2(SPN) FG VSSD VINSPN VINREF VDDA
8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 ADC VINREF FG SPINDLE LOGIC
VINREF
41 40
VINREF
LEVEL SHIFT
39 38 37 36
SLED LOGIC
35 34 33
CP1 CP2 CP3
23 24 25 CHARGE PUMP
47 k
32 31 30
CTL1 CTL2 TEMP
26 27 28
MUTE/ STANDBY FUNCTIONS
VINREF
47 k
29
VINSLD1
SA56202
VINREF
001aaa429
Fig 1. Block diagram.
9397 750 12772
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 01 -- 19 July 2004
3 of 24
Philips Semiconductors
SA56202
One-chip motor driver
6. Pinning information
6.1 Pinning
HU+ 1 HU- 2 HV+ 3 HV- 4 HW+ 5 HW- 6 HBIAS 7 RREF 8 REMF 9 RLIM 10 VSS1(SPN) 11 U 12 VDD1(SPN) 13 V 14 VSS2(SPN) 15 W 16 VDD2(SPN) 17 FG 18 VSSD 19 VINSPN 20 VINREF 21 VDDA 22 CP1 23 CP2 24 CP3 25 CTL1 26 CTL2 27 TEMP 28
001aaa458
56 COSC 55 DIODE 54 VSS(DIO) 53 VINLD 52 VINFCS 51 VINTRK 50 VINTLT 49 VDD(LD) 48 LDO+ 47 LDO- 46 FCSO+ 45 FCSO- 44 VSS(LIN) 43 VDD(ACT) 42 TRKO+ 41 TRKO- 40 TLTO+ 39 TLTO- 38 RSLD1 37 SLDO1+ 36 SLDO1- 35 RSLD2 34 SLDO2+ 33 SLDO2- 32 VDD(SLD) 31 VSSA 30 VINSLD2 29 VINSLD1
SA56202TW
Fig 2. Pin configuration.
6.2 Pin description
Table 2: Symbol HU+ HU- HV+ HV- HW+ HW- HBIAS RREF
9397 750 12772
Pin description Pin 1 2 3 4 5 6 7 8 Description Hall input U positive Hall input U negative Hall input V positive Hall input V negative Hall input W positive Hall input W negative Hall element bias external resistor for current reference
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 01 -- 19 July 2004
4 of 24
Philips Semiconductors
SA56202
One-chip motor driver
Pin description ...continued Pin 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 Description external resistor for EMF regeneration external resistor for current limit spindle driver ground 1 spindle driver output U spindle driver supply voltage 1 spindle driver output V spindle driver ground 2 spindle driver output W spindle driver supply voltage 2 frequency generator output digital ground spindle driver input voltage for spindle motor current reference input voltage for all motor drivers analog supply voltage charge pump capacitor connection 1 charge pump capacitor connection 2 charge pump capacitor connection 3 driver logic control input 1 driver logic control input 2 thermal warning sled driver 1 input voltage for sled motor current sled driver 2 input voltage for sled motor current analog ground sled driver supply voltage sled driver output 2 negative sled driver output 2 positive external sense resistor for sled driver 2 current sense sled driver output 1 negative sled driver output 1 positive external sense resistor for sled driver 1 current sense tilting driver output negative tilting driver output positive tracking driver output negative tracking driver output positive actuator drivers supply voltage linear drivers ground focus driver output negative focus driver output positive loading driver output negative loading driver output positive loading driver supply voltage
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Table 2: Symbol REMF RLIM VSS1(SPN) U VDD1(SPN) V VSS2(SPN) W VDD2(SPN) FG VSSD VINSPN VINREF VDDA CP1 CP2 CP3 CTL1 CTL2 TEMP VINSLD1 VINSLD2 VSSA VDD(SLD) SLD2O- SLDO2+ RSLD2 SLDO1- SLDO1+ RSLD1 TLTO- TLTO+ TRKO- TRKO+ VDD(ACT) VSS(LIN) FCSO- FCSO+ LDO- LDO+ VDD(LD)
9397 750 12772
Preliminary data sheet
Rev. 01 -- 19 July 2004
5 of 24
Philips Semiconductors
SA56202
One-chip motor driver
Pin description ...continued Pin 50 51 52 53 54 55 56 Description tilting driver input for tilt actuator voltage tracking driver input for tracking actuator voltage focus driver input for focus actuator voltage loading driver input for loading motor voltage temperature diode ground diode for temperature readout external capacitor for internal oscillator
Table 2: Symbol VINTLT VINTRK VINFCS VINLD VSS(DIO) DIODE COSC
7. Functional description
7.1 Spindle motor control
The control input voltage on pin VINSPN is converted into a digital value by the ADC where the voltage on pin VINREF is the midpoint reference. The transconductance gain from input voltage VVINSPN to output motor current IMOT is: I MOT I LIM g m(SPN ) = ------------------------------------------------ = -------------------V VINSPN - V VINREF V VINREF where ILIM can be programmed by means of external resistor RLIM; see Section 7.4. The motor current is described by Figure 3.
