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| Final data SPW21N50C3 VDS @ Tjmax RDS(on) ID 560 0.19 21 P-TO247 Cool MOSTM Power Transistor Feature * New revolutionary high voltage technology * Ultra low gate charge * Periodic avalanche rated * Extreme dv/dt rated * Ultra low effective capacitances * Improved transconductance V A Type SPW21N50C3 Package P-TO247 Ordering Code Q67040-S4586 Marking 21N50C3 Maximum Ratings Parameter Symbol ID Value Unit Continuous drain current TC = 25 C TC = 100 C A 21 13.1 Pulsed drain current, tp limited by Tjmax Avalanche energy, single pulse I D = 10 A, VDD = 50 V I D puls EAS 63 690 1 21 6 20 30 mJ Avalanche energy, repetitive tAR limited by Tjmax1) EAR I D = 21 A, VDD = 50 V Avalanche current, repetitive tAR limited by Tjmax I AR Reverse diode dv/dt dv/dt IS=21A, VDS=480V, T j=125C A V/ns V W C 2003-06-30 Gate source voltage VGS VGS Ptot T j , T stg Page 1 Gate source voltage AC (f >1Hz) Power dissipation, TC = 25C Operating and storage temperature 208 -55... +150 Final data SPW21N50C3 Maximum Ratings Parameter Drain Source voltage slope V DS = 400 V, ID = 21 A, Tj = 125 C Symbol dv/dt Value 50 Unit V/ns Thermal Characteristics Parameter Thermal resistance, junction - case Thermal resistance, junction - ambient, leaded Soldering temperature, 1.6 mm (0.063 in.) from case for 10s Electrical Characteristics, at Tj=25C unless otherwise specified Parameter Symbol Conditions min. Drain-source breakdown voltage V(BR)DSS V GS=0V, ID=0.25mA Drain-Source avalanche V(BR)DS V GS=0V, ID=21A breakdown voltage Gate threshold voltage Zero gate voltage drain current 500 2.1 Values typ. 600 3 0.1 0.16 0.54 0.53 max. 3.9 A 1 100 100 0.19 nA Symbol min. RthJC RthJA - Values typ. max. 0.6 62 260 Unit K/W C Tsold Unit V VGS(th) I DSS ID=1000, VGS=V DS V DS=500V, VGS=0V, Tj=25C, Tj=150C Gate-source leakage current I GSS V GS=20V, VDS=0V V GS=10V, ID=13.1A, Tj=25C Tj=150C Drain-source on-state resistance RDS(on) Gate input resistance RG f=1MHz, open Drain Page 2 2003-06-30 Final data SPW21N50C3 Electrical Characteristics , at Tj = 25 C, unless otherwise specified Parameter Transconductance Input capacitance Output capacitance Reverse transfer capacitance Symbol g fs Ciss Coss Crss Conditions min. V DS2*I D*RDS(on)max, ID=13.1A V GS=0V, V DS=25V, f=1MHz Values typ. 18 2400 1200 30 87 tbd 10 5 67 4.5 max. - Unit S pF Effective output capacitance, 2) Co(er) energy related Effective output capacitance, 3) Co(tr) time related Turn-on delay time Rise time Turn-off delay time Fall time V GS=0V, V DS=0V to 400V pF td(on) tr td(off) tf V DD=380V, V GS=0/10V, ID=21A, RG =3.6 - ns Gate Charge Characteristics Gate to source charge Qgs Gate to drain charge Gate charge total Gate plateau voltage Qgd Qg VDD=380V, ID=21A - 10 50 95 5 - nC VDD=380V, ID=21A, VGS=0 to 10V V(plateau) VDD=380V, ID=21A V 1Repetitve avalanche causes additional power losses that can be calculated as P =EAR*f. AV 2C o(er) is a fixed capacitance that gives the same stored energy as Coss while VDS is rising from 0 to 80% V DSS. 3C o(tr) is a fixed capacitance that gives the same charging time as Coss while V DS is rising from 0 to 80% V DSS. Page 3 2003-06-30 Final data SPW21N50C3 Electrical Characteristics, at Tj = 25 C, unless otherwise specified Parameter Inverse diode continuous forward current Inverse diode direct current, pulsed Inverse diode forward voltage Reverse recovery time Reverse recovery charge Peak reverse recovery current Peak rate of fall of reverse recovery current VSD trr Qrr Irrm dirr /dt VGS=0V, IF=IS VR=380V, IF=IS , diF/dt=100A/s Symbol IS ISM Conditions min. TC=25C Values typ. 1 450 9 60 1200 max. 21 63 1.2 - Unit A V ns C A A/s Typical Transient Thermal Characteristics Symbol Thermal