ILIM
IMOT forward torque 0 reverse torque brake VVINREF 2VVINREF
-ILIM
VVINSPN
001aaa431
Fig 3. Spindle motor current as a function of control input voltage on pin VINSPN.
For VINSPN voltages larger than VVINREF the motor will accelerate with forward torque control. For VINSPN voltages smaller than VVINREF the motor will brake with reverse torque control. Because the U, V and W half-bridges of the spindle motor driver use a direct PWM full-bridge switching scheme, the motor current can also be controlled and limited during brake. Note that because of this active brake mechanism energy of the motor can be recuperated back to the supply. Especially at large speeds, this can result in currents delivered back to the supply. If the supply and/or other circuits than the motor
9397 750 12772
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 01 -- 19 July 2004
6 of 24
Philips Semiconductors
SA56202
One-chip motor driver
driver do not use this recuperated current, than the supply voltage can possibly rise to unacceptable values. In that case it is recommended to lower the spindle current during brake by means of the VINSPN setting. Upon detection of reverse detection all U, V and W driver outputs are connected to VDD(SPN). This short brake prevents the motor of spinning backwards.
7.2 Internal regeneration of back-EMF spindle motor
The spindle motor driver uses the information from the Hall sensors to internally regenerate the back-EMF of the motor. See Figure 4.
ANALOG DOMAIN VINSPN torque control signal RLIM maximum motor current REMF motor k-factor DIGITAL DOMAIN A D VEMF = x k A D SPEED Hall U Hall V Hall W VRI = Rm x Im VMOT = VRI + VEMF PWM U V W spindle motor
A D
001aaa438
Fig 4. Regeneration of back-EMF voltage spindle motor.
Rotational speed is derived from the Hall event frequency. Multiplying with the k-factor of the motor gives the back-EMF voltage VEMF. This VEMF is added to the current-limit scaled spindle input voltage VVINSPN. This sum VMOT steers the PWM outputs U, V and W. The result is that the input voltage VVINSPN sets the current through the motor. This explains how the SA56202 spindle motor driver exhibits a current control transfer function without using external sense resistors. The simplified motor schematic in Figure 5 shows the series resistance and back-EMF voltage of the motor.
VM1
VRM VEMF
2
VEMF
2
VRM
VM2
001aaa450
Fig 5. Simplified spindle motor schematic.
9397 750 12772 (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 01 -- 19 July 2004
7 of 24
Philips Semiconductors
SA56202
One-chip motor driver
Figure 6 depicts the motor voltages VM1 and VM2 during accelerating and braking. The back-EMF voltage is part of these motor voltages.
VDD(SPN)
VM1
VRM
VEMF 2 VM2
VDD(SPN) 2 0
k
VEMF 2
max
VRM
VM1
0
0 accelerating
VM2 braking
001aaa432
Fig 6. Motor voltages when accelerating and braking with constant motor current.
7.3 Sine generation using True-Silent signals
For the phase relation between the Hall inputs and the spindle outputs in forward rotation, see Figure 7. These are the signal shapes in sine mode using our True-Silent PWM technology. The particular shape of the 120 symmetrical U, V and W steering voltages are because of improved drive strength and improved power efficiency. The drive strength is improved because with this signal shape a 15 % larger sine can be fit within the supply rails compared to direct-written sine signals. Also the power efficiency is improved because this signal shape has 33 % less switching losses compared to a direct-written sine. The result is that the motor currents (and motor torques) are pure sine waves generated in such a way that the motor is driven optimally silent, optimally power efficient and with maximum driving strength.
9397 750 12772
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 01 -- 19 July 2004
8 of 24
Philips Semiconductors
SA56202
One-chip motor driver
HALL U
HALL W
HALL V
U(V)
U
U(I)
V(V)
V
V(I)
W(V)
W
W(I)
001aaa433
Fig 7. Phase relation between Hall input signals and spindle motor driver output voltages U(V), V(V), W(V) and motor currents U(I), V(I), W(I) in forward rotation mode.
7.4 Programming RLIM
If the supply is connected between the terminals of a non-running spindle motor, then usually a current will flow that is too large. The motor current can be limited to a value ILIM. This ILIM can be programmed by means of RLIM. In order to calculate the required RLIM first a typical maximum motor current IMAX needs to be determined: V DD ( SPN ) I MAX = ------------------------------------------R motor + R switches
9397 750 12772
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 01 -- 19 July 2004
9 of 24
Philips Semiconductors
SA56202
One-chip motor driver
ILIM can be chosen to be a fraction of this maximum current IMAX. By making the ratio between RLIM (connected to pin 10) and RREF (connected to pin 8) this same fraction, ILIM R LIM is programmed as expressed in the following formula: I LIM = ------------ x I MAX R REF I LIM So by choosing ILIM, RLIM needs to be: R LIM = ------------ x R REF I MAX Figure 8 shows the limit current as a function of RLIM with RREF = 47 k.
001aaa434
100 ILIM (% of IMAX) 80
60
40
20
0 0 10 20 30 40 50 R LIM (k)
Fig 8. Limit current ILIM as a function of external resistor RLIM.
During accelerating and braking the motor current will not exceed ILIM. ILIM also sets the transconductance gain ILIM/VVINREF of the spindle driver.
7.5 Programming REMF
The back-EMF voltage is internally regenerated. The ratio between REMF and RREF is used to scale the internal EMF regeneration. The value of external resistor REMF depends on the type of motor (k-factor and number of pole pairs NPP) and the motor supply voltage VDD(SPN). The following formula should be used to determine the REMF resistor: R EMF k x 2.6 x 10 x R REF = -------------------------------------------------- with k in units Nm/A. N PP x V DD ( SPN )
3
7.6 FG generator
The raw zero-crossings of the Hall sensors are first filtered and debounced before being passed to the FG generator. The FG generator toggles its output at every filtered Hall zero-crossing. For three Hall sensors this means that the motor frequency is linked to the FG FG frequency by: f motor = ------------------3 x N PP
9397 750 12772
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 01 -- 19 July 2004
10 of 24
Philips Semiconductors
SA56202
One-chip motor driver
where NPP indicates the number of pole pairs of the motor. FG has an open-drain output for easy interfacing to 3 V and 5 V logic.
7.7 Sled motor driver
Two current-steering PWM channels are available to drive a stepper motor. Per channel an external sense resistor Rsense is used that is connected to ground. A peak-current control loop is implemented that modulates the duty cycle of the PWM signal. See Figure 9.
47 k Rext
VINSLD
47 k
+
- VVINREF CLOCK 70 kHz
A
VVINREF input amplifier
R Q S
LOGIC DRIVE
DRIVER
M
IO
Rsense
001aaa435
Fig 9. Peak-current control architecture of stepper motor driver.
The clock generator has a nominal frequency of fosc/256 = 70 kHz. See Figure 10 for the transfer function from input voltage VVINSLD to output current at a typical Rsense of 0.5 . Input-to-output transconductance gain can be scaled down by connecting an external resistor Rext in series with the input VINSLD.
IOUT (A) 1A
dead zone VVINSLD - VVINREF (V) -30 mV +1 A/V -1 A
+1 A/V 30 mV
001aaa436
Fig 10. Transfer function of stepper motor driver.