resistance R th1 R th2 R th3 R th4 R th5 R th6 0.00769 0.015 0.029 0.114 0.136 0.059 K/W Value typ. Unit Symbol Value typ. Unit Thermal capacitance Cth1 Cth2 Cth3 Cth4 Cth5 Cth6 0.0003763 0.001411 0.001931 0.005297 0.012 0.091 Ws/K Tj P tot (t) R th1 R th,n T case E xternal H eatsink C th1 C th2 C th,n T am b Page 4 2003-06-30 Final data SPW21N50C3 1 Power dissipation Ptot = f (TC) 240 SPW21N50C3 2 Safe operating area ID = f ( V DS ) parameter : D = 0 , T C=25C 10 2 W 200 180 A 10 1 Ptot 140 120 100 80 60 40 20 0 0 20 40 60 80 100 120 10 -1 10 0 ID 160 tp = 0.001 ms tp = 0.01 ms tp = 0.1 ms tp = 1 ms tp = 10 ms DC C 160 10 -2 0 10 10 1 10 2 TC 10 V VDS 3 3 Transient thermal impedance ZthJC = f (t p) parameter: D = tp/T 10 0 4 Typ. output characteristic ID = f (VDS); Tj=25C parameter: tp = 10 s, VGS 70 K/W A Vgs = 20V Vgs = 7V Vgs = 6.5V Vgs = 6V 10 -1 ZthJC 50 ID 40 10 -2 10 -3 D = 0.5 D = 0.2 D = 0.1 D = 0.05 D = 0.02 D = 0.01 single pulse Vgs = 5.5V 30 Vgs = 5V 20 Vgs = 4.5V 10 Vgs = 4V 10 -4 10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 s tp 10 0 0 0 5 10 15 V VDS 25 Page 5 2003-06-30 Final data SPW21N50C3 5 Typ. output characteristic ID = f (VDS); Tj=150C parameter: tp = 10 s, VGS 40 6 Typ. drain-source on resistance RDS(on)=f(ID) parameter: Tj=150C, V GS 1.5 A Vgs = 20V Vgs = 7V Vgs = 6V Vgs = 5.5V Vgs = 5V 25 RDS(on) 30 Vgs = 4V Vgs = 4.5V Vgs = 5V Vgs = 5.5V Vgs = 6V Vgs = 20V ID 20 0.9 15 Vgs = 4.5V 10 Vgs = 4V 0.6 5 0 0 5 10 15 V VDS 25 0.3 0 5 10 15 20 25 30 40 A ID 7 Drain-source on-state resistance RDS(on) = f (Tj) parameter : ID = 13.1 A, VGS = 10 V 1.1 SPW21N50C3 8 Typ. transfer characteristics ID= f ( VGS ); V DS 2 x ID x RDS(on)max parameter: tp = 10 s 70 0.9 A Tj = 25C RDS(on) 0.8 50 ID 0.7 0.6 0.5 0.4 0.3 98% 0.2 0.1 0 -60 -20 20 60 100 C Tj = 150C 40 30 20 typ 10 180 0 0 2 4 6 V 10 Tj Page 6 VGS 2003-06-30 Final data SPW21N50C3 9 Typ. gate charge VGS = f (QGate) 10 Forward characteristics of body diode IF = f (VSD) parameter: Tj , tp = 10 s 10 2 SPW21N50C3 parameter: ID = 21 A pulsed 16 V SPW21N50C3 A 12 VGS 0.8 VDS max 8 6 IF 10 0 Tj = 25 C typ Tj = 150 C typ Tj = 25 C (98%) Tj = 150 C (98%) nC 10 0.2 VDS max 10 1 4 2 10 -1 0 0 0 20 40 60 80 100 140 0.4 0.8 1.2 1.6 2 2.4 V 3 QGate VSD 11 Avalanche SOA IAR = f (tAR) par.: Tj 150 C 20 12 Avalanche energy EAS = f (Tj) par.: ID = 10 A, VDD = 50 V mJ 750 A 600 550 EAS Tj(Start)=25C IAR 500 450 400 350 300 250 10 5 Tj(Start)=125C 200 150 100 50 0 -3 10 10 -2 10 -1 10 0 10 1 10 2 s 10 tAR 4 0 20 40 60 80 100 120 C 160 Tj Page 7 2003-06-30 Final data SPW21N50C3 13 Drain-source breakdown voltage V(BR)DSS = f (Tj) 600 SPW21N50C3 14 Avalanche power losses PAR = f (f ) parameter: E AR=1mJ 500 V W V(BR)DSS 570 560 550 540 530 520 510 500 490 480 470 460 450 -60 -20 20 60 100 100 200 PAR 300 C 180 04 10 10 5 Hz f 10 6 Tj 15 Typ. capacitances C = f (VDS) parameter: V GS=0V, f=1 MHz 10 5 16 Typ. Coss stored energy Eoss=f(VDS) 10 pF 10 4 Ciss J 10 3 C Eoss Coss Crss 6 10 2 4 10 1 2 10 0 0 100 200 300 V 500 0 0 50 100 150 200 250 300 350 400 VDS V 500 VDS Page 8 2003-06-30 Final data SPW21N50C3 Definition of diodes switching characteristics Page 9 2003-06-30 Final data SPW21N50C3 P-TO-247-3-1 15.9 6.35 o3.61 5.03 2.03 4.37 20.9 9.91 6.17 D 7 D 1.75 1.14 0.243 1.2 2 2.92 5.46 16 0.762 MAX. 2.4 +0.05 General tolerance unless otherwise specified: Leadframe parts: 0.05 Package parts: 0.12 41.22 2.97 x 0.127 5 5.94 20 Page 10 2003-06-30 Final data Published by Infineon Technologies AG, Bereichs Kommunikation St.-Martin-Strasse 53, D-81541 Munchen (c) Infineon Technologies AG 1999 All Rights Reserved. SPW21N50C3 Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Page 11 2003-06-30 |
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