Both limit current and transconductance gain are related to Rsense in the following way: Io 1 Transconductance gain, ------- = ----------------------2 x R sense V in 1V Limit current, I LIM = ----------------------2 x R sense
9397 750 12772 (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 01 -- 19 July 2004
11 of 24
Philips Semiconductors
SA56202
One-chip motor driver
7.8 Loading motor driver
One of the linear channels is available to drive a DC loading motor. Pin VDD(LD) is used to set the supply voltage for the loading motor driver. Figure 11 depicts the voltage-steering bridge topology of the SA56202.
188 k 47 k
LDO+
47 k
VINLD
188 k
R
VDD(LD)
188 k 47 k R
VINREF
47 k 188 k
LDO-
001aaa437
Fig 11. Voltage-steering bridge topology of linear driver.
7.9 Actuator motor drivers
Three linear channels are available to drive 3D actuators: focus, tracking and tilt. A pin VDD(ACT) is used to set the supply voltage for these actuator drivers. The voltage-steering bridge topology is the same as depicted in Figure 11. The mismatch of the voltage gain of these 3 linear channels is guaranteed to be less than 5 %.
7.10 Charge pump
The on-board charge pump generates a regulated voltage of typically 18.2 V by using the VDD(SPN) supply voltage. This boosted voltage is used to turn on the upper n-type DMOS transistors of the output stages of the spindle driver, sled driver, loading driver and actuator drivers. Recommended values for the pump-and-hold capacitor are 10 nF and 22 nF respectively (see also application diagram Figure 13). The charge pump should not be loaded with other components or circuitry than these capacitors.
7.11 Thermal protection
If the junction temperature of the SA56202 exceeds 150 C, then a thermal warning signal is given at pin TEMP. TEMP has an active-LOW open-drain output for easy interfacing to 3 V and 5 V logic. The temperature hysteresis for the thermal warning is 10 C. If the junction temperature of the IC rises to 160 C, then a thermal shutdown is activated that sets all power outputs in 3-state. The temperature hysteresis for the thermal shutdown is 30 C. As soon as the thermal shutdown deactivates at 130 C, all motor drivers continue normal operation.
9397 750 12772
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 01 -- 19 July 2004
12 of 24
Philips Semiconductors
SA56202
One-chip motor driver
7.12 Oscillator
The RC oscillator uses two external components (RREF and COSC) to fix its frequency at 18 MHz. RREF is used to generate a reference current. This reference current is used to charge and discharge COSC. The nominal oscillation frequency fosc is 18 MHz with RREF = 47 k (2 % tolerance) and COSC = 70 pF (5 % tolerance). These values are fixed. The oscillator can be overruled by applying an 18 MHz clock to pin COSC. The reference current derived from RREF is also used for RLIM and REMF. RREF should always be connected.
7.13 Muting functions
Pins CTL1 and CTL2 are used to mute certain parts of the IC. See Table 3. In this table off means 3-state.
Table 3: CTL1 L L H H Muting functions CTL2 L H L H Loading motor off on off off Sled motor Others off on on on off off on on Spindle mode off FG and Hall bias on block commutation True-Silent commutation
8. Limiting values
Table 4: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Voltages VDD(SPN) VDD(SLD) VDD(LD) VDD(ACT) VDDA Currents IDD(SPN) IDD(SLD) IDD(ACT) IHALL IHBIAS IRPROG IOD IDIG ICPUMP
9397 750 12772
Parameter spindle driver supply voltage sled driver supply voltage loading driver supply voltage actuator drivers supply voltage system supply voltage current on pins 12, 14 and 16 current on pins 33, 34, 35, 36, 37 and 38 current on pins 39, 40, 41, 42, 45, 46, 47 and 48 current on pins 1, 2, 3, 4, 5 and 6 current on pin 7 current on pins 8, 9 and 10 current on pins 18 and 28 current on pins 26 and 27 current on pins 23, 24 and 25
Conditions
Min -0.5 -0.5 -0.5 -0.5 -0.5 -1 -1 -1 -1 -1 -20
Max +16 +16 +16 +16 +6.5 2.1 1.2 2.0 +1 +100 +1 +10 +1 +20
Unit V V V V V A A A mA mA mA mA mA mA
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 01 -- 19 July 2004
13 of 24
Philips Semiconductors
SA56202
One-chip motor driver
Table 4: Limiting values ...continued In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol ISTEER IDIODE IOSC General Tstg Tamb Tj Vesd(HBM) storage temperature ambient temperature junction temperature human body model pins 1 to 6 and 8 to 56 pin 7 Vesd(MM)
[1] [2]
[1]
Parameter current on pins 20, 21, 29, 30, 50, 51, 52 and 28 current on pins 54 and 55 current on pin 56
Conditions
Min -1 -1 -20 -55 -40 -40
Max +1 +1 +20 +150 +85 +160
Unit mA mA mA C C C
Electrostatic discharge voltage [2]
1500 1000 150
V V V
machine model
-
Class 1, equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor. Class 1, equivalent to discharging a 200 pF capacitor through a 0.75 H coil and a 10 resistor.
9. Thermal characteristics
Table 5: Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient Conditions multilayer PCB, no airflow Typ 33 Unit K/W
4 PD (W) 3
001aaa428
2
1
0 0 50 100 Tamb (C) 150
Fig 12. Maximum dissipation as a function of ambient temperature.
9397 750 12772
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 01 -- 19 July 2004
14 of 24
Philips Semiconductors
SA56202
One-chip motor driver
10. Characteristics
Table 6: Characteristics Tamb = 25 C; VDDA = 5 V; VDD(SPN) = 12 V; VDD(SLD) = 12 V; VDD(ACT) = 5 V; VDD(LD) = 12 V; unless otherwise specified. Symbol VDDA VDD(SPN) VIO Vi Vi(dif)(p-p) VHBIAS fosc fPWM Rds(on) VVINREF VVINSPN Parameter system supply voltage motor supply voltage input offset voltage Hall amplifier input voltage range Hall amplifier Hall amplifier differential input voltage (peak-to-peak value) voltage on pin HBIAS oscillator frequency PWM frequency D-MOSFET on-resistance (high or low) reference voltage on pin VINREF torque control voltage on pin VINSPN supply voltage motor supply voltage motor current limit PWM frequency input dead-zone trip level transconductance gain D-MOSFET on-resistance (high or low) motor supply voltage current limit (high or low) output offset voltage voltage gain D-MOSFET on-resistance (high or low) supply voltage current limit (high or low) output offset voltage voltage gain gain mismatch between 3 channels Rsense = 0.5 Rsense = 0.5 RREF = 47 k; COSC = 70 pF IHBIAS = 32 mA RREF = 47 k; COSC = 70 pF RREF = 47 k; COSC = 70 pF Conditions Min 4.5 4.5 -3.5 0 25 1.2 0 Typ 5.0 12 0.6 18 70 0.35 1.65 Max 5.5 14 +3.5 VDDA 0.9 0.50 2.5 VDDA Unit V V mV V mV V MHz kHz V V Spindle motor driver
Stepper motor driver VDDA VDD(SLD) IDD(SLD) fPWM Vi(trip) gm Rds(on) 4.5 4.5 0.85 15 0.85 5.0 12 1.0 70 30 1.0 1.0 5.5 14 1.15 45 1.15 1.4 V V A kHz mV A/V
Loading motor driver VDD(LD) IDD(LD) VOO Gv Rds(on) 4.5 0.9 -100 16.8 12 1.2 0 17.6 0.6 14 2.0 +100 18.4 0.9 V A mV dB
Actuator driver (focus, tracking and tilt) VDD(ACT) IDD(ACT) VOO Gv Gv(m)
9397 750 12772
4.5 0.9 -55 16.8 -
5 1.2 0 17.6 -
14 2.0 +55 18.4 5
V A mV dB %
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 01 -- 19 July 2004
15 of 24
Philips Semiconductors
SA56202
One-chip motor driver
Table 6: Characteristics ...continued Tamb = 25 C; VDDA = 5 V; VDD(SPN) = 12 V; VDD(SLD) = 12 V; VDD(ACT) = 5 V; VDD(LD) = 12 V; unless otherwise specified. Symbol Rds(on) General VCP3 VIH VIL VOL IDDA(q) IDD(SPN)(q) IDD(SLD)(q) IDD(ACT)(q) ISTB(tot) TTEMP Thys(TEMP) TSD Thys(SD) charge pump output voltage HIGH-level input voltage digital on pins 26 and 27 LOW-level input voltage digital on pins 26 and 27 LOW-level output voltage digital on pins 18 and 28 VDDA quiescent current VDD(SPN) quiescent current VDD(SLD) quiescent current VDD(ACT) quiescent current total standby current thermal warning temperature thermal warning hysteresis thermal shutdown temperature thermal shutdown hysteresis IOL = 2 mA CTL1 = H; CTL2 = H CTL1 = H; CTL2 = H CTL1 = H; CTL2 = H CTL1 = H; CTL2 = H CTL1 = L; CTL2 = L 2.0 18.2 14 9 0 16 4.5 150 10 160 30 0.8 0.5 20 15 1 25 8 V V V V mA mA mA mA mA C C C C Parameter D-MOSFET on-resistance (high or low) Conditions Min Typ 0.6 Max 0.9 Unit
9397 750 12772
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 01 -- 19 July 2004
16 of 24
Philips Semiconductors
SA56202
One-chip motor driver
11. Application information
5V 150 HALL U 1 2 3 HALL V 4 5 HALL W 6 HALL AMP FG REVERSE DETECTION OSCILLATOR 56 55 THERMAL SHUTDOWN 70 pF 0V
54 53 52 51 50 49
0V tray motor in focus in tracking in tilt in 12 V M tray motor
0V
RREF 47 k REMF RLIM 0V
7
HALL BIAS VINREF CURRENT REFERENCE VINREF
48 LEVEL SHIFT 47 46 LEVEL SHIFT 45 44 43 42 LEVEL SHIFT 0V 5V tracking actuator focus actuator
8 9 10 11 12 spindle motor 12 V 13 14 0V 15 16 12 V 47 k 3.3 V 0V spindle input 1.65 V 5V 17 18 19 20 21 22 ADC VINREF FG SPINDLE LOGIC
VINREF
41 40
VINREF
LEVEL SHIFT
39 38 37 36 0.5
tilt actuator
0V sled motor M
SLED LOGIC
35 34 33
0.5
23 10 nF 22 nF 24 25 CHARGE PUMP
47 k
32 31 30
12 V 0V sled in2
26 MUTE/ SELECT 47 k 3.3 V 27
MUTE/ STANDBY FUNCTIONS
VINREF
47 k
29
sled in1
28
SA56202
VINREF
001aaa430
For REMF and RLIM see Section 7.
Fig 13. Application diagram.
9397 750 12772
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 01 -- 19 July 2004
17 of 24
Philips Semiconductors
SA56202
One-chip motor driver
12. Package outline
HTSSOP56: plastic thermal enhanced thin shrink small outline package; 56 leads; body width 6.1 mm; exposed die pad
SOT793-1
D
E
A X
c y exposed die pad HE vM A
Z
Dh
56
29
A A2 Eh pin 1 index A1 L detail X Lp
(A 3)
1
bp
28
wM
e
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.2 A1 0.15 0.05 A2 1.05 0.80 A3 0.25 bp 0.27 0.17 c 0.20 0.09 D (1) 14.1 13.9 Dh 4.3 4.1 E (2) 6.2 6.0 Eh 4.3 4.1 e 0.5 HE 8.3 7.9 L 1 Lp 0.8 0.4 v 0.2 w 0.08 y 0.1 Z (1) 0.4 0.1 8o o 0
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT793-1 REFERENCES IEC 143E36T JEDEC MO-153 JEITA EUROPEAN PROJECTION ISSUE DATE 03-03-04
Fig 14. Package outline.
9397 750 12772 (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 01 -- 19 July 2004
18 of 24
Philips Semiconductors
SA56202
One-chip motor driver
13. Soldering
13.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended.
13.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 C to 270 C depending on solder paste material. The top-surface temperature of the packages should preferably be kept:
* below 225 C (SnPb process) or below 245 C (Pb-free process)
- for all BGA, HTSSON..T and SSOP..T packages - for packages with a thickness 2.5 mm - for packages with a thickness < 2.5 mm and a volume 350 mm3 so called thick/large packages.
* below 240 C (SnPb process) or below 260 C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
13.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
* Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
* For packages with leads on two sides and a pitch (e):
- larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board;
9397 750 12772 (c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 01 -- 19 July 2004
19 of 24
Philips Semiconductors
SA56202
One-chip motor driver
- smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end.
* For packages with leads on four sides, the footprint must be placed at a 45 angle to
the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
13.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 C and 320 C.
13.5 Package related soldering information
Table 7: Package [1] BGA, HTSSON..T [3], LBGA, LFBGA, SQFP, SSOP..T [3], TFBGA, VFBGA, XSON DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC [5], SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP CWQCCN..L [8], PMFP [9], WQCCN..L [8]
[1] [2]
Suitability of surface mount IC packages for wave and reflow soldering methods Soldering method Wave not suitable not suitable [4] Reflow [2] suitable suitable
suitable not not recommended [5] [6] recommended [7]
suitable suitable suitable not suitable
not suitable
For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible.
[3]
9397 750 12772
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 01 -- 19 July 2004
20 of 24
Philips Semiconductors
SA56202
One-chip motor driver
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. Hot bar soldering or manual soldering is suitable for PMFP packages.
[5] [6] [7] [8]
[9]
9397 750 12772
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 01 -- 19 July 2004
21 of 24
Philips Semiconductors
SA56202
One-chip motor driver
14. Revision history
Table 8: Revision history Release date 20040719 Data sheet status Preliminary data sheet Change notice Order number 9397 750 12772 Supersedes Document ID SA56202_1
9397 750 12772
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 01 -- 19 July 2004
22 of 24
Philips Semiconductors
SA56202
One-chip motor driver
15. Data sheet status
Level I II Data sheet status [1] Objective data Preliminary data Product status [2] [3] Development Qualification Definition This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
III
Product data
Production
[1] [2] [3]
Please consult the most recently issued data sheet before initiating or completing a design. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
16. Definitions
Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
17. Disclaimers
Life support -- These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes -- Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
18. Contact information
For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
9397 750 12772
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 01 -- 19 July 2004
23 of 24
Philips Semiconductors
SA56202
One-chip motor driver
19. Contents
1 2 3 4 5 6 6.1 6.2 7 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 7.9 7.10 7.11 7.12 7.13 8 9 10 11 12 13 13.1 13.2 13.3 13.4 13.5 14 15 16 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 6 Spindle motor control . . . . . . . . . . . . . . . . . . . . 6 Internal regeneration of back-EMF spindle motor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Sine generation using 3-phase PWM signals . . 8 Programming RLIM . . . . . . . . . . . . . . . . . . . . . . 9 Programming REMF . . . . . . . . . . . . . . . . . . . . . 10 FG generator . . . . . . . . . . . . . . . . . . . . . . . . . 10 Sled motor driver . . . . . . . . . . . . . . . . . . . . . . 11 Loading motor driver. . . . . . . . . . . . . . . . . . . . 12 Actuator motor drivers . . . . . . . . . . . . . . . . . . 12 Charge pump . . . . . . . . . . . . . . . . . . . . . . . . . 12 Thermal protection . . . . . . . . . . . . . . . . . . . . . 12 Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Muting functions . . . . . . . . . . . . . . . . . . . . . . . 13 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 13 Thermal characteristics. . . . . . . . . . . . . . . . . . 14 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 15 Application information. . . . . . . . . . . . . . . . . . 17 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 19 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 19 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 20 Package related soldering information . . . . . . 20 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 22 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 23 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Contact information . . . . . . . . . . . . . . . . . . . . 23
(c) Koninklijke Philips Electronics N.V. 2004
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 19 July 2004 Document order number: 9397 750 12772
Published in The Netherlands

▲Up To Search▲

Price & Availability of SA56202

	To Download SA56202 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .